Iav sai sai los ua ib qhocov khoom siv platformrau cov lag luam kawg uas coj los ntawmcov chaw khaws ntaub ntawvthiabkev sib txuas lusHauv cov chaw khaws ntaub ntawv, nws yog lub hauv paus rau ob lub tuam txhab ntim khoom tseem ceeb:cov qauv ntawm cov chipsthiabkev nkag/tawm kho qhov muag (I/O).
Nws covcoefficient qis ntawm thermal expansion (CTE)thiabCov iav nqa khoom sib xws nrog cov ultraviolet tob (DUV)tau qhibkev sib txuas ua kethiabKev ua tiav sab nraub qaum ntawm 300 hli nyias-waferkom dhau los ua cov txheej txheem tsim khoom txheem.

Raws li qhov hloov pauv thiab cov khoom siv accelerator loj hlob dhau qhov ntev ntawm wafer-stepper,cov neeg nqa khoom vaj huam sib luagtab tom dhau los ua qhov tseem ceeb. Kev ua lag luam raucov khoom siv iav tseem ceeb (GCS)yog kwv yees tias yuav ncav cuag$460 lab nyiaj los ntawm xyoo 2030, nrog rau kev kwv yees zoo qhia tias kev siv dav dav nyob ib puag ncig2027–2028. Lub sijhawm no,cov khoom siv iavxav tias yuav tshaj$400 labtxawm tias nyob rau hauv cov kev kwv yees ruaj khov, thiabntu iav ruaj khovsawv cev rau kev ua lag luam ntawm ib ncig ntawm$500 lab.
In kev ntim khoom siab heev, iav tau hloov zuj zus los ntawm kev ua ib qho khoom yooj yim mus rau kev ua ib qhokev lag luam platformRaucov neeg nqa iav, kev tsim cov nyiaj tau los hloov pauv ntawmtus nqi rau ib lub vaj huam sib luag to kev lag luam ib zaug, qhov twg profitability nyob ntawmrov siv dua cov voj voog, cov txiaj ntsig ntawm laser / UV debonding, cov txheej txheem tawm los, thiabkev txo qhov kev puas tsuaj ntawm ntugQhov kev pabcuam dynamic no muaj txiaj ntsig zoo rau cov neeg muab khoomCov ntaub ntawv kawm tiav qib CTE, cov neeg muab kev pabcuam pob khoommuag cov khoom sib xyaw ua ke ntawmtus neeg nqa khoom + nplaum / LTHC + debond, thiabcov neeg muag khoom rov qab hauv cheeb tsamtshwj xeeb hauv kev lees paub qhov zoo ntawm qhov muag.
Cov tuam txhab uas muaj kev txawj ntse txog iav tob—xws liPlan Optik, paub txog nwscov neeg nqa khoom siab tiaj tiajnrogcov qauv geometries ntawm ntug kev tsim khothiabkev sib kis uas tswj tau-yog qhov chaw zoo tshaj plaws hauv cov saw hlau no.
Cov khoom siv iav tseem ceeb tam sim no qhib lub peev xwm tsim cov vaj huam sib luag rau kev ua lag luam los ntawmTGV (Through Glass Via), RDL zoo (Txheej faib tawm dua), thiabcov txheej txheem tsim khoCov thawj coj hauv kev ua lag luam yog cov uas paub txog cov kev sib txuas lus tseem ceeb:
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Kev khawb/txiav TGV uas muaj txiaj ntsig zoo
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Kev txhaws tooj liab tsis muaj qhov khoob
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Daim duab lithography vaj huam sib luag nrog kev sib dhos hloov kho tau
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2/2 µm L/S (kab/qhov chaw)kev tsim qauv
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Cov thev naus laus zis tswj tau vaj huam sib luag Warp
Cov neeg muag khoom substrate thiab OSAT koom tes nrog cov chaw tsim khoom iav zaub tab tom hloov pauvmuaj peev xwm loj hauv thaj chawmus rau hauvCov txiaj ntsig zoo rau cov ntim khoom loj.

Los ntawm Carrier mus rau Full-Fledged Platform Material
Iav tau hloov pauv los ntawm ib qhotus neeg nqa khoom ib ntusmus rau hauv ib qhocov khoom siv dav davraukev ntim khoom siab heev, ua raws li cov megatrends xws likev sib koom ua ke ntawm cov chiplet, kev tsim vaj huam sib luag, kev teeb tsa ntsug, thiabkev sib txuas ua ke—thaum tib lub sijhawm tswj cov peev nyiaj rautshuab, thermal, thiabchav huv sikev ua tau zoo.
