SOI (Silicon-On-Insulator) waferssawv cev rau cov khoom siv semiconductor tshwj xeeb uas muaj ib txheej silicon nyias nyias uas tsim nyob rau saum ib txheej oxide rwb thaiv tsev. Cov qauv sandwich tshwj xeeb no muab kev txhim kho kev ua tau zoo rau cov khoom siv semiconductor.
Cov Qauv Muaj pes tsawg leeg:
Txheej Khoom Siv (Silicon Sab Saum Toj):
Qhov tuab ntawm ntau lub nanometers mus rau micrometers, ua haujlwm ua txheej txheem nquag rau kev tsim cov transistor.
Txheej Oxide faus (BOX):
Ib txheej silicon dioxide rwb thaiv tsev (tuab 0.05-15μm) uas cais cov txheej cuab yeej ntawm lub substrate los ntawm hluav taws xob.
Lub hauv paus substrate:
Cov silicon loj (tuab 100-500μm) muab kev txhawb nqa kho tshuab.
Raws li cov txheej txheem npaj, cov txheej txheem tseem ceeb ntawm SOI silicon wafers tuaj yeem muab faib ua: SIMOX (oxygen injection isolation technology), BESOI (bonding thinning technology), thiab Smart Cut (intelligent stripping technology).
SIMOX (tshuab rho tawm cov pa oxygen) yog ib txoj kev siv uas txhaj cov pa oxygen ions muaj zog heev rau hauv cov silicon wafers los ua ib txheej silicon dioxide, uas tom qab ntawd raug rau kev kub siab annealing los kho cov qhov tsis zoo ntawm lattice. Lub hauv paus yog kev txhaj cov pa oxygen ion ncaj qha los ua txheej oxygen faus.
BESOI (Bonding Thinning technology) cuam tshuam nrog kev sib txuas ob lub silicon wafers thiab tom qab ntawd thinning ib qho ntawm lawv los ntawm kev sib tsoo tshuab thiab tshuaj etching los tsim ib qho qauv SOI. Lub hauv paus nyob hauv kev sib txuas thiab thinning.
Siv thev naus laus zis ntse (Smart Cut) los tsim ib txheej txheej tawv los ntawm kev txhaj tshuaj hydrogen ion. Tom qab sib txuas, kev kho cua sov raug ua kom cov silicon wafer tawm raws li txheej hydrogen ion, tsim ib txheej silicon nyias heev. Lub plawv yog kev txhaj tshuaj hydrogen.
Tam sim no, muaj lwm yam thev naus laus zis hu ua SIMBOND (oxygen injection bonding technology), uas tau tsim los ntawm Xinao. Qhov tseeb, nws yog ib txoj kev uas sib xyaw cov pa oxygen injection thiab bonding technologies. Hauv txoj kev no, cov pa oxygen uas txhaj rau hauv lub cev yog siv los ua ib txheej thaiv nyias nyias, thiab txheej pa oxygen uas faus rau hauv lub cev yog ib txheej thermal oxidation. Yog li ntawd, nws tib lub sijhawm txhim kho cov yam ntxwv xws li kev sib xws ntawm cov silicon sab saum toj thiab qhov zoo ntawm cov txheej pa oxygen uas faus rau hauv lub cev.
SOI silicon wafers tsim los ntawm ntau txoj kev siv tshuab muaj cov kev ua tau zoo sib txawv thiab tsim nyog rau cov xwm txheej thov sib txawv.
Cov hauv qab no yog cov lus qhia luv luv ntawm cov txiaj ntsig kev ua tau zoo ntawm SOI silicon wafers, ua ke nrog lawv cov yam ntxwv kev siv tshuab thiab cov xwm txheej siv tiag tiag. Piv nrog cov silicon ib txwm muaj, SOI muaj cov txiaj ntsig zoo hauv kev sib npaug ntawm kev ceev thiab kev siv hluav taws xob. (PS: Kev ua tau zoo ntawm 22nm FD-SOI ze rau FinFET, thiab tus nqi raug txo los ntawm 30%.)
