Silicon carbide (SiC) tsis yog tsuas yog ib qho thev naus laus zis tseem ceeb rau kev tiv thaiv lub teb chaws xwb tab sis kuj yog ib qho khoom siv tseem ceeb rau kev lag luam tsheb thiab lub zog thoob ntiaj teb. Raws li thawj kauj ruam tseem ceeb hauv kev ua SiC ib leeg-crystal, wafer slicing ncaj qha txiav txim siab qhov zoo ntawm kev nyias thiab polishing tom qab. Cov txheej txheem slicing ib txwm muaj feem ntau qhia txog qhov tawg ntawm qhov chaw thiab hauv qab, ua rau cov nqi tawg ntawm wafer thiab cov nqi tsim khoom nce ntxiv. Yog li ntawd, kev tswj hwm qhov puas tsuaj ntawm qhov chaw yog qhov tseem ceeb rau kev txhim kho kev tsim khoom siv SiC.
Tam sim no, SiC ingot slicing ntsib ob qhov teeb meem loj:
- Kev poob khoom ntau hauv kev txiav ntau hom hlau ib txwm muaj:SiC qhov nyuaj thiab brittleness ua rau nws yooj yim warping thiab tawg thaum txiav, sib tsoo, thiab polishing. Raws li Infineon cov ntaub ntawv, cov pob zeb diamond-resin-bonded multi-wire sawing ib txwm ua tiav tsuas yog 50% kev siv cov khoom siv hauv kev txiav, nrog rau tag nrho cov kev poob ib-wafer ncav cuag ~ 250 μm tom qab polishing, tawm hauv cov khoom siv tsawg kawg nkaus.
- Kev ua haujlwm tsis zoo thiab lub voj voog tsim khoom ntev:Cov ntaub ntawv tsim khoom thoob ntiaj teb qhia tau tias kev tsim 10,000 wafers siv 24-teev txuas ntxiv ntau txoj hlua sawing siv sijhawm ~ 273 hnub. Txoj kev no xav tau cov khoom siv thiab cov khoom siv ntau thaum tsim cov qhov chaw roughness thiab kuab paug (hmoov av, dej khib nyiab).
Txhawm rau daws cov teeb meem no, pab pawg ntawm Xib Fwb Xiu Xiangqian ntawm Nanjing University tau tsim cov khoom siv laser txiav siab rau SiC, siv cov thev naus laus zis laser ceev ceev los txo qhov tsis zoo thiab txhawb kev tsim khoom. Rau 20-hli SiC ingot, cov thev naus laus zis no ob npaug ntawm cov wafer yield piv rau cov hlau sawing ib txwm muaj. Tsis tas li ntawd, cov wafers txiav laser qhia txog kev sib npaug zoo dua geometric, ua rau txo qhov tuab mus rau 200 μm ib wafer thiab nce ntxiv cov zis.
Cov txiaj ntsig tseem ceeb:
- Ua tiav R&D ntawm cov khoom siv prototype loj, tau lees paub rau kev txiav 4–6-nti semi-insulating SiC wafers thiab 6-nti conductive SiC ingots.
- Kev txiav cov ingot 8-nti tab tom raug txheeb xyuas.
- Lub sijhawm txiav luv dua, cov zis txhua xyoo siab dua, thiab >50% kev txhim kho cov qoob loo.
XKH lub SiC substrate ntawm hom 4H-N
Kev Muaj Peev Xwm Ua Lag Luam:
Cov khoom siv no tau npaj los ua qhov kev daws teeb meem tseem ceeb rau 8-nti SiC ingot slicing, tam sim no tswj hwm los ntawm cov khoom xa tuaj ntawm Nyiv nrog cov nqi siab thiab kev txwv kev xa tawm. Kev thov hauv tsev rau cov khoom siv laser slicing / thinning ntau dua 1,000 units, tab sis tsis muaj lwm txoj hauv kev ua los ntawm Suav teb. Nanjing University cov thev naus laus zis muaj nqis loj heev rau kev lag luam thiab lub peev xwm kev lag luam.
Kev sib xws ntawm ntau yam khoom siv:
Dhau ntawm SiC, cov khoom siv txhawb nqa kev ua laser ntawm gallium nitride (GaN), txhuas oxide (Al₂O₃), thiab pob zeb diamond, nthuav dav nws cov ntawv thov kev lag luam.
Los ntawm kev hloov pauv txoj kev ua SiC wafer, qhov kev tsim kho tshiab no daws cov teeb meem tseem ceeb hauv kev tsim khoom semiconductor thaum ua raws li cov qauv thoob ntiaj teb rau cov khoom siv ua tau zoo thiab txuag hluav taws xob.
Xaus lus
Ua ib tug thawj coj hauv kev lag luam hauv kev tsim cov khoom siv silicon carbide (SiC), XKH tshwj xeeb hauv kev muab cov khoom siv SiC loj 2-12-nti (xws li 4H-N/SEMI-hom, 4H/6H/3C-hom) uas tsim los rau cov lag luam loj xws li cov tsheb fais fab tshiab (NEVs), photovoltaic (PV) cia hluav taws xob, thiab 5G kev sib txuas lus. Siv cov thev naus laus zis loj-dimension wafer low-loss slicing thiab cov thev naus laus zis ua tiav siab, peb tau ua tiav kev tsim cov khoom siv 8-nti thiab kev tshawb pom tshiab hauv 12-nti conductive SiC crystal growth technology, txo cov nqi ntawm ib-unit chip. Txij no mus, peb yuav txuas ntxiv mus txhim kho ingot-level laser slicing thiab cov txheej txheem tswj kev ntxhov siab ntse kom tsa 12-nti substrate yield mus rau qib sib tw thoob ntiaj teb, txhawb nqa kev lag luam SiC hauv tebchaws kom tawg cov kev tswj hwm thoob ntiaj teb thiab ua kom cov ntawv thov scalable hauv cov cheeb tsam siab xws li cov chips qib automotive thiab AI server power supplies.
XKH lub SiC substrate ntawm hom 4H-N
Lub sijhawm tshaj tawm: Lub Yim Hli-15-2025