Txij li xyoo 1980, qhov kev sib koom ua ke ntawm cov hluav taws xob tau nce ntxiv ntawm tus nqi txhua xyoo ntawm 1.5 × lossis sai dua. Kev sib koom ua ke ntau dua ua rau muaj qhov tam sim no ntau dua thiab tsim cua sov thaum lub sijhawm ua haujlwm.Yog tias tsis yaj tau zoo, qhov cua sov no tuaj yeem ua rau lub cev tsis ua haujlwm zoo thiab txo lub neej ntawm cov khoom siv hluav taws xob.
Yuav kom ua tau raws li qhov xav tau ntawm kev tswj cua sov uas nce zuj zus, cov ntaub ntawv ntim khoom siv hluav taws xob siab heev uas muaj kev ua tau zoo thermal tau raug tshawb fawb thiab kho kom zoo dua.
Cov khoom siv sib xyaw ua ke ntawm pob zeb diamond/tooj liab
01 Pob Zeb Diamond thiab Tooj Liab
Cov ntaub ntawv ntim khoom ib txwm muaj xws li cov khoom siv av nplaum, yas, hlau, thiab lawv cov khoom sib xyaw. Cov khoom siv av nplaum zoo li BeO thiab AlN qhia txog CTEs sib phim cov khoom siv semiconductors, kev ruaj khov tshuaj zoo, thiab kev ua haujlwm thermal nruab nrab. Txawm li cas los xij, lawv cov txheej txheem nyuaj, tus nqi siab (tshwj xeeb tshaj yog BeO lom), thiab kev txwv tsis pub siv. Cov yas ntim khoom muaj tus nqi qis, lub teeb yuag, thiab rwb thaiv tsev tab sis raug kev cuam tshuam los ntawm kev ua haujlwm thermal tsis zoo thiab kev tsis ruaj khov kub siab. Cov hlau ntshiab (Cu, Ag, Al) muaj kev ua haujlwm thermal siab tab sis CTE ntau dhau, thaum cov khoom sib xyaw (Cu-W, Cu-Mo) ua rau muaj kev ua haujlwm thermal tsis zoo. Yog li, cov ntaub ntawv ntim khoom tshiab uas sib npaug kev ua haujlwm thermal siab thiab CTE zoo tshaj plaws yog qhov xav tau sai.
| Kev txhawb zog | Kev Ua Kub (W/(m·K)) | CTE (×10⁻⁶/℃) | Qhov Ceev (g/cm³) |
| Pob zeb diamond | 700–2000 | 0.9–1.7 | 3.52 |
| Cov khoom me me BeO | 300 | 4.1 | 3.01 |
| Cov khoom AlN | 150–250 | 2.69 | 3.26 |
| Cov khoom me me SiC | 80–200 | 4.0 | 3.21 |
| Cov khoom me me B₄C | 29–67 | 4.4 | 2.52 |
| Cov fiber boron | 40 | ~5.0 | 2.6 |
| Cov khoom me me TiC | 40 | 7.4 | 4.92 |
| Cov khoom me me Al₂O₃ | 20–40 | 4.4 | 3.98 |
| SiC cov plaub hau | 32 | 3.4 | – |
| Cov khoom me me Si₃N₄ | 28 | 1.44 | 3.18 |
| TiB₂ cov khoom me me | 25 | 4.6 | 4.5 |
| Cov khoom me me SiO₂ | 1.4 | <1.0 | 2.65 |
Pob zeb diamond, cov khoom siv ntuj tsim uas nyuaj tshaj plaws (Mohs 10), kuj muaj qhov tshwj xeebkev ua kom sov (200–2200 W/(m·K)).
Pob zeb diamond micropowder
Tooj liab, nrog kev ua tau zoo ntawm cov cua sov/hluav taws xob (401 W/(m·K)), ductility, thiab kev siv nyiaj tsim nyog, yog siv dav hauv ICs.
Kev sib xyaw ua ke ntawm cov khoom no,Pob zeb diamond / tooj liab (Dia / Cu) composites—nrog Cu ua lub matrix thiab pob zeb diamond ua lub zog txhawb nqa—tab tom tshwm sim ua cov ntaub ntawv tswj kev kub tiam tom ntej.
