Txij li thaum xyoo 1980s, kev sib koom ua ke ntawm cov hluav taws xob hluav taws xob tau nce zuj zus ntawm tus nqi txhua xyoo ntawm 1.5 × lossis sai dua. Kev sib xyaw ua ke siab dua ua rau muaj qhov ceev dua tam sim no thiab tsim hluav taws xob thaum ua haujlwm.Yog hais tias tsis dissipated zoo, qhov cua sov no tuaj yeem ua rau thermal tsis ua haujlwm thiab txo lub neej ntawm cov khoom siv hluav taws xob.
Txhawm rau kom ua tau raws li qhov xav tau ntawm kev tswj hwm thermal, cov khoom ntim khoom siv hluav taws xob zoo tshaj plaws nrog cov thermal conductivity zoo dua tau raug tshawb fawb thiab ua kom zoo dua qub.
Pob zeb diamond / tooj liab composite khoom
01 Pob zeb diamond thiab tooj liab
Cov khoom ntim khoom suav nrog ceramics, plastics, hlau, thiab lawv cov alloys. Ceramics zoo li BeO thiab AlN nthuav tawm CTEs txuam nrog cov khoom siv hluav taws xob, kev ruaj ntseg tshuaj zoo, thiab cov thermal conductivity tsawg. Txawm li cas los xij, lawv txoj kev ua haujlwm nyuaj, tus nqi siab (tshwj xeeb tshaj yog tshuaj lom BeO), thiab kev txwv kev txwv tsis pub siv. Cov hnab yas ntim khoom muaj tus nqi qis, lub teeb yuag, thiab rwb thaiv tsev tab sis raug kev txom nyem los ntawm cov thermal conductivity tsis zoo thiab kub tsis ruaj khov. Cov hlau ntshiab (Cu, Ag, Al) muaj cov thermal conductivity tab sis ntau dhau CTE, thaum alloys (Cu-W, Cu-Mo) cuam tshuam kev ua haujlwm thermal. Yog li, cov khoom ntim tshiab sib npaug ntawm cov thermal conductivity thiab kev pom zoo CTE yog qhov xav tau sai.
| Kev txhawb zog | Thermal conductivity (W / (m·K)) | CTE (× 10⁻⁶ / ℃) | Qhov ceev (g / cm³) |
| Pob zeb diamond | 700-2000 Nws | 0.9–1.7 Nws | 3.52 ib |
| BeO cov khoom | 300 | 4.1 | 3.01 Nws |
| AlN hais | 150–250 : kuv | 2.69 ib | 3.26 |
| SiC particles | 80–200 | 4.0 | 3.21 |
| B₄C particles | 29–67 : kuv | 4.4 | 2.52 ib |
| Boron fiber ntau | 40 | ~ 5.0 | 2.6 |
| TiC particles | 40 | 7.4 ib | 4.92 ib |
| Al₂O₃ particles | 20–40 : kuv | 4.4 | 3.98 ib |
| SiC cov plaub hau | 32 | 3.4 | - |
| Si₃N₄ particles | 28 | 1.44 ib | 3.18 |
| TiB₂ particles | 25 | 4.6 | 4.5 |
| SiO₂ particles | 1.4 | <1.0 | 2.65 ib |
Pob zeb diamond, qhov nyuaj tshaj plaws paub cov khoom siv (Mohs 10), kuj muaj qhov tshwj xeebthermal conductivity (200-2200 W / (m·K)).
Pob zeb diamond micro hmoov
Tooj, nrog siab thermal / hluav taws xob conductivity (401 W / (m·K)), ductility, thiab nqi efficiency, yog dav siv nyob rau hauv ICs.
Combining cov khoom no,Pob zeb diamond / tooj liab (Dia / Cu) composites-nrog Cu raws li cov matrix thiab pob zeb diamond raws li kev txhawb nqa - tau tshwm sim los ua cov khoom siv hluav taws xob txuas ntxiv mus.
