Iav Ua Lub Platform Ntim Tshiab

iav yog sai ua ib tugcov khoom siv platformrau terminal kev lag luam coj los ntawmcov chaw zov me nyuamthiabkev sib txuas lus. Nyob rau hauv cov ntaub ntawv chaw zov me nyuam, nws underpins ob lub ntsiab ntim nqa khoom:chip architecturesthiaboptical input / tso zis (I / O).

NwsTsawg coefficient ntawm thermal expansion (CTE)thiabsib sib zog nqus ultraviolet (DUV)-tshaj iav nqatau enabledhybrid kev sib txuasthiab300 hli nyias-wafer backside ualos ua standardized manufacturing flows.

Raws li kev hloov thiab accelerator modules loj hlob dhau wafer-stepper qhov ntev,vaj huam sib luag nqatau dhau los ua qhov tseem ceeb. Kev ua lag luam rauiav core substrates (GCS)yog npaj kom ncav cuag$ 460 lab los ntawm 2030, nrog optimistic forecasts tawm tswv yim mainstream saws ib ncigXyoo 2027-2028. Lub caij no,iav interposersxav kom tshaj$400 labtxawm nyob rau hauv kev saib xyuas kev kwv yees, thiabkhov kho iav nqa ntu ntusawv cev rau kev ua lag luam ntawm ib ncig$500 lab.

In advanced ntim, iav tau hloov zuj zus los ntawm kev ua ib qho yooj yim tivthaiv los ua ib qhokev lag luam platform. Rauiav nqa, kev khwv nyiaj tau los hloov los ntawmnqe vaj huam sib luag to ib-cycle economics, qhov twg profitability nyob ntawmrov siv lub voj voog, laser / UV debonding yields, txheej txheem tawm los, thiabntug kev puas tsuaj mitigation. Qhov no dynamic pab cov neeg muab khoom muabCTE-qib portfolios, cov muab kev pab cuammuag integrated stacks ntawmcarrier + nplaum / LTHC + debond, thiabregional reclaim neeg muag khoomspecializing nyob rau hauv optical-zoo kev ruaj ntseg.

Cov tuam txhab uas muaj kev txawj ntse iav sib sib zog nqus-xws liPlan Optik, paub txog nwshigh-flatness nqanrogengineered ntug geometrythiabtswj kis tau tus mob-yog qhov zoo tshaj plaws nyob rau hauv cov saw nyiaj no.

Iav core substrates yog tam sim no unlocking zaub vaj huam sib luag tsim muaj peev xwm mus rau profitability los ntawmTGV (Los ntawm iav Via), zoo RDL (Cov Txheej Txheem Rov Ntxiv), thiabtsim cov txheej txheem. Cov thawj coj ua lag luam yog cov uas paub txog qhov tseem ceeb interfaces:

• High-yield TGV drilling / etching

• Void-dawb tooj liab filling

• Vaj huam sib luag lithography nrog kev hloov kho kom haum

• 2/2 µm L / S (kab / qhov chaw)qauv

• Warp-controlled vaj huam sib luag tuav technologies

Substrate thiab OSAT cov neeg muag khoom sib koom tes nrog cov iav tsom iav tau hloov pauvmuaj peev xwm lojrau hauvtus nqi zoo rau kev ntim khoom vaj huam sib luag.

Los ntawm Carrier mus rau Puv-Fledged Platform Khoom

iav tau hloov los ntawm ibtus nqa khoom ib ntushauv acomprehensive khoom platformrauadvanced ntim, aligning nrog megatrends xws lichiplet kev koom ua ke, panelization, ntsug stacking, thiabhybrid kev sib txuas-thaum ib txhij nruj pob nyiaj siv rautxhua yam, thermal, thiabchav huvkev ua tau zoo.

Raws li ib tugtus cab kuj(ob qho tib si wafer thiab vaj huam sib luag),pob tshab, qis-CTE iavpabkev nyuaj siab-tsim kom haumthiablaser / UV debonding, txhim kho yields rausub-50 µm wafers, backside txheej txheem ntws, thiabreconstituted panels, yog li ua tiav cov nqi siv ntau yam.

Raws li ib tugiav core substrate, nws hloov cov organic cores thiab kev txhawb nqapanel-level manufacturing.

• TGVsmuab ntom ntsug zog thiab teeb liab routing.

• SAP RDLpushes xov txwv txwv rau2/2 µm.

• Pav ca, CTE-tunable ntominimize warpage.

• Optical pob tshabnpaj lub substrate rauco-packaged optics (CPO).
  Lub caij no,kub dissipationcov teeb meem raug daws los ntawmtooj liab dav hlau, stitched vias, Backside fais fab xa khoom network (BSPDN), thiabcua txias ob sab.

Raws li ib tugiav interposer, cov khoom ua tiav nyob rau hauv ob qhov sib txawv paradigms:

• Passive hom, ua kom loj heev 2.5D AI / HPC thiab hloov cov qauv tsim uas ua tiav cov xov hlau ceev thiab cov pob zeb suav tsis tau los ntawm silicon ntawm tus nqi sib piv thiab thaj chaw.

• Active hom, kev koom ua keSIW/filters/antennasthiabmetalized trench lossis laser-sau waveguidesnyob rau hauv lub substrate, folding RF paths thiab routing optical I / O mus rau lub periphery nrog tsawg kawg nkaus poob.

Kev Lag Luam Outlook thiab Kev Lag Luam Dynamics

Raws li kev txheeb xyuas tshiab los ntawmYole Group, iav cov ntaub ntawv tau uaCentral rau lub semiconductor ntim kiv puag ncig, tau tsav los ntawm cov ncauj lus tseem ceeb hauvArtificial txawj ntse (AI), Kev ua haujlwm siab (HPC), 5G / 6G kev sib txuas, thiabco-packaged optics (CPO).

Cov kws tshuaj ntsuam xyuas cov iav ntawdcov khoom tshwj xeeb- suav nrog nwsqis CTE, superior dimension stability, thiaboptical pob tshab- Ua nws indispensable rau ntsib covmechanical, hluav taws xob, thiab thermal xav tauntawm cov pob khoom tom ntej.

Yole sau ntxiv tiascov chaw zov me nyuamthiabxov tooj cuanyob twj ywmthawj kev loj hlob cavrau iav saws hauv ntim, thaumtsheb, tiv thaiv, thiabhigh-end neeg siv khoom electronicspab txhawb ntxiv zog. Cov sectors no nce nyob ntawmchiplet kev koom ua ke, hybrid kev sib txuas, thiabpanel-level manufacturing, qhov twg iav tsis tsuas yog txhim kho kev ua tau zoo tab sis kuj txo tag nrho cov nqi.

Thaum kawg, qhov tshwm sim ntawmcov khoom lag luam tshiab hauv Asia- tshwj xeeb hauvTuam Tshoj, Kaus Lim Qab Teb, thiab Nyiv- raug txheeb xyuas tias yog ib qho tseem ceeb rau kev tsim cov khoom lag luam thiab ntxiv dag zog rauntiaj teb no ecosystem rau advanced ntim iav.