Cov Txheej Txheem Txheej Txheem ntawm Nyias Zaj Duab Xis Cov Txheej Txheem: MOCVD, Magnetron Sputtering, thiab PECVD

Hauv kev tsim khoom semiconductor, thaum photolithography thiab etching yog cov txheej txheem nquag hais, cov txheej txheem epitaxial lossis nyias zaj duab xis tso tawm yog qhov tseem ceeb sib npaug. Tsab ntawv xov xwm no qhia txog ntau yam txheej txheem nyias zaj duab xis tso tawm siv hauv chip fabrication, suav nrogMOCVD, magnetron sputtering, thiabPECVD.

Vim li cas Nyias Film Processes tseem ceeb hauv Chip Manufacturing?

Ua piv txwv, xav txog ib qho yooj yim ci flatbread. Ntawm nws tus kheej, nws yuav saj bland. Txawm li cas los xij, los ntawm txhuam qhov chaw nrog cov kua ntses sib txawv - zoo li cov taum savory paste lossis qab zib malt syrup - koj tuaj yeem hloov nws qhov tsw. Cov tsw-txhim xim txheej no zoo ib yam linyias zaj duab xisnyob rau hauv cov txheej txheem semiconductor, thaum lub flatbread nws tus kheej sawv cev rausubstrate.

Hauv chip fabrication, nyias zaj duab xis ua haujlwm ntau lub luag haujlwm - rwb thaiv tsev, conductivity, passivation, lub teeb nqus, thiab lwm yam - thiab txhua txoj haujlwm yuav tsum muaj cov txheej txheem tshwj xeeb.

1. Hlau-Organic Chemical Vapor Deposition (MOCVD)

MOCVD yog cov txheej txheem siab heev thiab meej siv rau kev tso tawm ntawm cov khoom siv hluav taws xob zoo semiconductor nyias zaj duab xis thiab nanostructures. Nws ua lub luag haujlwm tseem ceeb hauv kev tsim cov khoom siv xws li LEDs, lasers, thiab hluav taws xob hluav taws xob.

Cov Cheebtsam tseem ceeb ntawm MOCVD System:

• Gas Delivery System
  Lub luag haujlwm rau kev qhia meej ntawm cov reactants rau hauv cov tshuaj tiv thaiv chamber. Qhov no suav nrog kev tswj dej ntws ntawm:

• Cov pa roj carbon monoxide

• Hlau-organic precursors

• Hydride gases
  Lub kaw lus nta ntau txoj kev li qub rau kev hloov ntawm txoj kev loj hlob thiab kev tshem tawm hom.

• Teb Chamber
  Lub plawv ntawm qhov system uas qhov kev loj hlob ntawm cov khoom siv tiag tiag tshwm sim. Cov khoom xyaw muaj xws li:

  • Graphite susceptor (substrate yas dhos)

  • Kub thiab kub sensors

  • Optical ports rau kev saib xyuas hauv tsev

  • Robotic caj npab rau automated wafer loading / unloading

• Growth Control System
  Nws muaj cov programmable logic controllers thiab ib lub computer host. Cov no ua kom muaj kev saib xyuas meej thiab rov ua dua thaum lub sijhawm tso nyiaj.

• Kev Saib Xyuas Hauv Tsev
  Cov cuab yeej xws li pyrometers thiab reflectometers ntsuas:

  • Zaj duab xis thickness

  • Qhov kub thiab txias

  • Substrate curvature
    Cov no ua rau muaj kev tawm tswv yim thiab hloov kho lub sijhawm tiag tiag.

• Exhaust Treatment System
  Kho tshuaj lom byproducts siv thermal decomposition lossis tshuaj catalysis kom muaj kev nyab xeeb thiab kev ua raws li ib puag ncig.

Closed-Coupled Showerhead (CCS) Configuration:

Nyob rau hauv ntsug MOCVD reactors, CCS tsim tso cai rau cov pa roj carbon monoxide txhaj los ntawm kev sib hloov nozzles hauv cov qauv da dej. Qhov no txo ​​qis qhov tshwm sim ntxov ntxov thiab txhim kho kev sib xyaw ua ke.

• Covrotating graphite susceptorntxiv pab homogenize ciam txheej ntawm gases, txhim kho zaj duab xis uniformity thoob plaws lub wafer.

2. Magnetron Sputtering

Magnetron sputtering yog lub cev vapor deposition (PVD) txoj kev siv dav rau kev tso cov yeeb yaj kiab thiab txheej txheej, tshwj xeeb tshaj yog hauv electronics, optics, thiab ceramics.

Txoj Cai Ua Haujlwm:

1. Lub hom phiaj khoom
   Cov khoom siv uas yuav tsum tau tso - hlau, oxide, nitride, thiab lwm yam - yog tsau rau ntawm lub cathode.