02 Cov Txheej Txheem Tseem Ceeb
Cov txheej txheem kev npaj pob zeb diamond / tooj liab muaj xws li: hmoov metallurgy, high-temperature thiab high-pressure method, yaj immersion method, discharge plasma sintering method, txias spraying method, etc.
Kev sib piv ntawm cov kev npaj sib txawv, cov txheej txheem thiab cov khoom ntawm ib qho me me pob zeb diamond / tooj liab composites
| Parameter | Hmoov metallurgy | Nqus Kub-Nias | Spark Plasma Sintering (SPS) | High-Pressure High-Temperature (HPHT) | Txias Txias Deposition | Melt Infiltration |
| Hom Pob Zeb Diamond | MBD 8 | HFD-D | MBD 8 | MBD4 | PDA | MBD8/HHD |
| Matrix | 99.8% Cu hmoov | 99.9% electrolytic Cu hmoov | 99.9% Cu hmoov | Alloy / ntshiab Cu hmoov | Ntshiab Cu hmoov | Ntshiab Cu bulk/rod |
| Kev hloov kho interface | - | - | - | B, Ti, Si, Cr, Zr, W, Mo | - | - |
| Particle Loj (μm) | 100 | 106–125 : kuv | 100-400 | 20–200 | 35–200 : kuv | 50–400 |
| Volume Fraction (%) | 20–60 : kuv | 40–60 : kuv | 35–60 : kuv | 60–90 : kuv | 20–40 : kuv | 60–65 : kuv |
| Qhov kub thiab txias (°C) | 900 | 800-1050 Nws | 880–950 : kuv | 1100-1300 Nws | 350 | 1100-1300 Nws |
| Siab (MPa) | 110 | 70 | 40–50 : kuv | 8000 | 3 | 1–4 |
| Sijhawm (min) | 60 | 60–180 : kuv | 20 | 6–10 | - | 5–30 |
| Kev txheeb ze ntom ntom (%) | 98.5 ib | 99.2–99.7 Ib | - | - | - | 99.4–99.7 Ib |
| Kev ua tau zoo | ||||||
| Qhov zoo tshaj plaws thermal conductivity (W / (m·K)) | 305 | 536 ib | 687 ib | 907 ib | - | 943 ua |
Cov txheej txheem sib xyaw Dia/Cu muaj xws li:
(1)Hmoov metallurgy
Mixed pob zeb diamond / Cu hmoov yog compacted thiab sintered. Thaum tus nqi-zoo thiab yooj yim, txoj kev no ua rau muaj qhov tsawg tsawg, cov qauv tsis sib xws, thiab cov qauv txwv qhov ntev.
Sintering unit
(1)High-Pressure High-Temperature (HPHT)
Siv ntau lub pob zeb loj, molten Cu infiltrates pob zeb diamond lattices nyob rau hauv huab cua txias, tsim cov khoom sib xyaw ntom ntom. Txawm li cas los xij, HPHT xav tau pwm kim thiab tsis tsim nyog rau kev tsim khoom loj.
Cubic xov
(1)Melt Infiltration
Molten Cu permeates pob zeb diamond preforms ntawm lub siab-pab lossis capillary-tsav infiltration. Cov khoom sib xyaw ua tiav tau> 446 W / (m·K) thermal conductivity.
(2)Spark Plasma Sintering (SPS)
Pulsed tam sim no sai sinters tov hmoov nyob rau hauv siab. Txawm hais tias ua tau zoo, SPS kev ua tau zoo degrades ntawm pob zeb diamond feem> 65 vol%.
Schematic daim duab ntawm cov plasma sintering system
(5) Txias Txias Deposition
Cov hmoov yog nrawm thiab tso rau hauv substrate. Txoj kev nascent no ntsib cov teeb meem hauv kev tswj kom tiav qhov kawg thiab kev ua haujlwm thermal validation.
