Cov khoom siv thev naus laus zis Microjet laser wafer txiav SiC cov khoom ua tiav

Microjet laser thev naus laus zis khoom siv wafer txiav SiC cov khoom ua tiav Featured Duab

Kev Piav Qhia Luv:

Cov khoom siv thev naus laus zis Microjet laser yog ib hom kev ua haujlwm precision uas sib xyaw ua ke laser zog siab thiab micron-level kua jet. Los ntawm kev sib txuas lub teeb laser rau lub tshuab ua kua ceev ceev (dej deionized lossis kua tshwj xeeb), cov khoom siv ua tiav nrog qhov tseeb siab thiab kev puas tsuaj thermal tsawg tuaj yeem ua tiav. Cov thev naus laus zis no tshwj xeeb tshaj yog rau kev txiav, drilling thiab microstructure ua cov khoom tawv thiab brittle (xws li SiC, sapphire, iav), thiab siv dav hauv semiconductor, photoelectric zaub, cov khoom siv kho mob thiab lwm yam teb.

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Cov yam ntxwv

Txoj cai ua haujlwm:

1. Kev sib txuas laser: pulsed laser (UV/ntsuab/infrared) yog tsom mus rau hauv lub dav hlau kua los tsim kom muaj kev sib kis hluav taws xob ruaj khov.

2. Kev taw qhia kua: lub dav hlau ceev ceev (qhov ntws ntawm 50-200m / s) ua kom txias thaj chaw ua haujlwm thiab tshem tawm cov khib nyiab kom tsis txhob muaj cua sov thiab ua qias tuaj.

3. Kev tshem tawm cov khoom siv: Lub zog laser ua rau muaj cavitation hauv cov kua kom ua tiav cov txheej txheem txias ntawm cov khoom siv (cheeb tsam cuam tshuam los ntawm cua sov <1μm).

4. Kev tswj hwm dynamic: kev hloov kho lub sijhawm tiag tiag ntawm cov laser parameters (lub zog, zaus) thiab lub zog dav hlau kom tau raws li qhov xav tau ntawm cov ntaub ntawv sib txawv thiab cov qauv.

Cov Ntsiab Lus Tseem Ceeb:

1. Lub zog laser: 10-500W (kho tau)

2. Lub dav hlau txoj kab uas hla: 50-300μm

3. Kev ua haujlwm raug: ±0.5μm (txiav), qhov tob rau qhov dav piv 10:1 (drilling)

Cov txiaj ntsig zoo ntawm kev siv tshuab:

(1) Yuav luag tsis muaj kev puas tsuaj los ntawm cua sov
- Kev siv dej txias tswj thaj chaw uas raug cua sov (HAZ) mus rau **<1μm**, zam kev tawg me me uas tshwm sim los ntawm kev siv laser ib txwm muaj (HAZ feem ntau yog >10μm).

(2) Kev ua haujlwm siab heev
- Kev txiav / tho qhov tseeb txog li ** ± 0.5μm **, ntug roughness Ra <0.2μm, txo qhov xav tau kev polishing tom qab.

- Txhawb kev ua cov qauv 3D nyuaj (xws li cov qhov conical, cov qhov zoo li).

(3) Kev sib raug zoo ntawm cov khoom siv dav dav
- Cov ntaub ntawv tawv thiab tawg yooj yim: SiC, sapphire, iav, ceramics (cov txheej txheem ib txwm yooj yim tawg).

- Cov ntaub ntawv rhiab heev rau cua sov: polymers, cov ntaub so ntswg biological (tsis muaj kev pheej hmoo ntawm thermal denaturation).

(4) Kev tiv thaiv ib puag ncig thiab kev ua haujlwm zoo
- Tsis muaj plua plav paug, kua dej tuaj yeem rov ua dua tshiab thiab lim dej.

- Kev ua haujlwm ceev dua 30%-50% (piv rau kev siv tshuab).

