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TSMC Xauv hauv 12-Inch Silicon Carbide rau New Frontier, Kev Siv Lub Tswv Yim hauv AI Era's Critical Thermal Management Materials

Cov ntsiab lus

1. Kev hloov pauv thev naus laus zis: Kev nce ntawm Silicon Carbide thiab nws cov kev sib tw

2. TSMC's Strategic Shift: Exiting GaN and Betting on SiC

3. Cov khoom sib tw: Qhov Irreplaceability ntawm SiC

4. Daim Ntawv Thov Scenario: Thermal Management Revolution in AI Chips thiab Next-Gen Electronics

5. Cov Kev Sib Tw Yav Tom Ntej: Kev Sib Tw Kev Lag Luam thiab Kev Lag Luam

Raws li TechNews, kev lag luam thoob ntiaj teb semiconductor tau nkag mus rau lub sijhawm uas tau tsav los ntawm kev txawj ntse txawj ntse (AI) thiab kev ua haujlwm siab (HPC), qhov twg thermal tswj tau tshwm sim los ua lub hauv paus tseem ceeb cuam tshuam rau kev tsim cov chips thiab cov txheej txheem tawg. Raws li cov txheej txheem ntim qib siab zoo li 3D stacking thiab 2.5D kev koom ua ke txuas ntxiv ua kom cov nti ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom ntom tsis tuaj yeem ua tau raws li qhov xav tau thermal flux. TSMC, lub ntiaj teb cov thawj coj wafer foundry, tau teb rau qhov kev sib tw no nrog cov khoom siv ua haujlwm loj: siab puag 12-nti ib leeg-crystal silicon carbide (SiC) substrates thaum maj mam tawm hauv kev lag luam gallium nitride (GaN). Qhov kev txav no tsis tsuas yog qhia txog kev rov ua dua tshiab ntawm TSMC cov khoom siv lub tswv yim tab sis kuj tseem qhia txog qhov kev tswj xyuas thermal tau hloov pauv li cas los ntawm "kev txhawb nqa thev naus laus zis" mus rau "kev sib tw tseem ceeb."

 

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Silicon Carbide: Tshaj Tawm Hluav Taws Xob Hluav Taws Xob

Silicon carbide, renowned rau nws dav bandgap semiconductor zog, tau ib txwm siv nyob rau hauv high-efficiency fais fab hluav taws xob xws li hluav taws xob tsheb inverters, muaj lub cev muaj zog tswj, thiab tauj dua tshiab zog infrastructure. Txawm li cas los xij, SiC lub peev xwm nthuav dav dhau qhov no. Nrog rau qhov tshwj xeeb thermal conductivity ntawm kwv yees li 500 W / mK - deb tshaj cov pa ceramic substrates xws li txhuas oxide (Al₂O₃) los yog sapphire -SiC tam sim no npaj los daws cov teeb meem thermal ntawm cov ntawv thov siab.

 https://www.xkh-semitech.com/sic-substrate-epi-wafer-conductivesemi-type-4-6-8-inch-product/

 

AI Accelerators thiab Thermal Crisis ​​

Kev loj hlob ntawm AI accelerators, data center processors, thiab AR ntse tsom iav tau ua rau muaj kev txwv ntau dua thiab kev tswj xyuas thermal. Hauv cov khoom siv hnav, piv txwv li, cov khoom siv microchip nyob ze ntawm lub qhov muag xav tau cov thermal tswj kom muaj kev nyab xeeb thiab ruaj khov. Leveraging nws lub xyoo caum ntawm kev txawj ntse nyob rau hauv 12-nti wafer fabrication, TSMC yog nce mus rau loj-thaj chaw ib leeg-crystal SiC substrates los hloov cov tsoos ceramics. Lub tswv yim no ua rau muaj kev sib koom ua ke rau hauv cov kab tsim khoom uas twb muaj lawm, sib npaug cov txiaj ntsig thiab cov nqi zoo yam tsis tas yuav tsum tau ua tiav kev tsim khoom.

 

Kev Sib Tw Txuj Ci thiab Kev Tsim Kho Tshiabua

Thaum SiC substrates rau kev tswj xyuas thermal tsis tas yuav tsum muaj cov qauv hluav taws xob tsis zoo uas xav tau los ntawm cov khoom siv fais fab, kev siv lead ua ncaj ncees tseem ceeb heev. Lwm yam xws li impurities lossis kev ntxhov siab tuaj yeem cuam tshuam phonon kis tau tus mob, degrade thermal conductivity, thiab induce localized overheating, thaum kawg cuam tshuam rau txhua yam muaj zog thiab nto flatness. Rau 12-nti wafers, warpage thiab deformation yog qhov kev txhawj xeeb tseem ceeb, vim tias lawv cuam tshuam ncaj qha rau kev sib txuas ntawm cov chips thiab cov khoom ntim siab heev. Kev lag luam tsom tau yog li hloov pauv los ntawm kev tshem tawm cov teeb meem hluav taws xob kom ntseeg tau tias muaj qhov sib txawv ntawm qhov sib txawv, tsis tshua muaj porosity, thiab qhov siab ntawm qhov dav dav-qhov yuav tsum tau ua ua ntej rau high-yield SiC thermal substrate pawg ntau lawm.

