TGV yog dab tsi?
TGV, (Through-Iav via), ib txoj kev siv tshuab los tsim cov qhov hla ntawm cov iav substrate, Hauv cov lus yooj yim, TGV yog lub tsev siab uas xuas, sau thiab txuas rau saum thiab hauv qab iav los tsim cov integrated circuits rau ntawm pem teb iav. Cov thev naus laus zis no suav hais tias yog ib qho thev naus laus zis tseem ceeb rau tiam tom ntej ntawm 3D ntim khoom.
Cov yam ntxwv ntawm TGV yog dab tsi?
1. Qauv: TGV yog ib lub qhov uas nkag mus rau hauv cov hluav taws xob uas ua rau ntawm lub iav substrate. Los ntawm kev tso ib txheej hlau conductive rau ntawm phab ntsa pore, cov txheej sab saud thiab sab qis ntawm cov teeb liab hluav taws xob tau sib txuas.
2. Cov txheej txheem tsim khoom: Kev tsim khoom TGV suav nrog kev kho cov khoom siv ua ntej, ua qhov, tso cov hlau txheej, txhaws qhov thiab ua kom tiaj tus. Cov txheej txheem tsim khoom feem ntau yog tshuaj etching, laser drilling, electroplating thiab lwm yam.
3. Cov txiaj ntsig ntawm kev siv: Piv nrog rau cov hlau ib txwm muaj los ntawm qhov, TGV muaj cov txiaj ntsig ntawm qhov me dua, qhov ceev ntawm cov xov hlau siab dua, kev ua haujlwm zoo dua ntawm kev tso cua sov thiab lwm yam. Siv dav hauv microelectronics, optoelectronics, MEMS thiab lwm yam kev sib txuas lus siab.
4. Kev loj hlob ntawm txoj kev loj hlob: Nrog rau kev tsim cov khoom siv hluav taws xob mus rau qhov me me thiab kev sib koom ua ke siab, TGV thev naus laus zis tau txais kev saib xyuas thiab kev siv ntau dua. Yav tom ntej, nws cov txheej txheem tsim khoom yuav txuas ntxiv mus rau qhov zoo tshaj plaws, thiab nws qhov loj me thiab kev ua tau zoo yuav txuas ntxiv mus zoo dua.
Cov txheej txheem TGV yog dab tsi:
1. Kev npaj cov iav substrate (a): Npaj ib lub iav substrate thaum pib kom paub tseeb tias nws qhov chaw du thiab huv si.
2. Kev tho iav (b): Siv lub laser los ua ib lub qhov nkag mus rau hauv lub khob iav. Lub duab ntawm lub qhov feem ntau yog conical, thiab tom qab kev kho laser ntawm ib sab, nws raug tig thiab ua tiav rau sab tod.
3. Kev kho kom zoo nkauj ntawm phab ntsa qhov (c): Kev kho kom zoo nkauj yog ua tiav rau ntawm phab ntsa qhov, feem ntau yog los ntawm PVD, CVD thiab lwm yam txheej txheem los tsim cov txheej txheem hlau conductive rau ntawm phab ntsa qhov, xws li Ti / Cu, Cr / Cu, thiab lwm yam.
4. Lithography (d): Qhov saum npoo ntawm lub iav substrate yog coated nrog photoresist thiab photopatterned. Qhia cov khoom uas tsis xav tau plating, yog li tsuas yog cov khoom uas xav tau plating thiaj li raug nthuav tawm.
5. Kev txhaws qhov (e): Siv tooj liab electroplating los txhaws lub iav los ntawm qhov kom ua tau ib txoj kev conductive tiav. Feem ntau yuav tsum tau txhaws qhov kom tag nrho tsis muaj qhov. Nco ntsoov tias Cu hauv daim duab tsis tau puv tag nrho.
6. Qhov chaw tiaj tiaj ntawm lub substrate (f): Qee cov txheej txheem TGV yuav ua rau qhov chaw ntawm lub iav substrate tiaj tiaj kom ntseeg tau tias qhov chaw ntawm lub substrate du, uas yog qhov zoo rau cov kauj ruam tom ntej.
7. Txheej tiv thaiv thiab qhov txuas ntawm qhov kawg (g): Ib txheej tiv thaiv (xws li polyimide) yog tsim rau ntawm qhov chaw ntawm lub iav substrate.
Hauv ntej, txhua kauj ruam ntawm TGV cov txheej txheem yog qhov tseem ceeb thiab xav tau kev tswj hwm thiab kev ua kom zoo. Tam sim no peb muab TGV iav los ntawm qhov thev naus laus zis yog tias xav tau. Thov koj xav tiv tauj peb!
(Cov ntaub ntawv saum toj no yog los ntawm Is Taws Nem, kev tswj xyuas)
Lub sijhawm tshaj tawm: Lub Rau Hli-25-2024