TGV Los Ntawm Iav Los Ntawm Iav BF33 Quartz JGS1 JGS2 Sapphire Khoom Siv

Kev Piav Qhia Luv:

Lub Npe Khoom Siv	Lub Npe Suav
BF33 Iav	BF33 Borosilicate Iav
Quartz	Fused Quartz
JGS1	JGS1 Fused Silica
JGS2	JGS2 Fused Silica
Sapphire	Sapphire (Ib Leeg Crystal Al₂O₃)

Xa email rau peb

Cov yam ntxwv

Kev Taw Qhia Txog Khoom TGV

Peb cov kev daws teeb meem TGV (Through Glass Via) muaj nyob rau hauv ntau yam khoom siv zoo xws li BF33 borosilicate iav, fused quartz, JGS1 thiab JGS2 fused silica, thiab sapphire (single crystal Al₂O₃). Cov ntaub ntawv no raug xaiv rau lawv cov khoom siv optical, thermal, thiab mechanical zoo heev, ua rau lawv yog cov khoom siv zoo tshaj plaws rau kev ntim khoom semiconductor siab heev, MEMS, optoelectronics, thiab microfluidic applications. Peb muab kev ua tiav precision kom tau raws li koj qhov kev ntsuas via thiab cov kev xav tau metallization.

Cov Khoom Siv thiab Cov Khoom ntawm TGV

Khoom siv	Hom	Cov Khoom Ib Txwm Muaj
BF33	Borosilicate Iav	CTE qis, thermal stability zoo, yooj yim rau tho thiab txhuam
Quartz	Cov Silica Fused (SiO₂)	CTE qis heev, pob tshab siab, rwb thaiv hluav taws xob zoo heev
JGS1	Kho qhov muag Quartz iav	Kev sib kis tau zoo los ntawm UV mus rau NIR, tsis muaj npuas, purity siab
JGS2	Kho qhov muag Quartz iav	Zoo ib yam li JGS1, tso cai rau cov npuas tsawg kawg nkaus
Sapphire	Ib Leeg Crystal Al₂O₃	Kev ua kom muaj zog, kev ua kom sov siab, kev rwb thaiv tsev RF zoo heev

Daim ntawv thov TGV

Cov Ntawv Thov TGV:
Cov thev naus laus zis Through Glass Via (TGV) siv dav hauv cov khoom siv microelectronics thiab optoelectronics. Cov ntawv thov feem ntau suav nrog:

3D IC thiab wafer-level ntim khoom— ua kom muaj kev sib txuas hluav taws xob ntsug los ntawm cov iav substrates rau kev sib koom ua ke compact, high-density.
Cov khoom siv MEMS— muab cov iav hermetic interposers nrog through-vias rau cov sensors thiab actuators.
Cov Cheebtsam RF & cov modules antenna— siv qhov poob dielectric qis ntawm iav rau kev ua haujlwm siab.
Kev koom ua ke ntawm Optoelectronic— xws li cov micro-lens arrays thiab photonic circuits uas xav tau cov substrates pob tshab, insulating.
Cov microfluidic chips— suav nrog cov qhov hla mus rau cov kav dej thiab kev nkag mus rau hluav taws xob.

Txog XINKEHUI

Shanghai Xinkehui New Material Co., Ltd. yog ib lub tuam txhab muag khoom siv kho qhov muag thiab semiconductor loj tshaj plaws hauv Suav teb, tau tsim tsa xyoo 2002. Ntawm XKH, peb muaj pab pawg R&D muaj zog uas muaj cov kws tshawb fawb thiab cov engineers uas muaj kev paub dhau los uas mob siab rau kev tshawb fawb thiab kev txhim kho cov khoom siv hluav taws xob siab heev.

Peb pab neeg mob siab rau cov haujlwm tshiab xws li TGV (Through Glass Via) thev naus laus zis, muab cov kev daws teeb meem rau ntau yam kev siv semiconductor thiab photonic. Siv peb cov kev txawj ntse, peb txhawb nqa cov kws tshawb fawb kev kawm thiab cov neeg koom tes hauv kev lag luam thoob ntiaj teb nrog cov wafers zoo, substrates, thiab kev ua iav precision.

Cov Neeg Koom Tes Thoob Ntiaj Teb

Nrog peb cov kev txawj ntse ntawm cov khoom siv semiconductor siab heev, XINKEHUI tau tsim kev koom tes dav dav thoob plaws ntiaj teb. Peb zoo siab koom tes nrog cov tuam txhab ua lag luam thoob ntiaj teb xws liCorningthiabSchott Iav, uas tso cai rau peb txuas ntxiv txhim kho peb cov peev xwm kev txawj ntse thiab tsav tsheb tsim kho tshiab hauv cov chaw xws li TGV (Through Glass Via), hluav taws xob hluav taws xob, thiab cov khoom siv optoelectronic.

Los ntawm cov kev koom tes thoob ntiaj teb no, peb tsis yog tsuas yog txhawb nqa cov ntawv thov kev lag luam tshiab xwb tab sis kuj koom nrog cov haujlwm tsim kho ua ke uas thawb cov ciam teb ntawm cov khoom siv thev naus laus zis. Los ntawm kev ua haujlwm ze nrog cov neeg koom tes no, XINKEHUI ua kom peb nyob twj ywm ntawm pem hauv ntej ntawm kev lag luam semiconductor thiab kev lag luam hluav taws xob siab heev.