03 Kev hloov kho interface
Rau kev npaj cov ntaub ntawv sib xyaw, kev sib koom ua ke ntawm cov khoom sib xyaw yog qhov tsim nyog yuav tsum tau ua ua ntej rau cov txheej txheem sib xyaw thiab qhov tseem ceeb cuam tshuam rau cov qauv kev sib txuas thiab kev sib txuas ntawm lub xeev. Qhov tsis ntub dej ntawm qhov sib cuam tshuam ntawm pob zeb diamond thiab Cu ua rau muaj kev cuam tshuam siab heev thermal kuj. Yog li ntawd, nws yog ib qho tseem ceeb heev uas yuav tau ua qhov kev hloov kho kev tshawb fawb ntawm kev sib cuam tshuam ntawm ob los ntawm ntau yam txuj ci. Tam sim no, muaj ob txoj hauv kev los txhim kho qhov teeb meem cuam tshuam ntawm pob zeb diamond thiab Cu matrix: (1) Kev kho deg kho ntawm pob zeb diamond; (2) Alloying kev kho ntawm tooj liab matrix.
Hloov kho schematic daim duab: (a) Direct plating rau saum npoo ntawm pob zeb diamond; (b) Matrix alloying
(1) Kev hloov kho deg ntawm pob zeb diamond
Plating cov ntsiab lus nquag xws li Mo, Ti, W thiab Cr ntawm txheej txheej txheej ntawm lub zog txhawb nqa tuaj yeem txhim kho cov yam ntxwv ntawm lub ntsej muag ntawm pob zeb diamond, yog li txhim kho nws cov thermal conductivity. Sintering tuaj yeem ua rau cov ntsiab lus saum toj no ua rau cov pa roj carbon monoxide nyob rau saum npoo ntawm cov hmoov pob zeb diamond los tsim cov txheej txheem hloov pauv carbide. Qhov no optimizes lub xeev ntub dej ntawm pob zeb diamond thiab hlau puag, thiab cov txheej txheem tuaj yeem tiv thaiv cov qauv ntawm pob zeb diamond los ntawm kev hloov ntawm qhov kub thiab txias.
(2) Alloying ntawm tooj liab matrix
Ua ntej cov khoom sib xyaw ua ke, kev kho ua ntej alloying yog ua los ntawm cov hlau tooj liab, uas tuaj yeem tsim cov ntaub ntawv sib xyaw nrog feem ntau cov thermal conductivity. Doping active ntsiab nyob rau hauv tooj liab matrix yuav tsis tsuas zoo txo lub wetting lub kaum sab xis ntawm pob zeb diamond thiab tooj liab, tab sis kuj tsim ib tug carbide txheej uas yog cov khoom soluble nyob rau hauv tooj liab matrix ntawm lub pob zeb diamond / Cu interface tom qab cov tshuaj tiv thaiv. Nyob rau hauv txoj kev no, feem ntau ntawm cov khoob uas twb muaj lawm ntawm cov khoom siv interface raug hloov kho thiab sau, yog li txhim kho cov thermal conductivity.
04 Xaus
Cov khoom ntim cov khoom lag luam poob qis hauv kev tswj cov cua sov los ntawm cov chips siab heev. Dia/Cu composites, nrog tunable CTE thiab ultrahigh thermal conductivity, sawv cev rau kev hloov pauv rau cov khoom siv hluav taws xob tiam tom ntej.
Raws li lub tuam txhab high-tech koom ua ke kev lag luam thiab kev lag luam, XKH tsom mus rau kev tshawb fawb thiab kev tsim kho thiab tsim cov pob zeb diamond / tooj liab sib xyaw thiab cov khoom siv hlau zoo xws li SiC / Al thiab Gr / Cu, muab cov txheej txheem thermal tswj kev daws teeb meem nrog thermal conductivity ntau dua 900W / (m·K) rau lub zog ntawm cov khoom siv hluav taws xob thiab chaw ntim khoom,
XKH's Pob zeb diamond tooj liab clad laminate composite khoom:
Post lub sij hawm: May-12-2025