Infrared Picosecond Dual-Platform Laser Cutting khoom siv rau Optical Glass/Quartz/Sapphire Processing
Cov yam ntxwv tseem ceeb
| Hom Laser | Infrared Picosecond |
| Qhov Loj ntawm Lub Platform | 700 × 1200 (hli) |
| 900 × 1400 (hli) | |
| Txiav Qhov Ntev | 0.03-80 (hli) |
| Kev Ceev Txiav | 0-1000 (hli/s) |
| Kev Txiav Txim Siab | <0.01 (hli) |
| Lus Cim: Qhov loj ntawm lub platform tuaj yeem hloov kho. | |
Cov Nta Tseem Ceeb
1. Kev Siv Tshuab Laser Ceev Tshaj Plaws:
· Cov pulses luv luv theem Picosecond (10⁻¹²s) ua ke nrog MOPA tuning technology ua tiav qhov siab tshaj plaws ntawm lub zog ceev >10¹² W/cm².
· Qhov ntev ntawm lub teeb infrared (1064nm) nkag mus rau hauv cov ntaub ntawv pob tshab los ntawm kev nqus tsis ncaj, tiv thaiv kev rhuav tshem ntawm qhov chaw.
· Lub tshuab kho qhov muag uas muaj ntau lub hom phiaj tshwj xeeb tsim plaub qhov chaw ua haujlwm ywj pheej tib lub sijhawm.
2. Dual-Chaw Nres Tsheb Synchronization System:
· Cov theem tsav tsheb ob chav linear uas siv cov granite-base (qhov chaw raug: ±1μm).
· Lub sijhawm hloov chaw nres tsheb <0.8s, ua kom muaj kev ua haujlwm "ua tiav-thauj khoom/tso tawm" sib luag.
· Kev tswj qhov kub thiab txias ywj pheej (23±0.5°C) rau txhua qhov chaw ua kom muaj kev ruaj khov ntawm kev siv tshuab mus sij hawm ntev.
3. Kev Tswj Xyuas Txheej Txheem Ntse:
· Cov ntaub ntawv khoom siv sib xyaw ua ke (200+ cov iav tsis sib xws) rau kev sib phim tsis siv neeg.
· Kev saib xyuas plasma tiag tiag hloov kho lub zog laser (kev daws teeb meem kev hloov kho: 0.1mJ).
· Kev tiv thaiv cua ntsawj txo qhov me me ntawm ntug (<3μm).
Hauv ib qho kev siv uas muaj 0.5 hli tuab sapphire wafer dicing, lub kaw lus ua tiav qhov kev txiav ceev ntawm 300mm/s nrog rau qhov ntev chipping <10μm, uas sawv cev rau kev txhim kho kev ua haujlwm 5 zaug dua li cov txheej txheem ib txwm muaj.
Cov txiaj ntsig ntawm kev ua haujlwm
1. Kev sib txuas ua ke ntawm ob lub chaw nres tsheb txiav thiab faib ua ke rau kev ua haujlwm yooj ywm;
2. Kev ua haujlwm ceev ceev ntawm cov qauv geometries ua rau kev hloov pauv txheej txheem ua haujlwm zoo dua;
3. Cov npoo txiav uas tsis muaj taper nrog tsawg kawg chipping (<50μm) thiab kev tswj hwm kev nyab xeeb ntawm tus neeg teb xov tooj;
4. Kev hloov pauv yooj yim ntawm cov khoom siv nrog kev ua haujlwm intuitive;
5. Cov nqi khiav lag luam tsawg, cov nqi qoob loo siab, cov txheej txheem tsis muaj kuab paug thiab tsis muaj kuab paug;
6. Tsis muaj cov slag, cov kua dej khib nyiab lossis cov dej khib nyiab uas lav qhov chaw zoo;
Qauv zaub
Cov Ntawv Thov Ib Txwm Muaj
1. Kev Tsim Khoom Siv Hluav Taws Xob Rau Cov Neeg Siv Khoom:
Kev txiav cov duab ntawm lub iav npog 3D ntawm lub xov tooj ntse (Qhov tseeb ntawm lub kaum sab xis R: ±0.01 hli).
