Cov Lus Qhia
1.Cov ntsiab lus thiab cov haujlwm tseem ceeb ntawm FOUP
2.Structure thiab tsim nta ntawm FOUP
3. Kev faib tawm thiab Daim Ntawv Thov Kev Qhia ntawm FOUP
4. Kev khiav hauj lwm thiab qhov tseem ceeb ntawm FOUP hauv Semiconductor Manufacturing
5.Technical Challenges thiab Future Development Trends
6.XKH's Customized Solutions and Service Support
Nyob rau hauv cov txheej txheem tsim khoom semiconductor, Pem Hauv Ntej Qhib Kev Sib Koom Tes Pod (FOUP) yog lub thawv tseem ceeb siv los tiv thaiv, thauj, thiab khaws cia wafers. Nws sab hauv tuaj yeem ua tau 25 daim ntawm 300mm wafers, thiab nws cov khoom tseem ceeb suav nrog lub thawv qhib rau pem hauv ntej thiab lub qhov rooj rau qhov rooj qhib thiab kaw. FOUP yog ib qho tseem ceeb ntawm cov cab kuj nyob rau hauv lub tsheb thauj mus los tsis pub dhau 12inch wafer fabs. Nws feem ntau yog thauj mus rau hauv lub xeev kaw thiab tsuas yog qhib thaum thawb mus rau cov khoom siv thauj khoom, tso cai rau wafers hloov mus rau hauv cov khoom siv thauj khoom / tshem tawm qhov chaw nres nkoj.
Kev tsim qauv ntawm FOUP yog yoog raws li micro-ib puag ncig yuav tsum tau ua. Nws nta cov qhov nyob rau tom qab rau wafer ntxig, thiab lub hau yog tsim tshwj xeeb kom phim lub clamp ntawm qhov qhib. Wafer-tswj neeg hlau ua haujlwm nyob rau hauv chav kawm 1 huab cua huv, kom ntseeg tau tias cov wafers tsis muaj kab mob thaum sib kis. Tsis tas li ntawd, FOUP tau txav ntawm cov txheej txheem cov cuab yeej los ntawm kev siv cov khoom siv tsis siv neeg (AMHS). Niaj hnub nimno wafer fabs feem ntau siv nyiaj siv ua haujlwm tsheb thauj mus los rau kev thauj mus los, thaum ob peb lub fab qub tuaj yeem siv cov tsheb thauj mus los hauv av (AGVs).
FOUP tsis tsuas yog ua kom muaj kev hloov pauv hloov pauv hloov pauv hloov pauv hloov pauv, tab sis kuj tseem ua haujlwm rau kev khaws cia. Vim muaj ntau yam kev tsim khoom, wafers yuav siv sij hawm ntau lub hlis los ua kom tiav tag nrho cov txheej txheem ntws. Ua ke nrog cov ntim ntau lawm txhua hli, qhov no txhais tau hais tias ntau txhiab tus wafers nyob rau hauv ib lub fab yog tas li nyob rau hauv kev thauj mus los lossis ib ntus cia nyob rau txhua lub sijhawm. Thaum lub sij hawm cia, FOUPs yog ib ntus purged nrog nitrogen los tiv thaiv cov kab mob los ntawm kev tiv tauj cov wafers, ua kom cov txheej txheem ntau lawm huv si thiab txhim khu kev qha.
1. Kev ua haujlwm thiab qhov tseem ceeb ntawm FOUP
Lub luag haujlwm tseem ceeb ntawm FOUP yog los tiv thaiv wafers los ntawm kev poob siab thiab kev sib kis, tshwj xeeb tshaj yog tsis txhob cuam tshuam rau cov txiaj ntsig thaum lub sij hawm hloov. Nws zoo tiv thaiv cov dej noo los ntawm txoj hauv kev xws li roj purging thiab Local Atmosphere Control (LAC), kom ntseeg tau tias cov wafers nyob hauv lub xeev muaj kev nyab xeeb thaum tos cov kauj ruam tom ntej. Nws lub kaw lus kaw thiab tswj tau tso cai tsuas yog cov khoom tsim nyog thiab cov ntsiab lus nkag mus, txo qhov tsis zoo ntawm VOCs, oxygen, thiab noo noo ntawm cov wafers.
Txij li thaum FOUP tau ntim tag nrho nrog 25 wafers tuaj yeem hnyav txog li 9 kilograms, nws txoj kev thauj mus los yuav tsum vam khom rau Kev Siv Khoom Siv Khoom Siv Hluav Taws Xob (AMHS). Txhawm rau pab txhawb qhov no, FOUP yog tsim los nrog ntau yam kev sib txuas ntawm cov phaj sib txuas, pins, thiab qhov, thiab tau nruab nrog RFID cov cim npe hluav taws xob rau kev txheeb xyuas yooj yim thiab kev faib tawm. Qhov kev tuav tswj tsis siv neeg no yuav luag tsis muaj kev ua haujlwm ntawm phau ntawv, txo qis kev ua yuam kev thiab txhim kho kev nyab xeeb thiab raug ntawm cov txheej txheem tsim khoom.
