TGV Iav substrates 12 nti wafer Iav xuas nrig ntaus

Cov khoom siv iav ua tau zoo dua ntawm cov khoom thermal, kev ruaj khov ntawm lub cev, thiab tiv taus cua sov ntau dua thiab tsis tshua muaj teeb meem warping lossis deformation vim qhov kub siab;

Ntxiv mus, cov khoom siv hluav taws xob tshwj xeeb ntawm lub iav tseem ceeb ua rau muaj kev poob dielectric qis dua, ua rau lub teeb liab thiab kev xa hluav taws xob meej dua. Yog li ntawd, kev poob hluav taws xob thaum lub sijhawm xa hluav taws xob raug txo qis thiab kev ua haujlwm zoo ntawm lub nti tau nce ntxiv. Qhov tuab ntawm lub iav tseem ceeb substrate tuaj yeem txo qis li ib nrab piv rau ABF yas, thiab qhov kev nyias nyias ua rau kev xa hluav taws xob ceev thiab kev siv hluav taws xob zoo dua.

Kev siv tshuab ua qhov ntawm TGV:

Txoj kev siv laser etching los ua kom lub cheeb tsam denaturation txuas ntxiv mus los ntawm pulsed laser, thiab tom qab ntawd cov iav kho laser raug muab tso rau hauv cov kua hydrofluoric acid rau etching. Tus nqi etching ntawm denaturation cheeb tsam iav hauv hydrofluoric acid yog sai dua li ntawm cov iav tsis denataturated los tsim los ntawm qhov.

TGV sau:

Ua ntej, cov qhov muag tsis pom ntawm TGV raug ua. Qhov thib ob, cov noob txheej tau muab tso rau hauv cov qhov muag tsis pom ntawm TGV los ntawm kev siv lub cev ua pa (PVD). Qhov thib peb, kev siv hluav taws xob hauv qab mus rau saum toj ua rau TGV puv tsis muaj qhov puas tsuaj; Thaum kawg, los ntawm kev sib txuas ib ntus, sib tsoo rov qab, kev siv tshuaj lom neeg kho tshuab (CMP) kev siv tooj liab, kev tshem tawm cov hlau, thiab tsim cov phaj hloov pauv TGV uas muaj hlau puv.