· Kev tho qhov me me hauv cov iav sapphire saib (qhov qhib tsawg kawg nkaus: Ø0.3mm).
· Kev ua tiav ntawm cov iav kho qhov muag rau cov koob yees duab hauv qab qhov screen.
2. Kev Tsim Khoom Siv Optical:
Kev siv tshuab microstructure rau AR/VR lens arrays (qhov loj me ≥20μm).
· Kev txiav cov prism quartz rau cov laser collimators uas muaj kaum sab xis (kev kam rau siab ntawm kaum sab xis: ± 15").
· Kev tsim cov duab ntawm cov lim infrared (txiav taper <0.5°).
3. Kev Ntim Khoom Siv Semiconductor:
· Kev ua cov iav los ntawm kev siv lub tshuab (TGV) ntawm theem wafer (qhov sib piv ntawm 1:10).
· Microchannel etching ntawm cov iav substrates rau microfluidic chips (Ra <0.1μm).
· Kev txiav cov zaus rau MEMS quartz resonators.
Rau kev tsim lub qhov rais kho qhov muag LiDAR hauv tsheb, lub kaw lus ua rau muaj peev xwm txiav cov iav quartz tuab 2 hli nrog kev txiav perpendicularity ntawm 89.5 ± 0.3 °, ua tau raws li qhov yuav tsum tau ua ntawm kev sim kev co hauv tsheb.
Cov Ntawv Thov Txheej Txheem
Tsim tshwj xeeb rau kev txiav cov khoom tawg/tawv xws li:
1. Cov iav txheem & cov tsom iav kho qhov muag (BK7, fused silica);
2. Cov pob zeb siv lead ua los ntawm quartz thiab sapphire;
3. Cov iav kub thiab cov lim dej kho qhov muag
4. Cov khoom siv iav
Muaj peev xwm txiav cov duab thiab ua kom raug qhov drilling sab hauv (yam tsawg kawg nkaus Ø0.3mm)
Txoj Cai Txiav Laser
Lub laser tsim cov pulses luv luv nrog lub zog siab heev uas cuam tshuam nrog cov khoom ua haujlwm hauv lub sijhawm femtosecond-rau-picosecond. Thaum lub sijhawm kis mus los ntawm cov khoom siv, lub teeb cuam tshuam nws cov qauv kev ntxhov siab los tsim cov qhov micron-scale filamentation. Qhov chaw zoo tshaj plaws tsim cov kab nrib pleb me me, uas ua ke nrog cov thev naus laus zis cleaving kom ua tiav kev sib cais meej.
Cov txiaj ntsig ntawm kev txiav laser
1. Kev sib koom ua ke ntawm automation (kev txiav ua ke / kev txiav ua haujlwm) nrog kev siv hluav taws xob tsawg thiab kev ua haujlwm yooj yim;
2. Kev ua tsis sib cuag ua rau muaj peev xwm tshwj xeeb uas tsis tau los ntawm cov txheej txheem ib txwm muaj;
3. Kev ua haujlwm tsis siv khoom siv txo cov nqi khiav lag luam thiab txhim kho kev ruaj khov ntawm ib puag ncig;
4. Kev ua kom raug zoo tshaj plaws nrog lub kaum sab xis xoom thiab tshem tawm qhov kev puas tsuaj ntawm cov khoom ua haujlwm thib ob;
XKH muab cov kev pabcuam kho kom haum rau peb cov tshuab txiav laser, suav nrog kev teeb tsa platform tshwj xeeb, kev tsim cov txheej txheem tshwj xeeb, thiab cov kev daws teeb meem tshwj xeeb rau daim ntawv thov kom ua tau raws li cov kev xav tau tshwj xeeb ntawm ntau yam lag luam.