4 nti Silicon wafer FZ CZ N-Type DSP lossis SSP Qib Xeem

Kev Piav Qhia Luv:

Ib daim silicon wafer yog ib daim ntawv nyias txiav los ntawm ib daim silicon siv lead ua ke. Cov silicon wafers muaj nyob rau hauv 2-nti, 3-nti, 4-nti, 6-nti, thiab 8-nti txoj kab uas hla, thiab feem ntau yog siv los tsim cov integrated circuits. Silicon wafers tsuas yog cov khoom siv raw thiab cov chips yog cov khoom tiav. Silicon wafers yog cov ntaub ntawv tseem ceeb rau kev ua cov integrated circuits, thiab ntau yam khoom siv semiconductor tuaj yeem ua los ntawm kev siv photolithography thiab ion implantation rau ntawm silicon wafers.

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Cov yam ntxwv

Taw qhia ntawm lub thawv wafer

Cov silicon wafers yog ib feem tseem ceeb ntawm kev lag luam thev naus laus zis niaj hnub no uas tab tom loj hlob. Kev ua lag luam cov khoom siv semiconductor xav tau cov silicon wafers uas muaj cov lus qhia meej kom tsim tau ntau lub cuab yeej sib xyaw ua ke tshiab. Peb lees paub tias thaum tus nqi ntawm kev tsim khoom semiconductor nce ntxiv, tus nqi ntawm cov khoom siv tsim khoom, xws li silicon wafers kuj nce ntxiv. Peb nkag siab txog qhov tseem ceeb ntawm qhov zoo thiab kev siv nyiaj tsim nyog hauv cov khoom uas peb muab rau peb cov neeg siv khoom. Peb muab cov wafers uas tsim nyog tus nqi thiab zoo sib xws. Peb feem ntau tsim cov silicon wafers thiab ingots (CZ), epitaxial wafers, thiab SOI wafers.

Txoj kab uas hla	Txoj kab uas hla	Polished	Doped	Kev Taw Qhia	Kev tiv taus/Ω.cm	Thickness/um
2 nti	50.8 ± 0.5 hli	SSP DSP	Tus nqi/N	100	1-20	200-500
3 nti	76.2 ± 0.5 hli	SSP DSP	P/B	100	NA	525 ± 20
4 nti	101.6 ± 0.2 101.6 ± 0.3 101.6 ± 0.4	SSP DSP	Tus nqi/N	100	0.001-10	200-2000
6 nti	152.5 ± 0.3	SSPDSP	Tus nqi/N	100	1-10	500-650
8 nti	200 ± 0.3	DSPSSP	Tus nqi/N	100	0.1-20	625

Kev siv cov silicon wafers

Cov khoom siv: PECVD / LPCVD txheej, magnetron sputtering

Cov Khoom Siv: XRD, SEM, atomic force infrared spectroscopy, transmission electron microscopy, fluorescence spectroscopy thiab lwm yam kev ntsuam xyuas analytical, molecular beam epitaxial growth, X-ray analysis ntawm crystal microstructure processing: etching, bonding, MEMS devices, power devices, MOS devices thiab lwm yam kev ua.

Txij li xyoo 2010, Shanghai XKH Material Tech. Co., Ltd tau cog lus tias yuav muab cov kev daws teeb meem 4-nti wafer Silicon Wafer rau cov neeg siv khoom, los ntawm kev debugging level wafers Dummy Wafer, test level wafers Test Wafer, mus rau product level wafers Prime Wafer, nrog rau cov wafers tshwj xeeb, Oxide wafers Oxide, Nitride wafers Si3N4, Aluminium plated wafers, Copper plated silicon wafers, SOI Wafer, MEMS Glass, customized ultra-tuab thiab ultra-flat wafers, thiab lwm yam, nrog rau qhov ntau thiab tsawg ntawm 50mm-300mm, thiab peb tuaj yeem muab semiconductor wafers nrog ib-sab / ob-sab polishing, thinning, dicing, MEMS thiab lwm yam kev ua thiab kev hloov kho cov kev pabcuam.