Pob zeb diamond hlau Multi-Wire High-Speed ​​High-Precision downward viav vias txiav tshuab

Lus piav qhia luv luv:

Lub pob zeb diamond hlau multi-wire high-speed high-precision downward viav vias txiav tshuab yog cov cuab yeej CNC siab heev tsim los rau kev ua tiav ntawm cov ntaub ntawv nyuaj thiab nkig. Nws ua ke nrog ntau yam kev siv thev naus laus zis, suav nrog kev kub ceev xaim khiav, kev tswj hwm kev ua haujlwm siab, ntau cov xaim ib txhij txiav, thiab nqes viav vias txiav. Lub tshuab no ua tiav kev ua haujlwm loj loj nrog kev ua haujlwm tshwj xeeb thiab qhov zoo ntawm qhov chaw.

Los ntawm kev siv cov pob zeb diamond hlau ua qhov nruab nrab ntawm kev txiav, lub tshuab muab kev hnav zoo dua thiab txiav qhov tseeb piv nrog cov txheej txheem txiav. Nws txoj kev tsim ntau lub xov hlau ua rau batch txiav ntawm ntau lub workpieces ib txhij, txhim kho cov khoom tsim tau zoo thaum txo cov nqi tsim khoom. Lub viav vias nqes qis faib cov txiav quab yuam ntau sib npaug, txo qhov tsis xws luag thiab micro-cracks, uas ua rau smoother thiab huv si txiav.


Nta

Daim duab qhia ntxaws

pc207127262-diamond_wire_multi_wire_high_speed_high_precision_descending_oscillating_txiav_machine_副本2
pc207127263-diamond_wire_multi_wire_high_speed_high_precision_descending_oscillating_txiav_machine_副本2

Qhia

Lub pob zeb diamond hlau multi-wire high-speed high-precision downward viav vias txiav tshuab yog cov cuab yeej CNC siab heev tsim los rau kev ua tiav ntawm cov ntaub ntawv nyuaj thiab nkig. Nws ua ke nrog ntau yam kev siv thev naus laus zis, suav nrog kev kub ceev xaim khiav, kev tswj hwm kev ua haujlwm siab, ntau cov xaim ib txhij txiav, thiab nqes viav vias txiav. Lub tshuab no ua tiav kev ua haujlwm loj loj nrog kev ua haujlwm tshwj xeeb thiab qhov zoo ntawm qhov chaw.

Los ntawm kev siv cov pob zeb diamond hlau ua qhov nruab nrab ntawm kev txiav, lub tshuab muab kev hnav zoo dua thiab txiav qhov tseeb piv nrog cov txheej txheem txiav. Nws txoj kev tsim ntau lub xov hlau ua rau batch txiav ntawm ntau lub workpieces ib txhij, txhim kho cov khoom tsim tau zoo thaum txo cov nqi tsim khoom. Lub viav vias nqes qis faib cov txiav quab yuam ntau sib npaug, txo qhov tsis xws luag thiab micro-cracks, uas ua rau smoother thiab huv si txiav.

Technical Advantage

  • Kev kub ceev txiav: Hlau khiav ceev txog 2000 m / min, txo cov sijhawm ua haujlwm.

  • Siab Precision: Txiav qhov tseeb txog li 0.01 hli, kom ntseeg tau cov tuab tuab zoo sib xws thiab cov txiaj ntsig tawm los.

  • Multi-Wire Muaj peev xwm: Hlau cia muaj peev xwm ntawm 20 km, txhawb nqa loj-scale sib npaug txiav.

  • Vijtsam Txiav: ± 8 ° viav vias ntau ntawm 0.83 ° / s tusyees faib cov kev ntxhov siab, txuas cov hlau lifespan thiab txhim kho qhov zoo.

  • Saj zawg zog tswj: Txiav nro adjustable los ntawm 10N txog 60N (0.1N increments), yoog mus rau ntau yam ntaub ntawv.

  • Lub cev muaj zog: Lub tshuab hnyav ntawm 8000 kg ua kom muaj kev ruaj khov thiab ruaj khov thaum lub sijhawm ua haujlwm ntev.

  • Ntse Tswj System: Tus neeg siv-phooj ywg interface nrog kev teeb tsa, kev saib xyuas lub sijhawm tiag tiag, thiab lub tswb ua haujlwm tsis raug.

