Q: Cov thev naus laus zis tseem ceeb siv hauv SiC wafer slicing thiab ua cov khoom yog dab tsi?
A:Silicon carbide (SiC) muaj qhov nyuaj thib ob tsuas yog pob zeb diamond thiab suav hais tias yog cov khoom siv tawv thiab tawg yooj yim. Cov txheej txheem txiav, uas cuam tshuam nrog kev txiav cov siv lead ua rau hauv cov wafers nyias nyias, yog siv sijhawm ntau thiab yooj yim rau chipping. Raws li thawj kauj ruam hauvSiCKev ua cov khoom siv lead ua ib zaug xwb, qhov zoo ntawm kev txiav ua rau muaj kev cuam tshuam loj heev rau kev sib tsoo, kev txhuam, thiab kev nyias nyias tom qab ntawd. Kev txiav feem ntau ua rau muaj kev tawg ntawm qhov chaw thiab hauv qab, ua rau cov wafer tawg ntau ntxiv thiab cov nqi tsim khoom ntau ntxiv. Yog li ntawd, kev tswj hwm kev puas tsuaj ntawm qhov chaw thaum lub sijhawm txiav yog qhov tseem ceeb rau kev txhim kho kev tsim khoom siv SiC.
Cov txheej txheem txiav SiC uas tau tshaj tawm tam sim no suav nrog kev sib txhuam ruaj khov, kev txiav dawb, kev txiav laser, kev hloov pauv txheej (kev sib cais txias), thiab kev txiav hluav taws xob. Ntawm cov no, kev txiav ntau lub hlau sib pauv nrog cov pob zeb diamond abrasives ruaj khov yog txoj hauv kev siv ntau tshaj plaws rau kev ua cov khoom siv SiC ib leeg. Txawm li cas los xij, thaum qhov loj ntawm cov ingot ncav cuag 8 nti thiab siab dua, kev txiav hlau ib txwm ua tsis tau zoo vim muaj kev xav tau khoom siv siab, nqi, thiab kev ua haujlwm qis. Muaj qhov xav tau ceev rau cov thev naus laus zis txiav pheej yig, poob qis, thiab ua haujlwm tau zoo.
Q: Cov txiaj ntsig ntawm laser slicing dua li kev txiav ntau hom hlau ib txwm muaj yog dab tsi?
A: Kev txiav hlau ib txwm txiav covSiC ingotraws ib qho kev taw qhia tshwj xeeb ua tej daim me me uas tuab ntau pua microns. Cov daim me me ntawd ces raug zom siv cov pob zeb diamond slurries kom tshem tawm cov cim pom thiab kev puas tsuaj hauv qab, ua raws li kev txhuam tshuaj lom neeg (CMP) kom ua tiav kev sib npaug thoob ntiaj teb, thiab thaum kawg ntxuav kom tau txais SiC wafers.
Txawm li cas los xij, vim SiC muaj zog thiab tawg yooj yim, cov kauj ruam no tuaj yeem ua rau warping, tawg, nce tus nqi tawg, cov nqi tsim khoom siab dua, thiab ua rau muaj qhov ntxhib thiab paug ntawm qhov chaw siab (hmoov av, dej khib nyiab, thiab lwm yam). Tsis tas li ntawd, kev txiav hlau qeeb thiab muaj cov txiaj ntsig qis. Kev kwv yees qhia tau tias kev txiav ntau hlau ib txwm ua tiav tsuas yog li 50% ntawm kev siv cov khoom siv, thiab txog li 75% ntawm cov khoom siv ploj tom qab polishing thiab sib tsoo. Cov ntaub ntawv tsim khoom txawv teb chaws thaum ntxov qhia tau hais tias nws yuav siv sijhawm li 273 hnub ntawm kev tsim khoom 24 teev tas mus li los tsim 10,000 wafers - siv sijhawm ntau heev.
