Cov Lus Qhia
1.Heat Dissipation Bottleneck hauv AI Chips thiab kev tawg ntawm Silicon Carbide Materials
2. Cov yam ntxwv thiab kev ua tau zoo ntawm Silicon Carbide Substrates
3. Cov phiaj xwm phiaj xwm thiab kev sib koom tes tsim los ntawm NVIDIA thiab TSMC
4. Txoj Kev Ua Haujlwm thiab Cov Txheej Txheem Tseem Ceeb
5. Kev Ua Lag Luam Kev Lag Luam thiab Kev Muaj Peev Xwm Loj
6.Qhov cuam tshuam rau cov khoom siv thiab kev ua haujlwm ntawm cov tuam txhab muaj feem cuam tshuam
7. Cov ntawv thov dav thiab tag nrho kev lag luam loj ntawm Silicon Carbide
8. XKH's Customized Solutions and Product Support
Lub tshav kub dissipation bottleneck ntawm yav tom ntej AI chips tau kov yeej los ntawm silicon carbide (SiC) substrate cov ntaub ntawv.
Raws li kev tshaj tawm xov xwm txawv teb chaws, NVIDIA npaj yuav hloov cov khoom nruab nrab nruab nrab ntawm cov khoom siv hauv CoWoS cov txheej txheem ntim qib siab ntawm nws cov txheej txheem tom ntej nrog silicon carbide. TSMC tau caw cov tuam txhab loj los koom ua ke tsim cov thev naus laus zis rau SiC nruab nrab substrates.
Qhov laj thawj tseem ceeb yog tias kev txhim kho kev ua haujlwm ntawm AI chips tam sim no tau ntsib kev txwv lub cev. Raws li GPU lub zog nce, kev sib koom ua ke ntau lub chips rau hauv silicon interposers tsim kom muaj cua sov dissipation xav tau heev. Cov cua sov tsim tawm hauv cov chips tau nce mus txog nws qhov kev txwv, thiab cov tsoos silicon interposers tsis tuaj yeem daws qhov kev sib tw no zoo.
NVIDIA Cov Txheej Txheem Hloov Cov Khoom Siv Hluav Taws Xob Hluav Taws Xob! Silicon Carbide Substrate Demand Set to Explode! Silicon carbide yog lub dav bandgap semiconductor, thiab nws cov khoom siv lub cev tshwj xeeb muab nws qhov txiaj ntsig tseem ceeb hauv qhov chaw huab cua nrog lub zog siab thiab kub kub flux. Hauv GPU siab ntim ntim, nws muaj ob qhov txiaj ntsig zoo:
1.Heat Dissipation Capability: Hloov silicon interposers nrog SiC interposers tuaj yeem txo cov thermal tsis kam los ntawm ze li ntawm 70%.
2.Efficient Power Architecture: SiC tso cai rau kev tsim kom muaj txiaj ntsig zoo dua, cov khoom siv hluav taws xob me me, ua kom lub zog xa mus rau txoj hauv kev, txo qhov kev poob qis, thiab muab cov lus teb sai dua, ruaj khov tam sim no rau AI suav loads.
Qhov kev hloov pauv no yog txhawm rau daws cov teeb meem kub ntxhov uas tshwm sim los ntawm kev ua kom lub zog GPU tsis tu ncua, muab kev daws teeb meem zoo dua rau kev ua haujlwm siab ntawm cov chips.
Lub thermal conductivity ntawm silicon carbide yog 2-3 zaug siab dua li ntawm silicon, zoo txhim kho thermal tswj efficiency thiab daws cov teeb meem kub dissipation nyob rau hauv high-power chips. Nws cov thermal ua tau zoo heev tuaj yeem txo qhov kub ntawm GPU chips los ntawm 20-30 ° C, txhim khu kev ruaj ntseg hauv cov xwm txheej siab.
Txoj Kev Ua Haujlwm thiab Kev Sib Tw
Raws li cov khoom siv saw, NVIDIA yuav siv cov khoom hloov pauv no hauv ob kauj ruam:
•2025-2026: Thawj tiam Rubin GPU tseem yuav siv silicon interposers. TSMC tau caw cov tuam txhab loj los koom ua ke tsim SiC interposer manufacturing technology.
•2027: SiC interposers yuav raug muab tso rau hauv cov txheej txheem ntim khoom siab heev.
Txawm li cas los xij, txoj kev npaj no ntsib ntau yam teeb meem, tshwj xeeb tshaj yog hauv kev tsim khoom. Lub hardness ntawm silicon carbide yog piv rau cov pob zeb diamond, xav tau kev siv tshuab siab heev. Yog tias kev txiav tshuab tsis txaus, SiC nto yuav dhau los ua wavy, ua rau nws siv tsis tau rau kev ntim khoom siab heev. Cov khoom lag luam xws li Nyiv lub DISCO tab tom ua haujlwm los tsim cov cuab yeej laser txiav tshiab los daws qhov kev sib tw no.
Yav tom ntej Prospects
Tam sim no, SiC interposer thev naus laus zis yuav xub siv rau hauv cov txheej txheem AI tshaj plaws. TSMC npaj yuav tshaj tawm 7x reticle CoWoS nyob rau hauv 2027 los koom ua ke ntau cov txheej txheem thiab kev nco, ua rau thaj tsam interposer rau 14,400 mm², uas yuav ua rau muaj kev xav tau ntau dua rau cov substrates.