02 Cov Txheej Txheem Tsim Khoom Tseem Ceeb
Cov txheej txheem siv rau kev npaj pob zeb diamond/tooj liab suav nrog: hmoov metallurgy, txoj kev kub thiab siab, txoj kev yaj immersion, txoj kev tso tawm plasma sintering, txoj kev txau txias, thiab lwm yam.
Kev sib piv ntawm cov txheej txheem npaj sib txawv, cov txheej txheem thiab cov khoom ntawm cov pob zeb diamond / tooj liab ib qho me me
| Cov Qauv | Hmoov Metallurgy | Nqus Tsev Kub-Nias | Kev Spark Plasma Sintering (SPS) | Kev Kub Siab Siab (HPHT) | Kev Tso Tshuaj Txias | Kev yaj infiltration |
| Hom Pob Zeb Diamond | MBD8 | HFD-D | MBD8 | MBD4 | PDA | MBD8/HHD |
| Matrix | 99.8% Cu hmoov | 99.9% electrolytic Cu hmoov | 99.9% Cu hmoov | Hmoov hlau / Cu ntshiab | Hmoov Cu ntshiab | Ntshiab Cu ntau / pas nrig |
| Kev Hloov Kho Interface | – | – | – | B, Ti, Si, Cr, Zr, W, Mo | – | – |
| Qhov Loj ntawm Cov Khoom Me Me (μm) | 100 | 106–125 | 100–400 | 20–200 | 35–200 | 50–400 |
| Feem pua ntawm Qhov Ntim (%) | 20–60 | 40–60 | 35–60 | 60–90 | 20–40 | 60–65 |
| Kub (°C) | 900 | 800–1050 | 880–950 | 1100–1300 | 350 | 1100–1300 |
| Siab (MPa) | 110 | 70 | 40–50 | 8000 | 3 | 1–4 |
| Lub Sijhawm (feeb) | 60 | 60–180 | 20 | 6–10 | – | 5–30 |
| Qhov Ceev Sib Txheeb Ze (%) | 98.5 | 99.2–99.7 | – | – | – | 99.4–99.7 |
| Kev ua tau zoo | ||||||
| Kev Ua Kub Zoo Tshaj Plaws (W/(m·K)) | 305 | 536 | 687 | 907 | – | 943 |
Cov txheej txheem sib xyaw Dia/Cu muaj xws li:
(1)Hmoov Metallurgy
Cov hmoov pob zeb diamond/Cu sib xyaw ua ke raug nias thiab sintered. Txawm hais tias tus nqi tsim nyog thiab yooj yim, txoj kev no ua rau muaj qhov ceev tsawg, cov qauv me me tsis sib xws, thiab qhov loj me ntawm cov qauv txwv.
Schav sib tham
(1)Kev Kub Siab Siab (HPHT)
Siv cov tshuab nias ntau lub qhov (manual anvil presses), cov Cu uas yaj yuav nkag mus rau hauv cov pob zeb diamond lattices nyob rau hauv cov xwm txheej hnyav, ua rau muaj cov khoom sib xyaws tuab. Txawm li cas los xij, HPHT xav tau cov pwm kim thiab tsis haum rau kev tsim khoom loj.
Cubic xovxwm
(1)Kev yaj infiltration
Cov Cu uas yaj nkag mus rau hauv cov pob zeb diamond preforms los ntawm kev nkag mus rau hauv lub zog los ntawm kev pab los ntawm lub siab lossis lub capillary. Cov khoom sib xyaw ua tiav tau > 446 W / (m · K) thermal conductivity.
(2)Kev Spark Plasma Sintering (SPS)
Cov hluav taws xob pulsed sai sai sinters cov hmoov sib xyaw hauv qab kev siab. Txawm hais tias ua haujlwm tau zoo, SPS kev ua tau zoo poob qis ntawm cov feem pua pob zeb diamond >65 vol%.
Daim duab qhia txog lub tshuab tso tawm plasma sintering
(5) Kev Tso Tshuaj Txias
Cov hmoov raug ua kom nrawm dua thiab muab tso rau ntawm cov substrates. Txoj kev pib tshiab no ntsib teeb meem hauv kev tswj qhov tiav ntawm qhov chaw thiab kev ua haujlwm thermal.