Tej kev siv

  • Kev lag luam photovoltaic

    • Txiav ntawm monocrystalline thiab polycrystalline silicon ingots

    • Kev tsim khoom ntawm high-efficiency solar wafers

    • Txhim kho kev siv cov khoom siv thiab txo cov nqi ua haujlwm

  • Kev lag luam semiconductor

    • Precision slicing ntawm SiC, GaAs, Ge, thiab lwm yam semiconductor wafers

    • Loj-inch wafer txiav rau chip fabrication

    • Guarantees superior nto zoo rau xav tau cov txheej txheem semiconductor

  • Cov khoom siv tshiab

    • Sapphire substrate txiav rau LED thiab optical Cheebtsam

    • Precision txiav ntawm cov khoom siv hluavtaws thiab cov khoom sib nqus

    • Kev ua haujlwm ntawm quartz, iav ceramics, thiab lwm yam ntaub ntawv nyuaj

  • Kev Tshawb Fawb & Kev Siv Tshuaj

    • Kev npaj ua qauv rau kev tshawb fawb cov ntaub ntawv tshiab

    • Me-batch high-precision txiav thwmsim

    • Txhim khu kev qha txheej txheem validation rau R&D daim ntawv thov

Technical Specifications

Parameter Specification
Qhov project Multi-kab hlau saw nrog workbench rau saum
Qhov siab tshaj plaws workpiece loj 204 * 500mm
Lub ntsiab cov menyuam txheej txoj kab uas hla (Tswj ntawm ob qho kawg) Ø 240 * 510mm (ob lub ntsiab rollers)
Hlau khiav ceev 2000 (MIX) m/min
Pob zeb diamond hlau diam 0.1-0.5 hli
Kab cia muaj peev xwm ntawm cov khoom siv log 20 (0.25 Pob zeb diamond hlau txoj kab uas hla) km
Txiav thickness ntau 0.1-1.0 hli
Txiav raug 0.01mm ib
Vertical lifting stroke ntawm workstation 250 hli
Txiav txoj kev Cov khoom sways thiab nqis los ntawm sab saum toj mus rau hauv qab, thaum txoj hauj lwm ntawm pob zeb diamond kab tseem tsis hloov
Txiav pub ceev 0.01-10mm / min
Lub tank dej 300 L
Txiav kua Anti-xeb high-efficiency txiav kua
Swing ceev 0.83 ° / s
Cua twj tso kua mis siab 0.3-3MPa
Lub kaum sab xis ± 8°
Qhov siab tshaj plaws txiav nro 10N-60N (Teeb yam tsawg kawg nkaus 0.1N)
Txiav qhov tob 500 hli
Chaw ua haujlwm 1
Fais fab mov Peb-theem tsib-xaim AC380V / 50Hz
Tag nrho lub zog ntawm lub tshuab cuab yeej ≤ 92 kW
Main motor (Dej circulation txias) 22 * 2 kWm
Lub cev muaj zog 1 * 2 kWm
Workbench viav vias motor 1.3 * 1 kWm
Tension tswj lub cev muaj zog (Dej circulation txias) 5.5 * 2 kWm
Hlau tso tawm thiab sau lub cev muaj zog 15 * 2 kWm
Sab nraud qhov ntev (tsis suav nrog rocker arm box) 1320 * 2644 * 2840 hli
Sab nraud qhov ntev (nrog rau lub thawv rocker caj npab) 1780 * 2879 * 2840mm
Tshuab hnyav 8 000kg

FAQ

1. Q: Dab tsi yog qhov zoo ntawm oscillating txiav hauv pob zeb diamond hlau saws?

A: Oscillating txiav (± 8 °) txo qhov chipping rau <15μm thiab txhim kho nto tiav (Ra <0.5μm) rau cov khoom siv tawv tawv xws li SiC thiab sapphire.

 

 

2. Q: Ntev npaum li cas tuaj yeem ua ntau cov hlau pob zeb diamond txiav silicon wafers?

A: Nrog 200+ xov hlau ntawm 1-3m / s, nws txiav 300mm silicon wafers nyob rau hauv <2 feeb, boosting productivity 5x vs single-wire saws.

 


  • Yav dhau los:
  • Tom ntej:

  • Sau koj cov lus ntawm no thiab xa tuaj rau peb