2. Cov qauv thiab kev faib tawm ntawm FOUP
Qhov ntev ntawm FOUP yog kwv yees li 420 hli hauv qhov dav, 335 hli hauv qhov tob, thiab 335 hli hauv qhov siab. Nws cov khoom tseem ceeb muaj xws li: ib sab saum toj OHT (nceb taub hau) rau kev thauj mus los; ib lub qhov rooj pem hauv ntej rau cov khoom siv wafer nkag; sab tes tuav, feem ntau colorcoded kom paub qhov txawv cov txheej txheem nrog ntau theem sib txawv; daim npav cheeb tsam rau muab cov ntawv xov xwm; thiab daim npav RFID hauv qab uas ua haujlwm ua tus cim tshwj xeeb rau FOUP, tso cai rau cov cuab yeej thiab nyiaj siv ua haujlwm hoists kom paub txog nws. Lub hauv paus tseem nruab nrog plaub qhov kev txheeb xyuas thiab qhov chaw rau kev sib txuam nrog cov cuab yeej thiab qhov txawv ntawm cov txheej txheem.
Raws li kev siv, FOUPs tau muab faib ua peb hom: PRD (rau kev tsim khoom), ENG (rau engineering wafers), thiab MON (rau saib wafers). PRD FOUPs tuaj yeem siv rau kev tsim khoom, ENG hom tsim nyog rau R&D lossis kev sim, thiab MON hom tau mob siab rau cov txheej txheem saib xyuas cov kauj ruam xws li CMP thiab DIFF. Nws yog ib qho tseem ceeb uas yuav tsum nco ntsoov tias PRD FOUPs tuaj yeem siv rau ob qho tib si ENG thiab MON lub hom phiaj, thiab hom ENG tuaj yeem siv rau MON, tab sis kev ua haujlwm rov qab ua rau muaj kev pheej hmoo zoo.
Kev faib tawm los ntawm qib sib kis, FOUPs tuaj yeem muab faib ua FE FOUP ( txheej txheem pem hauv ntej, tsis muaj hlau), BE FOUP ( txheej txheem rov qab, muaj hlau), thiab cov tshwj xeeb rau cov txheej txheem hlau tshwj xeeb xws li NI FOUP, CU FOUP, thiab CO FOUP. FOUPs rau cov txheej txheem sib txawv feem ntau txawv ntawm cov xim ntawm sab tes lossis lub qhov rooj vaj huam sib luag. FOUPs los ntawm cov txheej txheem pem hauv ntej-kawg tuaj yeem siv rau hauv cov txheej txheem rov qab kawg, tab sis rov qab-kawg FOUPs yuav tsum tsis txhob siv rau hauv cov txheej txheem pem hauv ntej, vim qhov no yuav ua rau muaj kev phom sij.
Raws li tus neeg nqa khoom tseem ceeb hauv kev tsim khoom semiconductor, FOUP, los ntawm kev ua haujlwm siab thiab kev tswj xyuas nruj, ua kom muaj kev nyab xeeb thiab huv ntawm wafers thaum lub sijhawm tsim khoom, ua rau nws yog ib qho tseem ceeb hauv kev tsim kho tshiab hauv wafer fabs niaj hnub.
Xaus
XKH tau cog lus los muab cov neeg siv khoom nrog kev kho siab heev Front-Opening Unified Pod (FOUP) kev daws teeb meem, nruj me ntsis ua raws li koj cov txheej txheem tshwj xeeb thiab cov khoom siv interface specifications. Kev siv cov khoom siv thev naus laus zis thiab kev tsim cov txheej txheem precision, peb xyuas kom meej tias txhua FOUP cov khoom xa tawm tshwj xeeb airtightness, huv si, thiab txhua yam ruaj khov. Peb pab neeg ua haujlwm muaj kev txawj ntse hauv kev lag luam, muab kev txhawb nqa thoob ntiaj teb-los ntawm kev xaiv kev sab laj thiab kev ua kom zoo rau kev tu thiab tu-ua kom muaj kev sib koom ua ke thiab kev sib koom tes zoo ntawm FOUP thiab koj Cov Khoom Siv Siv Hluav Taws Xob (AMHS) nrog rau cov khoom siv ua haujlwm. Peb tsis tu ncua qhov tseem ceeb ntawm kev nyab xeeb ntawm wafers thiab kev txhim kho cov khoom tsim tawm raws li peb lub hom phiaj tseem ceeb. Los ntawm cov khoom tshiab thiab tag nrho cov kev pabcuam kev pabcuam, peb muab kev lees paub zoo rau koj cov txheej txheem tsim khoom semiconductor, thaum kawg txhawb kev tsim khoom thiab cov khoom lag luam tawm los.
Post lub sij hawm: Sep-08-2025