Hauv tebchaws, ntau lub tuam txhab loj hlob siv lead ua SiC tsom mus rau kev nce lub peev xwm ntawm lub cub tawg. Txawm li cas los xij, es tsis txhob tsuas yog nthuav cov khoom tsim tawm, nws yog qhov tseem ceeb dua los xav txog yuav ua li cas txo qhov kev poob - tshwj xeeb tshaj yog thaum cov txiaj ntsig ntawm kev loj hlob siv lead ua tsis tau zoo tshaj plaws.
Cov khoom siv laser txiav tuaj yeem txo qhov poob ntawm cov khoom siv thiab txhim kho cov txiaj ntsig. Piv txwv li, siv ib qho 20 hli xwbSiC ingotKev txiav hlau tuaj yeem tsim tau kwv yees li 30 daim wafers ntawm 350 μm tuab. Kev txiav laser tuaj yeem tsim tau ntau dua 50 daim wafers. Yog tias daim wafer tuab raug txo kom txog 200 μm, ntau dua 80 daim wafers tuaj yeem tsim los ntawm tib lub ingot. Thaum kev txiav hlau siv dav rau cov wafers 6 nti thiab me dua, kev txiav ib daim 8-nti SiC ingot yuav siv sijhawm 10-15 hnub nrog cov txheej txheem ib txwm muaj, xav tau cov khoom siv siab thiab raug nqi siab nrog kev ua haujlwm tsawg. Hauv qab cov xwm txheej no, cov txiaj ntsig ntawm kev txiav laser tau pom tseeb, ua rau nws yog cov thev naus laus zis yav tom ntej rau 8-nti wafers.
Nrog kev txiav laser, lub sijhawm txiav ib 8-nti wafer tuaj yeem nyob hauv qab 20 feeb, nrog rau kev poob khoom ib wafer hauv qab 60 μm.
Hauv kev xaus lus, piv rau kev txiav ntau txoj hlua, laser slicing muab kev ceev dua, cov txiaj ntsig zoo dua, cov khoom poob qis dua, thiab kev ua tiav huv dua.
Q: Cov teeb meem tseem ceeb hauv kev txiav SiC laser yog dab tsi?
A: Cov txheej txheem laser slicing muaj ob kauj ruam tseem ceeb: kev hloov kho laser thiab kev sib cais wafer.
Lub hauv paus ntawm kev hloov kho laser yog beam shaping thiab parameter optimization. Cov parameter xws li lub zog laser, qhov chaw diameter, thiab scan speed txhua yam cuam tshuam rau qhov zoo ntawm cov khoom siv ablation thiab kev vam meej ntawm kev sib cais wafer tom qab. Lub geometry ntawm thaj chaw hloov kho txiav txim siab qhov roughness ntawm qhov chaw thiab qhov nyuaj ntawm kev sib cais. Qhov roughness ntawm qhov chaw siab ua rau kev sib tsoo tom qab nyuaj thiab ua rau cov khoom poob ntau ntxiv.
Tom qab hloov kho, kev sib cais wafer feem ntau yog ua tiav los ntawm kev siv zog shear, xws li kev tawg txias lossis kev ntxhov siab ntawm lub tshuab. Qee lub tshuab hauv tsev siv cov transducers ultrasonic los ua kom muaj kev co rau kev sib cais, tab sis qhov no tuaj yeem ua rau chipping thiab ntug tsis zoo, txo qhov txiaj ntsig kawg.
Txawm hais tias ob kauj ruam no tsis nyuaj, qhov tsis sib xws hauv qhov zoo ntawm cov siv lead ua - vim yog cov txheej txheem loj hlob sib txawv, cov qib doping, thiab kev faib tawm kev ntxhov siab sab hauv - cuam tshuam loj heev rau qhov nyuaj ntawm kev txiav, cov txiaj ntsig, thiab kev poob khoom. Tsuas yog txheeb xyuas cov cheeb tsam teeb meem thiab kho cov cheeb tsam laser scanning tej zaum yuav tsis txhim kho cov txiaj ntsig zoo.
