Silicon carbide pob zeb diamond hlau txiav tshuab 4/6/8/12 nti SiC ingot ua tiav

Kev Piav Qhia Luv:

Lub tshuab txiav hlau pob zeb diamond silicon carbide yog ib hom khoom siv ua tiav siab uas siv rau kev txiav silicon carbide (SiC) ingot, siv cov thev naus laus zis Diamond Wire Saw, los ntawm kev txav mus los ntawm cov hlau pob zeb diamond ceev (kab txoj kab uas hla 0.1 ~ 0.3 hli) mus rau SiC ingot ntau-hlau txiav, kom ua tiav kev npaj wafer siab, kev puas tsuaj tsawg. Cov khoom siv no siv dav hauv SiC fais fab semiconductor (MOSFET / SBD), lub cuab yeej siv zaus xov tooj cua (GaN-on-SiC) thiab cov khoom siv optoelectronic, yog cov khoom siv tseem ceeb hauv SiC kev lag luam saw.


Cov yam ntxwv

Txoj cai ua haujlwm:

1. Kev kho cov ingot: SiC ingot (4H/6H-SiC) raug kho rau ntawm lub platform txiav los ntawm lub fixture kom ntseeg tau tias qhov chaw raug (± 0.02 hli).

2. Kev txav ntawm kab pob zeb diamond: kab pob zeb diamond (cov pob zeb diamond electroplated ntawm qhov chaw) yog tsav los ntawm lub log qhia kev rau kev ncig ceev ceev (kab ceev 10 ~ 30m / s).

3. Kev pub txiav: cov ingot raug pub raws li qhov kev taw qhia, thiab kab pob zeb diamond raug txiav tib lub sijhawm nrog ntau kab sib luag (100 ~ 500 kab) los tsim ntau lub wafers.

4. Kev txias thiab tshem tawm cov chips: Txau cov dej txias (dej deionized + cov khoom ntxiv) rau hauv thaj chaw txiav kom txo qhov puas tsuaj los ntawm cua sov thiab tshem tawm cov chips.

Cov Ntsiab Lus Tseem Ceeb:

1. Kev txiav ceev: 0.2 ~ 1.0 hli / feeb (nyob ntawm qhov kev taw qhia siv lead ua thiab tuab ntawm SiC).

2. Kev nruj ntawm kab: 20 ~ 50N (siab dhau yooj yim tawg kab, qis dhau cuam tshuam rau kev txiav qhov tseeb).

3. Wafer tuab: tus qauv 350 ~ 500μm, wafer tuaj yeem ncav cuag 100μm.

Cov yam ntxwv tseem ceeb:

(1) Kev txiav qhov tseeb
Kev kam rau tuab: ± 5μm (@ 350μm wafer), zoo dua li kev txiav mortar ib txwm muaj (± 20μm).

Qhov roughness ntawm qhov chaw: Ra <0.5μm (tsis tas yuav sib tsoo ntxiv kom txo tau qhov ua tiav tom qab).

Warpage: <10μm (txo qhov nyuaj ntawm kev txhuam tom qab).

(2) Kev ua haujlwm zoo
Kev txiav ntau kab: txiav 100 ~ 500 daim ib zaug, nce peev xwm tsim khoom 3 ~ 5 zaug (piv rau kev txiav ib kab).

Lub neej ntawm kab: Cov kab pob zeb diamond tuaj yeem txiav 100 ~ 300km SiC (nyob ntawm qhov nyuaj ntawm cov ingot thiab kev ua kom zoo dua).

(3) Kev ua puas tsuaj tsawg
Ntug tawg: <15μm (txiav ib txwm> 50μm), txhim kho cov wafer yield.

Cov txheej txheem puas tsuaj hauv qab: <5μm (txo kev tshem tawm polishing).

(4) Kev tiv thaiv ib puag ncig thiab kev lag luam
Tsis muaj kev ua qias tuaj ntawm cov av nplaum: Txo cov nqi pov tseg cov kua dej pov tseg piv rau kev txiav cov av nplaum.

Kev siv cov khoom siv: Kev txiav poob <100μm / cutter, txuag SiC raw cov ntaub ntawv.

Kev txiav cov nyhuv:

1. Qhov zoo ntawm cov wafer: tsis muaj qhov tawg loj heev ntawm qhov chaw, muaj ob peb qhov tsis zoo me me (qhov txuas ntxiv ntawm qhov chaw tsis tuaj yeem tswj tau). Tuaj yeem nkag mus rau qhov txuas polishing ncaj qha, ua kom cov txheej txheem luv dua.

2. Kev sib xws: qhov sib txawv ntawm cov wafer hauv cov pawg yog <± 3%, tsim nyog rau kev tsim khoom tsis siv neeg.

3. Kev Siv Tau: Txhawb 4H / 6H-SiC ingot txiav, sib xws nrog conductive / semi-insulated hom.

Kev qhia tshwj xeeb:

Cov Lus Qhia Tshwj Xeeb Cov ntsiab lus
Qhov Loj (L × W × H) 2500x2300x2500 los yog hloov kho
Ua cov khoom siv loj npaum li cas 4, 6, 8, 10, 12 nti ntawm silicon carbide
Qhov ntxhib ntawm qhov chaw Ra≤0.3u
Qhov nruab nrab ntawm kev txiav ceev 0.3 hli/feeb
Qhov hnyav 5.5t
Cov kauj ruam teeb tsa cov txheej txheem txiav ≤30 kauj ruam
Cov khoom siv suab nrov ≤80 dB
Kev nruj ntawm cov hlau hlau 0 ~ 110N (0.25 hlau nro yog 45N)
Kev ceev ntawm cov hlau hlau 0 ~ 30m / S
Tag nrho lub zog 50kw
Txoj kab uas hla ntawm pob zeb diamond ≥0.18 hli
Qhov kawg tiaj tiaj ≤0.05 hli
Kev txiav thiab tawg tus nqi ≤1% (tshwj tsis yog vim tib neeg yog vim li cas, cov khoom siv silicon, kab, kev saib xyuas thiab lwm yam laj thawj)

 

Cov Kev Pabcuam XKH:

XKH muab kev pabcuam tag nrho rau kev siv lub tshuab txiav hlau pob zeb diamond silicon carbide, suav nrog kev xaiv cov khoom siv (hlau txoj kab uas hla / hlau ceev sib phim), kev tsim cov txheej txheem (kev ua kom zoo dua ntawm kev txiav), kev muab khoom siv (hlau pob zeb diamond, lub log qhia) thiab kev txhawb nqa tom qab muag (kev saib xyuas cov khoom siv, kev tshuaj xyuas qhov zoo ntawm kev txiav), los pab cov neeg siv khoom ua tiav cov txiaj ntsig siab (> 95%), kev tsim khoom loj SiC wafer pheej yig. Nws kuj tseem muaj kev hloov kho tshwj xeeb (xws li kev txiav nyias heev, kev thauj khoom thiab tshem tawm tsis siv neeg) nrog lub sijhawm ua tiav 4-8 lub lis piam.

Daim duab qhia ntxaws ntxaws

Silicon carbide pob zeb diamond hlau txiav tshuab 3
Silicon carbide pob zeb diamond hlau txiav tshuab 4
SIC cutter 1

  • Yav dhau los:
  • Tom ntej no:

  • Sau koj cov lus ntawm no thiab xa tuaj rau peb