Cov khoom siv Infrared Nanosecond Laser Drilling rau Iav Drilling thickness≤20mm

Infrared Nanosecond Laser Drilling khoom siv rau Iav Drilling thickness≤20mm Featured Duab

Kev Piav Qhia Luv:

Kev Txheeb Xyuas Txog Kev Siv Tshuab:
Lub Infrared Nanosecond Laser Glass Drilling System yog ib qho kev daws teeb meem ua haujlwm hauv kev lag luam uas tsim tshwj xeeb rau kev khawb cov khoom siv iav. Siv lub tshuab laser infrared nanosecond 1064nm (pulse width: 10-300ns), lub kaw lus no ua tiav kev khawb qhov tseeb hauv ntau yam iav substrates nrog thicknesses ≤20mm los ntawm kev tswj lub zog thiab cov thev naus laus zis beam shaping.
Hauv cov kab ntau lawm, Infrared Nanosecond Laser Glass Drilling System qhia txog cov txiaj ntsig tshwj xeeb ntawm cov txheej txheem. Piv rau kev siv tshuab drilling lossis CO₂ laser processing, lub kaw lus tswj hwm thermal effect zoo tshaj plaws ua rau kev drilling precision nrog cov qhov diameters xws li Φ0.1-5mm hauv cov iav soda-lime txheem, thaum tswj cov phab ntsa taper hauv ± 0.5 °. Tshwj xeeb tshaj yog hauv kev ua cov lens sapphire npog lub koob yees duab smartphone, lub kaw lus tuaj yeem tsim cov Φ0.3mm micro-hole arrays nrog qhov tseeb ntawm ± 10μm, ua tau raws li cov kev cai miniaturization nruj hauv cov khoom siv hluav taws xob. Lub kaw lus los nrog cov interfaces loading / unloading tsis siv neeg rau kev sib koom ua ke nrog cov kab ntau lawm uas twb muaj lawm.

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Cov yam ntxwv

Cov yam ntxwv tseem ceeb

Hom laser	Infrared nanosecond
Qhov loj ntawm lub platform	*800 600 (hli)**
	*2000 1200 (hli)**
Qhov tuab ntawm qhov tho qhov	≤20 (hli)
Kev ceev ntawm kev khawb av	0-5000 (hli/s)
Kev tawg ntawm ntug drilling	<0.5 (hli)
Lus Cim: Qhov loj ntawm lub platform tuaj yeem hloov kho.

Txoj Cai Drilling Laser

Lub teeb laser raug tsom mus rau qhov chaw zoo tshaj plaws piv rau qhov tuab ntawm cov khoom ua haujlwm, tom qab ntawd luam theej duab raws txoj kev uas tau teev tseg ua ntej nrog kev kub ceev. Los ntawm kev sib cuam tshuam nrog lub teeb laser muaj zog siab, cov khoom siv raug tshem tawm ib txheej dhau ib txheej los tsim cov kav txiav, ua tiav qhov perforation meej (lub voj voog, plaub fab, lossis cov qauv geometries) nrog kev sib cais cov khoom siv tswj tau.

Cov txiaj ntsig ntawm Laser Drilling

· Kev sib koom ua ke ntawm automation nrog kev siv hluav taws xob tsawg thiab kev ua haujlwm yooj yim;

· Kev ua tsis sib cuag ua rau cov qauv geometries tsis muaj kev txwv dhau ntawm cov txheej txheem ib txwm muaj;

· Kev ua haujlwm tsis siv khoom txo cov nqi ua haujlwm thiab txhim kho kev ruaj khov ntawm ib puag ncig;

· Kev ua haujlwm zoo tshaj plaws nrog kev tawg ntawm ntug tsawg kawg nkaus thiab tshem tawm qhov kev puas tsuaj ntawm cov khoom ua haujlwm thib ob;

Cov khoom siv laser drilling iav infrared nanosecond 2

Qauv zaub

Cov Ntawv Thov Txheej Txheem

Lub tshuab no yog tsim los rau kev ua cov khoom siv uas tawg yooj yim/tawv xws li kev khawb, kev sib tsoo, kev tshem tawm zaj duab xis, thiab kev kho kom zoo nkauj ntawm qhov chaw. Cov kev siv feem ntau suav nrog:

1. Kev khawb thiab khawb rau cov khoom siv ntawm qhov rooj da dej

2. Kev tho qhov tseeb ntawm cov iav vaj huam sib luag

3. Vaj huam sib luag hnub ci los ntawm kev khawb av

4. Lub hau npog qhov hloov pauv / lub qhov (socket) tho qhov

5. Tshem tawm cov txheej iav nrog kev khawb

6. Kev tsim cov qauv nto thiab cov grooving rau cov khoom tshwj xeeb

Cov txiaj ntsig ntawm kev ua haujlwm

1. Lub platform loj loj ua rau muaj ntau yam khoom sib txawv thoob plaws kev lag luam

2. Kev khawb cov duab sib txawv ua tiav hauv kev ua haujlwm ib zaug xwb

3. Tsawg kawg nkaus ntug chipping nrog qhov chaw tiav zoo dua (Ra <0.8μm)

4. Kev hloov pauv yooj yim ntawm cov khoom siv nrog kev ua haujlwm yooj yim

5. Kev ua haujlwm pheej yig uas muaj:

· Cov nqi qoob loo siab (>99.2%)