Tus yuam sij rau kev siv dav dav yog nyob rau hauv kev tsim cov txheej txheem tshiab thiab cov khoom siv uas tuaj yeem hloov kho rau ntau yam zoo ntawm cov siv lead ua los ntawm ntau lub tuam txhab tsim khoom, ua kom zoo dua cov txheej txheem txheej txheem, thiab tsim cov tshuab laser slicing nrog kev siv tau thoob ntiaj teb.
Q: Puas siv tau cov tshuab laser slicing rau lwm cov ntaub ntawv semiconductor ntxiv rau SiC?
A: Kev siv tshuab txiav laser tau siv rau ntau yam khoom siv. Hauv cov khoom siv semiconductor, nws tau siv thawj zaug rau kev txiav wafer thiab txij li ntawd los tau nthuav dav mus rau kev txiav cov khoom siv loj loj.
Dhau ntawm SiC, laser slicing kuj tseem siv tau rau lwm cov ntaub ntawv tawv lossis brittle xws li pob zeb diamond, gallium nitride (GaN), thiab gallium oxide (Ga₂O₃). Cov kev tshawb fawb ua ntej ntawm cov ntaub ntawv no tau ua pov thawj txog qhov ua tau thiab qhov zoo ntawm laser slicing rau cov ntawv thov semiconductor.
Q: Puas muaj cov khoom siv laser slicing hauv tsev uas twb paub lawm? Koj txoj kev tshawb fawb nyob rau theem twg?
A: Cov khoom siv SiC laser slicing loj yog suav tias yog cov khoom siv tseem ceeb rau yav tom ntej ntawm 8-nti SiC wafer ntau lawm. Tam sim no, tsuas yog Nyiv Pooj thiaj li muab tau cov kab ke zoo li no, thiab lawv kim heev thiab raug txwv tsis pub xa tawm.
Kev thov hauv tebchaws rau cov tshuab laser slicing/thinning yog kwv yees li ntawm 1,000 units, raws li cov phiaj xwm tsim khoom SiC thiab lub peev xwm txiav hlau uas twb muaj lawm. Cov tuam txhab loj hauv tebchaws tau nqis peev ntau rau kev tsim kho, tab sis tsis muaj cov khoom siv hauv tebchaws uas muaj peev xwm loj hlob thiab muaj nyob hauv kev lag luam tau mus txog kev siv hauv kev lag luam.
Cov pab pawg tshawb fawb tau tsim cov thev naus laus zis laser lift-off txij li xyoo 2001 thiab tam sim no tau nthuav qhov no mus rau qhov loj-txoj kab uas hla SiC laser slicing thiab thinning. Lawv tau tsim ib lub kaw lus prototype thiab cov txheej txheem slicing uas muaj peev xwm ua tau: Txiav thiab thinning 4-6 nti semi-insulating SiC wafersSlicing 6-8 nti conductive SiC ingotsPerformance benchmarks: 6-8 nti semi-insulating SiC: slicing lub sijhawm 10-15 feeb/wafer; cov khoom poob <30 μm6-8 nti conductive SiC: slicing lub sijhawm 14-20 feeb/wafer; cov khoom poob <60 μm
Kwv yees tias cov wafer yield nce ntau dua 50%
Tom qab txiav, cov wafers ua tau raws li cov qauv hauv tebchaws rau geometry tom qab sib tsoo thiab polishing. Cov kev tshawb fawb kuj qhia tau tias cov teebmeem thermal uas laser ua rau tsis cuam tshuam rau kev ntxhov siab lossis geometry hauv cov wafers.
Cov khoom siv tib yam kuj tau siv los xyuas qhov ua tau rau kev txiav cov pob zeb diamond, GaN, thiab Ga₂O₃ ib leeg siv lead ua ke.
Lub sijhawm tshaj tawm: Tsib Hlis-23-2025