Ua ib tugtus neeg nqa khoom(ob qho tib si wafer thiab vaj huam sib luag),iav pob tshab, qis-CTEua raukev sib dhos uas txo qis kev ntxhov siabthiabkev tshem tawm laser / UV, txhim kho cov qoob loo raucov wafers uas tsis ntau tshaj 50 µm, cov txheej txheem rov qab, thiabcov panels uas tau tsim dua tshiab, yog li ua tiav ntau yam kev siv nyiaj tsim nyog.
Ua ib tugiav substrate, nws hloov cov organic cores thiab kev txhawb nqakev tsim khoom ntawm qib vaj huam sib luag.
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Cov TGVsmuab lub zog ntsug ntom ntom thiab kev taw qhia teeb liab.
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SAP RDLthawb cov kev txwv ntawm cov xov hlau mus rau2/2 µm.
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Cov nto tiaj tus, CTE-tunable surfacestxo qhov warpage.
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Kev pom tseeb ntawm qhov muagnpaj lub substrate raucov khoom siv sib xyaw ua ke (CPO).
Lub caij no,kev tshem tawm cua sovcov teeb meem raug daws los ntawmcov dav hlau tooj liab, cov vias xaws, Cov tes hauj lwm xa hluav taws xob tom qab (BSPDN), thiabkev txias ob sab.
Ua ib tugiav interposer, cov khoom siv ua tiav raws li ob qho qauv sib txawv:
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Hom tsis siv neeg, ua kom muaj cov qauv loj heev 2.5D AI/HPC thiab cov qauv hloov pauv uas ua tiav cov xov hlau ntom ntom thiab cov lej sib tsoo uas silicon tsis tuaj yeem ua tiav ntawm tus nqi thiab thaj chaw sib piv.
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Hom nquag, kev sib koom ua keSIW/lim/antennasthiabcov qhov av uas ua los ntawm hlau los yog cov waveguides uas sau los ntawm lasernyob rau hauv lub substrate, folding RF paths thiab routing optical I/O mus rau periphery nrog tsawg kawg poob.
Kev Lag Luam thiab Kev Lag Luam Dynamics
Raws li qhov kev tshuaj xyuas tshiab los ntawmPawg Yole, cov ntaub ntawv iav tau dhau los uaqhov tseem ceeb rau kev hloov pauv ntawm cov khoom ntim semiconductor, tsav los ntawm cov qauv tseem ceeb hauvkev txawj ntse cuav (AI), kev suav lej ua tau zoo (HPC), Kev sib txuas 5G/6G, thiabcov khoom siv sib xyaw ua ke (CPO).
Cov kws tshuaj ntsuam xyuas hais tias cov iavcov khoom tshwj xeeb- suav nrog nws covCTE qis, kev ruaj khov zoo tshaj plaws, thiabkev pom tseeb ntawm qhov muag- ua kom nws tseem ceeb rau kev ntsibcov kev xav tau ntawm kev siv tshuab, hluav taws xob, thiab thermalntawm cov pob khoom tiam tom ntej.
Yole ntxiv hais tiascov chaw khaws ntaub ntawvthiabkev sib txuas lus hauv xov toojnyob twj ywmcov cav loj hlob thawj zaugrau kev siv iav hauv kev ntim khoom, thaumtsheb, kev tiv thaiv, thiabcov khoom siv hluav taws xob siab heevpab txhawb nqa ntxiv. Cov kev lag luam no vam khom ntau zuj zus raukev sib koom ua ke ntawm cov chiplet, kev sib txuas ua ke, thiabkev tsim khoom ntawm qib vaj huam sib luag, qhov twg iav tsis tsuas yog txhim kho kev ua tau zoo tab sis kuj txo cov nqi tag nrho.
Thaum kawg, qhov tshwm sim ntawmcov saw hlau tshiab hauv Asia- tshwj xeeb tshaj yog nyob rau hauvTuam Tshoj, Kaus Lim Qab Teb, thiab Nyiv Pooj- yog pom tias yog ib qho tseem ceeb rau kev nthuav dav kev tsim khoom thiab txhawb nqalub ntiaj teb ecosystem rau cov iav ntim khoom siab heev.
Lub sijhawm tshaj tawm: Lub Kaum Hli-23-2025