| Qhov Zoo ntawm Kev Ua Tau Zoo | Txoj Cai Txuj Ci | Kev Qhia Tshwj Xeeb | Cov Xwm Txheej Ib Txwm Muaj Rau Daim Ntawv Thov |
| Qis Parasitic Capacitance | Txheej rwb thaiv tsev (BOX) thaiv kev sib txuas ntawm lub cuab yeej thiab cov khoom siv | Kev hloov pauv ceev nce ntxiv 15% -30%, kev siv hluav taws xob txo qis 20% -50% | 5G RF, Cov chips sib txuas lus zaus siab |
| Txo Qhov Tawg Tam Sim No | Txheej rwb thaiv tsev tiv thaiv cov kev xau tam sim no | Cov dej xau txo qis los ntawm >90%, lub roj teeb ntev dua | Cov khoom siv IoT, Cov khoom siv hluav taws xob hnav tau |
| Kev Ua Kom Muaj Zog Dua ntawm Kev Hluav Taws Xob | Cov txheej rwb thaiv tsev thaiv cov hluav taws xob uas ua rau muaj kev sib sau ua ke ntawm cov nqi hluav taws xob | Kev tiv thaiv kab mob tau zoo dua 3-5 zaug, txo qhov teeb meem ib zaug xwb | Lub dav hlau tsaws chaw, cov khoom siv hauv kev lag luam nuclear |
| Kev Tswj Xyuas Cov Nyhuv Luv-Channel | Cov txheej silicon nyias nyias txo cov hluav taws xob cuam tshuam ntawm cov dej ntws thiab qhov chaw | Kev ruaj khov ntawm qhov hluav taws xob threshold zoo dua, qhov nqes hav subthreshold zoo dua | Cov chips logic siab heev (<14nm) |
| Kev Tswj Xyuas Thermal Zoo Dua | Cov txheej rwb thaiv tsev txo cov kev sib txuas thermal conduction | Tsawg dua 30% cua sov sib sau ua ke, qis dua 15-25 ° C kub ua haujlwm | 3D ICs, Cov khoom siv hluav taws xob hauv tsheb |
| Kev Txhim Kho Zaus Siab | Txo cov kab mob parasitic capacitance thiab txhim kho cov neeg nqa khoom txav mus los | Qis dua 20%, txhawb nqa >30GHz kev ua cov teeb liab | Kev sib txuas lus mmWave, Cov chips sib txuas lus satellite |
| Kev Tsim Qauv Yooj Yim Ntxiv | Tsis tas yuav tsum tau siv tshuaj doping zoo, txhawb nqa kev cuam tshuam rov qab | Cov kauj ruam ua haujlwm tsawg dua 13% -20%, qhov sib koom ua ke ntau dua 40% | Cov ICs sib xyaw ua ke, Cov Sensors |
| Kev Tiv Thaiv Kab Mob Latch-up | Cov txheej rwb thaiv tsev cais cov kab mob PN sib txuas | Qhov txwv tam sim no ntawm lub latch-up tau nce mus txog > 100mA | Cov khoom siv hluav taws xob siab |
Hauv kev xaus lus, qhov zoo tshaj plaws ntawm SOI yog: nws khiav ceev thiab siv hluav taws xob ntau dua.
Vim yog cov yam ntxwv ntawm SOI no, nws muaj ntau daim ntawv thov hauv cov teb uas xav tau kev ua haujlwm zoo heev thiab kev siv hluav taws xob.
Raws li qhia hauv qab no, raws li qhov sib piv ntawm cov teb thov sib raug rau SOI, nws tuaj yeem pom tias RF thiab cov khoom siv fais fab suav rau feem ntau ntawm kev lag luam SOI.
| Daim Ntawv Thov | Kev Sib Koom Ua Lag Luam |
| RF-SOI (Xov Tooj Cua Zaus) | 45% |
| Lub zog SOI | 30% |
| FD-SOI (Tag Nrho Cov Khoom Siv) | 15% |
| Optical SOI | 8% |
| Sensor SOI | 2% |
Nrog kev loj hlob ntawm kev ua lag luam xws li kev sib txuas lus ntawm tes thiab kev tsav tsheb ywj pheej, SOI silicon wafers kuj tseem xav tias yuav tswj hwm qee qhov kev loj hlob.
XKH, ua ib lub tuam txhab tsim kho tshiab hauv Silicon-On-Insulator (SOI) wafer technology, muab cov kev daws teeb meem SOI tag nrho los ntawm R&D mus rau kev tsim khoom ntau ntau siv cov txheej txheem tsim khoom lag luam zoo tshaj plaws. Peb cov khoom lag luam tag nrho suav nrog 200mm/300mm SOI wafers uas suav nrog RF-SOI, Power-SOI thiab FD-SOI variants, nrog kev tswj xyuas zoo kom ntseeg tau tias muaj kev ua tau zoo tshaj plaws (qhov tuab sib xws hauv ± 1.5%). Peb muab cov kev daws teeb meem tshwj xeeb nrog cov txheej oxide faus (BOX) tuab ntawm 50nm txog 1.5μm thiab ntau yam kev tiv thaiv kom ua tau raws li cov kev xav tau tshwj xeeb. Siv 15 xyoo ntawm kev txawj ntse thiab kev xa khoom thoob ntiaj teb muaj zog, peb ntseeg tau muab cov khoom siv SOI substrate zoo rau cov chaw tsim khoom semiconductor zoo tshaj plaws thoob ntiaj teb, ua rau muaj kev tsim kho tshiab ntawm cov chip hauv 5G kev sib txuas lus, khoom siv hluav taws xob hauv tsheb, thiab kev siv tshuab txawj ntse.
XKH's SOI wafers:
Lub sijhawm tshaj tawm: Plaub Hlis-24-2025