Morgan Stanley kwv yees tias lub ntiaj teb txhua hli CoWoS ntim peev xwm yuav nce los ntawm 38,000 12-nti wafers hauv 2024 txog 83,000 xyoo 2025 thiab 112,000 xyoo 2026. Qhov kev loj hlob no yuav ncaj qha txhawb kev thov rau SiC interposers.
Txawm hais tias 12-nti SiC substrates yog tam sim no kim, cov nqi yuav tsum maj mam poob mus rau theem tsim nyog raws li kev tsim ntau lawm nce thiab thev naus laus zis kom loj hlob, tsim cov xwm txheej rau cov ntawv thov loj.
SiC interposers tsis tsuas yog daws cov teeb meem kub kub tab sis kuj tseem txhim kho kev sib koom ua ke kom ceev. Thaj tsam ntawm 12-nti SiC substrates yog ze li ntawm 90% loj dua li ntawm 8-nti substrates, tso cai rau ib tus neeg cuam tshuam los sib txuas ntau Chiplet modules, ncaj qha txhawb NVIDIA's 7x reticle CoWoS ntim cov cai.
TSMC tab tom koom tes nrog cov tuam txhab Nyij Pooj xws li DISCO los tsim SiC interposer manufacturing technology. Thaum cov cuab yeej tshiab nyob rau hauv qhov chaw, SiC interposer manufacturing yuav ua tau zoo dua, nrog rau qhov ntxov tshaj plaws nkag mus rau hauv kev ntim khoom siab heev xav tau nyob rau hauv 2027.
Tsav los ntawm cov xov xwm no, SiC-hais txog cov khoom lag luam ua tau zoo rau lub Cuaj Hlis 5, nrog rau qhov ntsuas tau nce 5.76%. Cov tuam txhab xws li Tianyue Advanced, Luxshare Precision, thiab Tiantong Co. ntaus cov kev txwv txhua hnub, thaum Jingsheng Mechanical & Electrical thiab Yintang Intelligent Control tau nce ntau dua 10%.
Raws li Cov Xov Xwm Txhua Hnub Kev Lag Luam, txhawm rau txhim kho kev ua tau zoo, NVIDIA npaj yuav hloov cov khoom nruab nrab ntawm cov khoom siv hauv CoWoS cov txheej txheem ntim khoom siab nrog silicon carbide hauv nws cov cim txuas ntxiv mus Rubin processor tsim cov phiaj xwm.
Cov ntaub ntawv pej xeem qhia tau hais tias silicon carbide muaj lub cev zoo heev. Piv nrog rau cov khoom siv silicon, SiC cov cuab yeej muaj qhov zoo xws li lub zog muaj zog ceev, tsis muaj zog poob, thiab qhov tshwj xeeb ntawm qhov kub thiab txias. Raws li Tianfeng Kev Ruaj Ntseg, SiC kev lag luam saw nce toj suav nrog kev npaj ntawm SiC substrates thiab epitaxial wafers; midstream suav nrog kev tsim, tsim khoom, thiab ntim khoom / kuaj ntawm SiC cov khoom siv hluav taws xob thiab RF.
Hauv qab, SiC daim ntawv thov yog dav, npog ntau tshaj kaum kev lag luam, suav nrog lub zog tshiab tsheb, photovoltaics, kev tsim khoom lag luam, kev thauj mus los, kev sib txuas lus hauv paus chaw nres tsheb, thiab radar. Ntawm cov no, tsheb yuav dhau los ua daim ntawv thov tseem ceeb rau SiC. Raws li Aijian Securities, los ntawm 2028, automotive sector yuav suav txog 74% ntawm lub ntiaj teb lub zog SiC khoom lag luam.
Nyob rau hauv cov nqe lus ntawm tag nrho cov lag luam loj, raws li Yole Intelligence, lub ntiaj teb no conductive thiab semi-insulating SiC substrate lag luam qhov ntau thiab tsawg yog 512millionand242 lab, raws li, nyob rau hauv 2022. Nws tau kwv yees tias los ntawm 2026, lub ntiaj teb no SiC kev lag luam loj yuav ncav cuag 2.053billion, withconductiveandsemimarketing. thiab $433 lab, feem. Qhov sib xyaw ua ke ntawm kev loj hlob txhua xyoo (CAGRs) rau kev coj ua thiab ib nrab insulating SiC substrates los ntawm 2022 txog 2026 yuav tsum yog 33.37% thiab 15.66%, feem.
XKH Tshwj xeeb hauv Kev Txhim Kho Kev Txhim Kho thiab Kev Muag Khoom Ntiaj Teb ntawm Silicon Carbide (SiC) Cov Khoom Siv, muab tag nrho qhov loj ntawm 2 txog 12 ntiv tes rau ob qho tib si conductive thiab semi-insulating silicon carbide substrates . Peb txhawb tus kheej customization ntawm tsis xws li siv lead ua orientation, resistivity (10⁻³–10¹⁰ Ω·cm), thiab thickness (350–2000μm). Peb cov khoom siv dav siv nyob rau hauv high-end teb nrog rau lub zog tshiab tsheb, photovoltaic inverters, thiab industrial motors. Leveraging ib tug ruaj khov khoom saw system thiab ib tug technical support team , peb xyuas kom meej cov lus teb sai thiab meej tus me nyuam, pab cov neeg muas zaub txhim kho cov cuab yeej kev ua tau zoo thiab optimize system nqi.
Post lub sij hawm: Sep-12-2025