2. Nqus Chamber
   Cov txheej txheem yog ua nyob rau hauv lub tshuab nqus tsev siab kom tsis txhob muaj kab mob.

3. Plasma tiam
   Ib qho roj inert, feem ntau argon, yog ionized los tsim cov ntshav.

4. Magnetic Field Application
   Ib qho chaw sib nqus kaw cov electrons nyob ze ntawm lub hom phiaj txhawm rau txhim kho ionization efficiency.

5. Sputtering txheej txheem
   Ions bombard lub hom phiaj, dislodging atoms uas taug kev los ntawm lub chamber thiab tso rau hauv lub substrate.

Qhov zoo ntawm Magnetron Sputtering:

• Uniform Film Depositionhla thaj chaw loj.

• Muaj peev xwm mus Deposit Complex Compounds, suav nrog alloys thiab ceramics.

• Tunable Process Parametersrau kev tswj cov thickness, muaj pes tsawg leeg, thiab microstructure.

• High Film Qualitynrog muaj zog adhesion thiab mechanical zog.

• Broad Material Compatibility, los ntawm hlau mus rau oxides thiab nitrides.

• Kev ua haujlwm kub qis, haum rau kub-sensitive substrates.

3. Plasma-Enhanced Chemical Vapor Deposition (PECVD)

PECVD yog dav siv rau kev tso tawm ntawm cov yeeb yaj kiab nyias xws li silicon nitride (SiNx), silicon dioxide (SiO₂), thiab amorphous silicon.

Txoj Cai:

Hauv PECVD system, cov pa roj ua ntej tau nkag mus rau hauv lub tshuab nqus tsev qhov twg aglow tawm plasmayog generated siv:

• RF kev xav

• DC siab voltage

• Microwave los yog pulsed qhov chaw

Lub plasma activates lub gas-phase cov tshuaj tiv thaiv, tsim cov reactive hom uas tso rau ntawm lub substrate los ua ib tug nyias zaj duab xis.

Cov kauj ruam tso nyiaj:

1. Plasma Tsim
   Zoo siab los ntawm electromagnetic teb, precursor gases ionize tsim reactive radicals thiab ions.

2. Cov tshuaj tiv thaiv thiab thauj
   Cov tsiaj no muaj kev cuam tshuam theem nrab thaum lawv txav mus rau lub substrate.

3. Nto Reaction
   Thaum ncav cuag lub substrate, lawv adsorb, react, thiab tsim ib tug zoo zaj duab xis. Qee cov khoom lag luam raug tso tawm raws li cov pa roj.

PECVD Cov txiaj ntsig:

• Uniformity zoo heevnyob rau hauv zaj duab xis muaj pes tsawg leeg thiab thickness.

• Muaj zog Adhesiontxawm nyob rau qhov kub thiab txias.

• High Deposition Rate, ua rau nws haum rau industrial-scale ntau lawm.

4. Thin Film Characterization Techniques

Kev nkag siab txog cov khoom ntawm cov yeeb yaj kiab nyias yog qhov tseem ceeb rau kev tswj kom zoo. Cov txheej txheem muaj xws li:

(1) X-ray Diffraction (XRD)

• Lub hom phiaj: Txheeb xyuas cov qauv siv lead ua, lattice tas li, thiab kev taw qhia.

• Txoj Cai: Raws li Bragg Txoj Cai, ntsuas seb X-rays cuam tshuam li cas los ntawm cov khoom siv crystalline.

• Daim ntawv thov: Crystallography, theem tsom xam, strain ntsuas, thiab nyias zaj duab xis ntsuam xyuas.

(2) Scanning Electron Microscopy (SEM)

• Lub hom phiaj: Saib xyuas qhov chaw morphology thiab microstructure.

• Txoj Cai: Siv lub teeb hluav taws xob los soj ntsuam cov qauv saum npoo. Nthuav cov teeb liab (xws li, theem nrab thiab backscattered electrons) qhia cov ntsiab lus saum npoo.

• Daim ntawv thov: Cov ntaub ntawv tshawb fawb, nanotech, biology, thiab tsis ua hauj lwm tsom xam.

(3) Atomic Force Microscopy (AFM)

• Lub hom phiaj: Duab nto ntawm atomic los yog nanometer daws teeb meem.

• Txoj Cai: Ib qho kev sojntsuam ntse scans qhov chaw thaum tswj kev sib cuam tshuam tas li; Vertical displacements tsim 3D topography.

• Daim ntawv thov: Kev tshawb fawb nanostructure, kev ntsuas qhov roughness, kev tshawb fawb biomolecular.