 

https://www.xkh-semitech.com/silicon-carbide-sic-single-crystal-substrate-10x10mm-wafer-product/

uaSiC lub luag haujlwm hauv Advanced Ntim

SiC kev sib xyaw ua ke ntawm cov thermal conductivity, txhua yam robustness, thiab thermal poob siab ua hauj lwm nws ua ib tug game-changer nyob rau hauv 2.5D thiab 3D ntim:

 
  • 2.5D Integration:Chips yog mounted ntawm silicon los yog organic interposers nrog luv luv, zoo teeb liab txoj kev. Thaum tshav kub kub dissipation cov nyom ntawm no feem ntau yog kab rov tav. ua
  • 3D Integration:Vertically stacked chips ntawm through-silicon vias (TSVs) los yog hybrid bonding ua tiav ultra-siab interconnect ceev tab sis fim exponential thermal siab. SiC tsis tsuas yog ua haujlwm raws li cov khoom siv hluav taws xob tsis zoo xwb tab sis kuj sib koom ua ke nrog cov kev daws teeb meem zoo li pob zeb diamond lossis kua hlau los ua "hybrid cooling" systems.

 

uaStrategic Exit los ntawm GaN

TSMC tshaj tawm cov phiaj xwm los txiav tawm GaN kev ua haujlwm los ntawm 2027, faib cov peev txheej rau SiC. Qhov kev txiav txim siab no qhia txog kev hloov kho lub tswv yim: thaum GaN ua tau zoo hauv cov ntawv thov kev siv ntau zaus, SiC qhov kev tswj hwm thermal muaj peev xwm thiab scalability zoo dua nrog TSMC lub zeem muag mus ntev. Kev hloov mus rau 12-nti wafers cog lus tias yuav txo nqi thiab txhim kho cov txheej txheem sib xws, txawm tias muaj kev sib tw hauv kev txiav, polishing, thiab kev npaj.

 

Beyond Automotive: SiC's New Frontiers

Keeb kwm, SiC tau ua ke nrog cov khoom siv hluav taws xob tsheb. Tam sim no, TSMC tab tom rov xav txog nws cov ntawv thov:

 
  • Conductive N-hom SiC:Ua raws li cov thermal kis hauv AI accelerators thiab cov txheej txheem ua haujlwm siab.
  • Insulating SiC:Ua haujlwm li interposers hauv chiplet tsim, ntsuas hluav taws xob sib cais nrog thermal conduction.

Cov kev tsim kho tshiab no tso SiC ua cov khoom siv hauv paus rau kev tswj xyuas thermal hauv AI thiab cov ntaub ntawv chaw chips.

 

Tsab ntawv xov xwm no tshwm sim thawj zaug https://www.xkh-semitech.com/4h-n6h-n-sic-wafer-reeasearch-production-dummy-grade-dia150mm-silicon-carbide-substrate-product/

 

uaCov khoom toj roob hauv pes

Thaum lub pob zeb diamond (1,000–2,200 W / mK) thiab graphene (3,000–5,000 W / mK) muaj cov thermal conductivity zoo dua, lawv cov nqi qis dua thiab cov kev txwv tsis pub muaj kev cuam tshuam loj rau kev saws me nyuam. Lwm txoj hauv kev zoo li cov kua hlau los yog microfluidic lub ntsej muag ua kom txias nrog kev sib koom ua ke thiab cov nqi teeb meem. SiC's "qhov chaw qab zib"-ua ke nrog kev ua haujlwm, kev siv lub zog, thiab kev tsim khoom-ua rau nws yog qhov kev daws teeb meem zoo tshaj plaws.
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TSMC's Competitive Edge

TSMC's 12-nti wafer kev txawj ntse txawv nws ntawm cov neeg sib tw, ua kom muaj kev xa tawm sai ntawm SiC platforms. Los ntawm kev siv cov cuab yeej cuab tam uas twb muaj lawm thiab cov khoom ntim qib siab zoo li CoWoS, TSMC lub hom phiaj los hloov cov khoom zoo rau hauv cov txheej txheem thermal daws teeb meem. Ib yam li ntawd, kev lag luam loj xws li Intel tau ua qhov tseem ceeb rau kev xa hluav taws xob rov qab thiab thermal-power co-tsim, underscoring lub ntiaj teb hloov mus rau thermal-centric innovation.

Post lub sij hawm: Sep-28-2025
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