· Kev ua khoom siv tsis tas siv

· Tsis muaj pa phem

6. Kev ua haujlwm tsis sib cuag ua kom muaj kev tiv thaiv kev ncaj ncees ntawm qhov chaw

Cov Nta Tseem Ceeb

1. Kev Siv Tshuab Tswj Xyuas Kub Kom Tseeb:

· Siv cov txheej txheem drilling ntau lub zog nrog lub zog ib lub zog hloov kho tau (0.1–50 mJ)

· Lub kaw lus tiv thaiv cua ntsawj sab tshiab txwv thaj chaw uas raug cua sov kom tsis pub dhau 10% ntawm txoj kab uas hla lub qhov

· Lub sijhawm tiag tiag infrared kub saib xyuas module tau them rov qab cov zog tsis (± 2% kev ruaj khov)

2. Lub Platform Ua Haujlwm Txawj Ntse:

· Nruab nrog lub tshuab ua haujlwm siab-precision linear motor stage (rov ua qhov tseeb: ± 2 μm)

· Kev sib txuas ua ke ntawm lub zeem muag sib dhos (5-megapixel CCD, kev lees paub qhov tseeb: ± 5 μm)

· Cov ntaub ntawv txheej txheem ua ntej nrog cov kev teeb tsa zoo tshaj plaws rau 50+ hom khoom siv iav

3. Kev Tsim Khoom Siv Tau Zoo:

· Hom kev ua haujlwm hloov pauv ob chav nrog lub sijhawm hloov pauv khoom ≤3 vib nas this

· Lub voj voog ua tiav ntawm 1 qhov / 0.5 vib nas this (Φ0.5 hli los ntawm qhov)

· Kev tsim qauv modular ua rau muaj kev sib pauv sai ntawm cov khoom sib dhos lens tsom (ntau yam ua tiav: Φ0.1–10 hli)

Cov Ntawv Thov Ua Khoom Siv Nyuaj

Hom Khoom Siv	Daim Ntawv Thov Xwm Txheej	Ua Cov Ntsiab Lus
Iav dej qab zib-txiv qaub ntsuab	Cov qhov rooj da dej	Cov qhov mounting thiab cov kav dej ntws
Iav dej qab zib-txiv qaub ntsuab	Cov vaj huam sib luag tswj cov khoom siv	Cov qhov dej ntws tawm
Iav Tempered	Cov qhov rais saib qhov cub	Cov qhov cua nkag
Iav Tempered	Cov qhov cub hluav taws xob	Cov kav dej txias uas muaj kaum sab xis
Borosilicate Iav	Cov vaj huam sib luag hnub ci	Cov qhov mounting
Borosilicate Iav	Cov khob iav hauv chav kuaj	Cov kav dej ntws raws li tus kheej
Iav-ceramic	Cov nto ntawm lub qhov cub	Cov qhov chaw tso rau ntawm lub qhov cub
Iav-ceramic	Cov lauj kaub hluav taws xob	Cov qhov mounting ntawm sensor
Sapphire	Cov npog ntawm cov khoom siv ntse	Cov qhov cua nkag
Sapphire	Cov chaw saib kev lag luam	Cov qhov muaj zog
Cov Iav Txheej	Cov iav hauv chav dej	Cov qhov rau kev teeb tsa (kev tshem tawm cov txheej txheem + kev khawb)
Cov Iav Txheej	Cov phab ntsa ntaub thaiv	Cov iav Low-E zais cov qhov dej ntws
Iav Ua Los Ntawm Av nplaum	Cov npog qhov (socket)/qhov (switch)	Cov qhov rau kev nyab xeeb + cov qhov hlau
Iav Ua Los Ntawm Av nplaum	Cov teeb meem hluav taws	Cov qhov txo qhov siab thaum muaj xwm txheej ceev

XKH muab kev txhawb nqa kev txawj ntse thiab cov kev pabcuam ntxiv rau cov khoom siv infrared nanosecond laser iav drilling kom ntseeg tau tias muaj kev ua haujlwm zoo tshaj plaws thoob plaws lub neej ntawm cov khoom siv. Peb muab cov kev pabcuam tsim kho cov txheej txheem uas peb pab neeg engineering koom tes nrog cov neeg siv khoom los tsim cov ntaub ntawv parameter tshwj xeeb rau cov khoom siv, suav nrog cov kev pab cuam drilling tshwj xeeb rau cov khoom siv nyuaj xws li sapphire thiab tempered iav nrog qhov sib txawv ntawm 0.1mm txog 20mm. Rau kev ua kom zoo dua qub, peb ua cov kev ntsuas khoom siv hauv tsev thiab kev ua haujlwm, kom ntseeg tau tias cov ntsuas tseem ceeb xws li qhov ntev ntawm qhov (± 5μm) thiab qhov zoo ntawm ntug (Ra < 0.5μm) ua tau raws li cov qauv kev lag luam.

Yav dhau los: Cov khoom siv thev naus laus zis Microjet laser wafer txiav SiC cov khoom ua tiav

Tom ntej no: 6 Nti Conductive SiC Composite Substrate 4H Txoj Kab uas hla 150 hli Ra≤0.2nm Warp≤35μm