Cov txiaj ntsig ntawm Through Glass Via (TGV) thiab Through Silicon Via, TSV (TSV) cov txheej txheem yog dab tsi dua li TGV?

Qhov zoo ntawmLos ntawm Iav Via (TGV)thiab Cov txheej txheem Los Ntawm Silicon Via (TSV) hla TGV feem ntau yog:

(1) cov yam ntxwv hluav taws xob zoo heev. Cov khoom siv iav yog cov khoom siv rwb thaiv tsev, qhov dielectric tas mus li tsuas yog li 1/3 ntawm cov khoom siv silicon, thiab qhov poob qis dua li cov khoom siv silicon 2-3 qhov kev txiav txim ntawm qhov loj, uas ua rau qhov poob ntawm cov substrate thiab cov teebmeem parasitic txo qis heev thiab ua kom muaj kev ncaj ncees ntawm cov teeb liab xa mus;

(2)Qhov loj thiab ultra-nyias iav substrateyooj yim kom tau. Corning, Asahi thiab SCHOTT thiab lwm cov chaw tsim khoom iav tuaj yeem muab cov iav loj heev (>2m × 2m) thiab ultra-thin (<50µm) thiab cov ntaub ntawv iav yooj ywm ultra-thin.

3) Tus nqi qis. Tau txais txiaj ntsig los ntawm kev nkag mus rau cov iav loj ultra-thin vaj huam sib luag, thiab tsis tas yuav tsum muaj cov txheej insulating, tus nqi tsim khoom ntawm cov iav adapter phaj tsuas yog li 1/8 ntawm cov silicon-based adapter phaj;

4) Cov txheej txheem yooj yim. Tsis tas yuav tsum tso ib txheej rwb thaiv tsev rau ntawm qhov chaw substrate thiab phab ntsa sab hauv ntawm TGV, thiab tsis tas yuav ua kom nyias nyias rau hauv lub phaj adapter ultra-thin;

(5) Muaj zog ruaj khov. Txawm tias thaum lub thickness ntawm lub adapter phaj tsawg dua 100µm, qhov warpage tseem me me;

(6) Ntau yam kev siv, yog ib qho thev naus laus zis txuas ntev uas siv rau hauv thaj chaw ntawm wafer-level ntim, kom ua tiav qhov luv tshaj plaws ntawm wafer-wafer, qhov tsawg kawg nkaus ntawm qhov sib txuas muab txoj hauv kev thev naus laus zis tshiab, nrog rau cov khoom siv hluav taws xob zoo heev, thermal, mechanical, hauv RF chip, high-end MEMS sensors, high-density system kev koom ua ke thiab lwm qhov chaw nrog cov txiaj ntsig tshwj xeeb, yog tiam tom ntej ntawm 5G, 6G high-frequency chip 3D Nws yog ib qho ntawm thawj qhov kev xaiv rau 3D ntim ntawm tiam tom ntej 5G thiab 6G high-frequency chips.

Cov txheej txheem molding ntawm TGV feem ntau suav nrog sandblasting, ultrasonic drilling, ntub etching, tob reactive ion etching, photosensitive etching, laser etching, laser-induced tob etching, thiab tsom qhov tso tawm qhov.

Cov kev tshawb fawb thiab kev txhim kho tshiab qhia tau hais tias cov thev naus laus zis no tuaj yeem npaj cov qhov thiab 5: 1 qhov dig muag nrog qhov tob rau qhov dav ntawm 20: 1, thiab muaj cov qauv zoo. Laser induced tob etching, uas ua rau muaj qhov me me ntawm qhov chaw roughness, yog txoj kev kawm ntau tshaj plaws tam sim no. Raws li pom hauv Daim Duab 1, muaj cov kab nrib pleb pom tseeb nyob ib puag ncig laser drilling, thaum cov phab ntsa ib puag ncig thiab sab ntawm laser-induced tob etching yog huv si thiab du.

Cov txheej txheem ua tiav ntawmTGVTus interposer tau qhia nyob rau hauv Daim Duab 2. Lub tswv yim tag nrho yog kom tho qhov rau ntawm lub iav substrate ua ntej, thiab tom qab ntawd tso cov txheej thaiv thiab cov noob txheej rau ntawm phab ntsa sab thiab nto. Cov txheej thaiv tiv thaiv kev sib kis ntawm Cu rau lub iav substrate, thaum ua kom muaj kev sib txuas ntawm ob qho, tau kawg, hauv qee qhov kev tshawb fawb kuj pom tias cov txheej thaiv tsis tsim nyog. Tom qab ntawd Cu raug tso los ntawm electroplating, tom qab ntawd annealed, thiab cov txheej Cu raug tshem tawm los ntawm CMP. Thaum kawg, RDL rewiring txheej yog npaj los ntawm PVD txheej lithography, thiab cov txheej passivation yog tsim tom qab cov kua nplaum raug tshem tawm.

(a) Kev npaj ntawm wafer, (b) kev tsim ntawm TGV, (c) ob-sab electroplating - deposition ntawm tooj liab, (d) annealing thiab CMP tshuaj-mechanical polishing, tshem tawm ntawm qhov chaw tooj liab txheej, (e) PVD txheej thiab lithography, (f) kev tso ntawm RDL rewiring txheej, (g) degluing thiab Cu / Ti etching, (h) kev tsim ntawm passivation txheej.

Yuav kom xaus lus,iav los ntawm qhov (TGV)Cov kev cia siab ntawm daim ntawv thov yog dav, thiab kev lag luam hauv tsev tam sim no nyob rau theem nce siab, los ntawm cov khoom siv mus rau kev tsim khoom thiab kev tshawb fawb thiab kev loj hlob tus nqi siab dua li qhov nruab nrab thoob ntiaj teb

Yog tias muaj kev ua txhaum cai, tiv tauj rho tawm