P-hom SiC wafer 4H/6H-P 3C-N 6 nti tuab 350 μm nrog Primary Flat Orientation
Specification4H/6H-P Hom SiC Composite Substrates Cov lus qhia dav dav
6 nti txoj kab uas hla Silicon Carbide (SiC) Substrate Cov Lus Qhia Tshwj Xeeb
| Qib | Tsis Muaj MPD Ntau LawmQib (Z Qib) | Kev Tsim Khoom TxheemQib (P Qib) | Qib Dummy (D Qib) | ||
| Txoj kab uas hla | 145.5 hli ~ 150.0 hli | ||||
| Qhov tuab | 350 μm ± 25 μm | ||||
| Kev Taw Qhia Wafer | -Offaxis: 2.0°-4.0° mus rau [1120] ± 0.5° rau 4H/6H-P, Ntawm axis:〈111〉± 0.5° rau 3C-N | ||||
| Qhov Ceev ntawm Micropipe | 0 cm-2 | ||||
| Kev tiv taus | p-hom 4H/6H-P | ≤0.1 Ωꞏcm | ≤0.3 Ωꞏcm | ||
| n-hom 3C-N | ≤0.8 mΩꞏcm | ≤1 m Ωꞏcm | |||
| Kev Taw Qhia Tiaj Tus Thawj Coj | 4H/6H-P | -{1010} ± 5.0° | |||
| 3C-N | -{110} ± 5.0° | ||||
| Qhov Ntev Tiaj Tus Thawj | 32.5 hli ± 2.0 hli | ||||
| Qhov Ntev Thib Ob | 18.0 hli ± 2.0 hli | ||||
| Kev Taw Qhia Qib Thib Ob | Silicon tig rau saum: 90° CW. los ntawm Prime tiaj tus ± 5.0° | ||||
| Kev Tshem Tawm Ntug | 3 hli | 6 hli | |||
| LTV/TTV/Hneev nti /Warp | ≤ 2.5 μm / ≤5 μm / ≤ 15 μm / ≤ 30 μm | ≤ 10 μm / ≤ 15 μm / ≤ 25 μm / ≤ 40 μm | |||
| Kev ntxhib | Polish Ra≤1 nm | ||||
| CMP Ra≤0.2 nm | Ra≤0.5 nm | ||||
| Cov Ntxaij Ntug Los Ntawm Lub Teeb Ci Siab | Tsis muaj dab tsi | Qhov ntev tag nrho ≤ 10 hli, ib qho ntev ≤ 2 hli | |||
| Hex Phaj Los Ntawm Lub Teeb Ci Siab | Thaj chaw sib sau ua ke ≤0.05% | Thaj chaw sib sau ua ke ≤0.1% | |||
| Cov Cheeb Tsam Polytype Los Ntawm Lub Teeb Ci Siab | Tsis muaj dab tsi | Thaj chaw sib sau ua ke ≤ 3% | |||
| Cov pa roj carbon uas pom tau | Thaj chaw sib sau ua ke ≤0.05% | Thaj chaw sib sau ua ke ≤3% | |||
| Cov khawb ntawm cov nplaim silicon los ntawm lub teeb ci ntsa iab | Tsis muaj dab tsi | Qhov ntev tag nrho ≤1 × txoj kab uas hla wafer | |||
| Ntug Chips Siab Los Ntawm Lub Teeb Ci | Tsis pub ≥0.2 hli dav thiab tob | 5 tso cai, ≤1 hli txhua | |||
| Kev Ua Rau Silicon Nto Paug Los Ntawm Kev Siv Siab | Tsis muaj dab tsi | ||||
| Ntim Khoom | Multi-wafer Cassette los yog Single Wafer Thawv | ||||
Cov Lus Cim:
※ Cov kev txwv tsis zoo siv rau tag nrho cov nplaim wafer tshwj tsis yog thaj chaw tsis suav nrog ntug. # Cov khawb yuav tsum tau kuaj xyuas ntawm Si ntsej muag o
Lub P-hom SiC wafer, 4H/6H-P 3C-N, nrog nws qhov loj 6-nti thiab 350 μm tuab, ua lub luag haujlwm tseem ceeb hauv kev tsim khoom siv hluav taws xob muaj zog siab. Nws cov thermal conductivity zoo heev thiab lub zog tawg siab ua rau nws zoo tagnrho rau kev tsim cov khoom xws li cov hloov hluav taws xob, diodes, thiab transistors siv rau hauv qhov chaw kub siab xws li tsheb fais fab, cov hluav taws xob grids, thiab cov tshuab hluav taws xob rov ua dua tshiab. Lub peev xwm ntawm lub wafer los ua haujlwm tau zoo hauv cov xwm txheej hnyav ua kom muaj kev ua tau zoo hauv kev siv hauv kev lag luam uas xav tau lub zog ceev thiab kev siv hluav taws xob zoo. Tsis tas li ntawd, nws qhov kev taw qhia tiaj tus tseem ceeb pab txhawb kev sib phim meej thaum lub sijhawm tsim khoom siv, txhim kho kev ua haujlwm zoo thiab kev sib xws ntawm cov khoom.
Cov txiaj ntsig ntawm N-hom SiC composite substrates suav nrog
- Kev Ua Haujlwm Thermal Siab: P-hom SiC wafers ua kom cua sov tawm tau zoo, ua rau lawv zoo tagnrho rau kev siv kub siab.
- Lub zog tawg siab: Muaj peev xwm tiv taus cov hluav taws xob siab, ua kom ntseeg tau tias muaj kev ntseeg siab hauv cov khoom siv hluav taws xob thiab cov khoom siv hluav taws xob siab.
- Kev Tiv Thaiv Rau Qhov Chaw Nyuaj Siab: Ua tau zoo heev nyob rau hauv cov xwm txheej hnyav, xws li kub thiab kub ib puag ncig corrosive.
- Kev Hloov Pauv Fais Fab Zoo: Qhov P-hom doping ua rau kev tswj hwm lub zog zoo, ua rau lub wafer haum rau cov txheej txheem hloov pauv zog.
- Kev Taw Qhia Tiaj Tus Thawj Coj: Xyuas kom meej tias qhov sib dhos thaum lub sijhawm tsim khoom, txhim kho qhov tseeb ntawm cov khoom siv thiab kev sib xws.
- Cov Qauv Nyias (350 μm): Qhov tuab zoo tshaj plaws ntawm wafer txhawb kev koom ua ke rau hauv cov khoom siv hluav taws xob siab heev, qhov chaw txwv.
Zuag qhia tag nrho, P-hom SiC wafer, 4H/6H-P 3C-N, muaj ntau yam zoo uas ua rau nws tsim nyog rau kev siv hauv kev lag luam thiab hluav taws xob. Nws cov thermal conductivity siab thiab lub zog tawg ua rau kev ua haujlwm txhim khu kev qha hauv qhov kub thiab txias siab, thaum nws txoj kev tiv thaiv rau cov xwm txheej hnyav ua kom muaj zog. P-hom doping tso cai rau kev hloov pauv hluav taws xob zoo, ua rau nws zoo tagnrho rau cov khoom siv hluav taws xob thiab cov tshuab hluav taws xob. Tsis tas li ntawd, lub wafer thawj qhov kev taw qhia tiaj tus ua kom muaj kev sib dhos meej thaum lub sijhawm tsim khoom, txhim kho kev tsim khoom sib xws. Nrog rau qhov tuab ntawm 350 μm, nws zoo rau kev koom ua ke rau hauv cov khoom siv siab heev, compact.
Daim duab qhia ntxaws ntxaws