03 Kev Hloov Kho Interface
Rau kev npaj cov ntaub ntawv sib xyaw, qhov sib xyaw ua ke ntawm cov khoom sib xyaw yog qhov tsim nyog rau cov txheej txheem sib xyaw thiab yog qhov tseem ceeb uas cuam tshuam rau cov qauv interface thiab lub xeev sib txuas interface. Qhov xwm txheej tsis ntub ntawm qhov interface ntawm pob zeb diamond thiab Cu ua rau muaj kev tiv thaiv thermal ntawm qhov interface siab heev. Yog li ntawd, nws yog qhov tseem ceeb heev uas yuav tsum ua kev tshawb fawb hloov kho ntawm qhov interface ntawm ob qho los ntawm ntau txoj hauv kev. Tam sim no, muaj ob txoj hauv kev los txhim kho qhov teeb meem interface ntawm pob zeb diamond thiab Cu matrix: (1) Kev kho qhov chaw ntawm pob zeb diamond; (2) Kev kho alloying ntawm tooj liab matrix.
Daim duab qhia txog kev hloov kho: (a) Plating ncaj qha rau ntawm qhov chaw ntawm pob zeb diamond; (b) Matrix alloying
(1) Kev hloov kho qhov chaw ntawm pob zeb diamond
Kev plating cov ntsiab lus nquag xws li Mo, Ti, W thiab Cr rau ntawm txheej txheej ntawm cov theem txhawb nqa tuaj yeem txhim kho cov yam ntxwv ntawm pob zeb diamond, yog li ua kom nws cov thermal conductivity zoo dua. Sintering tuaj yeem ua rau cov ntsiab lus saum toj no cuam tshuam nrog cov pa roj carbon ntawm qhov chaw ntawm cov hmoov pob zeb diamond los tsim cov txheej hloov pauv carbide. Qhov no ua kom zoo dua qhov xwm txheej ntub ntawm pob zeb diamond thiab lub hauv paus hlau, thiab cov txheej txheem tuaj yeem tiv thaiv cov qauv ntawm pob zeb diamond los ntawm kev hloov pauv ntawm qhov kub siab.
(2) Kev sib xyaw ua ke ntawm cov tooj liab matrix
Ua ntej ua cov khoom sib xyaw ua ke, kev kho ua ntej-alloying yog ua rau ntawm cov tooj liab hlau, uas tuaj yeem tsim cov khoom sib xyaw nrog feem ntau muaj kev ua haujlwm thermal siab. Doping cov ntsiab lus nquag hauv cov tooj liab matrix tsis tsuas yog tuaj yeem txo qhov ntub ntawm pob zeb diamond thiab tooj liab, tab sis kuj tsim cov txheej carbide uas khov kho soluble hauv cov tooj liab matrix ntawm pob zeb diamond / Cu interface tom qab cov tshuaj tiv thaiv. Ua li no, feem ntau ntawm cov qhov sib txawv uas muaj nyob ntawm cov khoom siv interface raug hloov kho thiab sau, yog li txhim kho cov thermal conductivity.
04 Xaus Lus
Cov ntaub ntawv ntim khoom ib txwm tsis muaj peev xwm tswj tau cua sov los ntawm cov chips siab heev. Dia/Cu composites, nrog rau CTE uas hloov tau thiab ultrahigh thermal conductivity, sawv cev rau kev daws teeb meem hloov pauv rau cov khoom siv hluav taws xob tiam tom ntej.
Ua ib lub tuam txhab thev naus laus zis siab uas koom ua ke kev lag luam thiab kev lag luam, XKH tsom mus rau kev tshawb fawb thiab kev txhim kho thiab kev tsim cov pob zeb diamond/tooj liab sib xyaw thiab cov khoom sib xyaw ua ke hlau ua tau zoo xws li SiC/Al thiab Gr/Cu, muab cov kev daws teeb meem tswj kev kub tshiab nrog kev ua kom sov ntawm ntau dua 900W/(m·K) rau cov teb ntawm kev ntim khoom siv hluav taws xob, cov khoom siv fais fab thiab cov khoom siv dav hlau.
XKH'Cov khoom siv sib xyaw ua ke ntawm pob zeb diamond copper clad laminate:
Lub sijhawm tshaj tawm: Tsib Hlis-12-2025