(5) Kev tswj hwm ntse
- Kev sib xyaw ua ke ntawm kev pom thiab kev ua kom zoo dua ntawm AI parameter, kev hloov kho cov khoom siv tuab thiab qhov tsis zoo.

Cov lus qhia txog kev siv:

Qhov ntim ntawm lub txee	300 * 300 * 150	400 * 400 * 200
Txoj kab ncaj XY	Lub cev muaj zog linear. Lub cev muaj zog linear	Lub cev muaj zog linear. Lub cev muaj zog linear
Txoj kab ncaj Z	150	200
Qhov tseeb ntawm qhov chaw μm	+/-5	+/-5
Qhov tseeb ntawm qhov chaw rov ua dua μm	+/-2	+/-2
Kev nrawm G	1	0.29
Kev tswj hwm tus lej	3 txoj kab / 3 + 1 txoj kab / 3 + 2 txoj kab	3 txoj kab / 3 + 1 txoj kab / 3 + 2 txoj kab
Hom kev tswj lej	DPSS Nd:YAG	DPSS Nd:YAG
Qhov ntev ntawm nthwv dej nm	532/1064	532/1064
Lub zog ntsuas W	50/100/200	50/100/200
Dej dav hlau	40-100	40-100
Lub nozzle siab bar	50-100	50-600
Qhov Loj (Tes Tshuab) (Dav * Ntev * Siab) mm	1445 * 1944 * 2260	1700 * 1500 * 2120
Loj (txee tswj) (W * L * H)	700 * 2500 * 1600	700 * 2500 * 1600
Qhov hnyav (khoom siv) T	2.5	3
Qhov hnyav (txee tswj) KG	800	800
Kev ua haujlwm muaj peev xwm	Qhov roughness ntawm qhov chaw Ra≤1.6um Qhib ceev ≥1.25mm/s Kev txiav ncig ≥6mm / s Kev txiav ceev ≥50mm / s	Qhov roughness ntawm qhov chaw Ra≤1.2um Qhib ceev ≥1.25mm/s Kev txiav ncig ≥6mm / s Kev txiav ceev ≥50mm / s
	Rau gallium nitride siv lead ua, ultra-wide band gap semiconductor cov ntaub ntawv (pob zeb diamond / Gallium oxide), aerospace tshwj xeeb cov ntaub ntawv, LTCC carbon ceramic substrate, photovoltaic, scintillator siv lead ua thiab lwm yam ntaub ntawv ua tiav. Lus Cim: Lub peev xwm ua tiav txawv nyob ntawm cov yam ntxwv ntawm cov khoom siv

Cov ntaub ntawv ua tiav:

Cov kev pabcuam ntawm XKH:

XKH muab kev pabcuam puv ntoob rau cov khoom siv microjet laser, txij li thaum pib tsim cov txheej txheem thiab kev sib tham xaiv cov khoom siv, mus rau qhov nruab nrab ntawm kev sib koom ua ke (suav nrog kev sib phim tshwj xeeb ntawm laser qhov chaw, jet system thiab automation module), mus rau kev cob qhia ua haujlwm thiab kev saib xyuas tom qab thiab kev txhim kho cov txheej txheem tas mus li, tag nrho cov txheej txheem muaj kev txhawb nqa los ntawm pab pawg kws tshaj lij; Raws li 20 xyoo ntawm kev paub txog kev ua haujlwm precision machining, peb tuaj yeem muab cov kev daws teeb meem ib zaug xwb suav nrog kev txheeb xyuas cov khoom siv, kev qhia txog kev tsim khoom ntau thiab kev teb sai tom qab muag (24 teev ntawm kev txhawb nqa kev txawj ntse + cov khoom seem tseem ceeb) rau ntau yam lag luam xws li semiconductor thiab kev kho mob, thiab cog lus tias yuav lav 12 lub hlis ntev thiab kev saib xyuas thiab kev hloov kho tas mus li. Xyuas kom meej tias cov khoom siv rau cov neeg siv khoom ib txwm tswj tau kev ua haujlwm zoo tshaj plaws hauv kev lag luam thiab kev ruaj khov.