Silicon Wafers vs. Iav Wafers: Dab tsi Yog Peb Qhov Tseeb? Los ntawm Material Essence mus rau txheej txheem-raws li kev daws teeb meem

Txawm hais tias ob qho tib si silicon thiab iav wafers sib koom lub hom phiaj ntawm kev "huv," cov kev cov nyom thiab kev ua tsis tiav lawv ntsib thaum ntxuav yog qhov sib txawv heev. Qhov tsis sib xws no tshwm sim los ntawm cov khoom siv hauv paus thiab cov kev xav tau tshwj xeeb ntawm silicon thiab iav, nrog rau qhov txawv "philosophy" ntawm kev ntxuav uas tau tsav los ntawm lawv cov ntawv thov zaum kawg.

Ua ntej, cia peb qhia meej: Dab tsi yog peb ntxuav? Cov kab mob dab tsi cuam tshuam?

Cov kab mob kis tau tuaj yeem faib ua plaub pawg:

1. Particle Contaminants

   • Plua plav, hlau hais, organic hais, abrasive hais (los ntawm CMP txheej txheem), thiab lwm yam.

   • Cov kab mob no tuaj yeem ua rau cov qauv tsis xws luag, xws li luv luv lossis qhib circuits.

2. Organic Contaminants

   • Xws li photoresist residues, resin additives, tib neeg daim tawv nqaij roj, hnyav residues, thiab lwm yam.

   • Organic contaminants tuaj yeem tsim lub ntsej muag uas cuam tshuam etching lossis ion implantation thiab txo cov adhesion ntawm lwm cov yeeb yaj kiab nyias.

3. Hlau Ion Contaminants

   • Hlau, tooj liab, sodium, potassium, calcium, thiab lwm yam, uas feem ntau yog los ntawm cov khoom siv, tshuaj, thiab kev sib cuag ntawm tib neeg.

   • Hauv cov khoom siv hluav taws xob, cov hlau ions yog "killer" cov kab mob, qhia txog qib zog hauv qhov txwv tsis pub, uas ua rau kom cov dej ntws tawm tam sim no, ua rau lub neej luv luv, thiab ua rau cov khoom siv hluav taws xob puas. Hauv iav, lawv tuaj yeem cuam tshuam qhov zoo thiab adhesion ntawm cov yeeb yaj kiab nyias nyias.

4. Native Oxide Txheej

   • Rau silicon wafers: Ib txheej nyias ntawm silicon dioxide (Native Oxide) ib txwm ua rau saum npoo av. Lub thickness thiab uniformity ntawm no oxide txheej yog ib qho nyuaj rau tswj, thiab nws yuav tsum tau muab tshem tawm tag nrho thaum lub sij hawm tsim cov qauv tseem ceeb xws li rooj vag oxides.

   • Rau iav wafers: iav nws tus kheej yog ib tug silica network qauv, yog li tsis muaj teeb meem ntawm "tshem tawm ib txwm oxide txheej." Txawm li cas los xij, qhov saum npoo yuav raug hloov kho vim muaj kev sib kis, thiab txheej txheej no yuav tsum tau muab tshem tawm.

I. Lub hom phiaj tseem ceeb: Qhov sib txawv ntawm kev ua tau zoo ntawm hluav taws xob thiab lub cev zoo

• Silicon Wafers

  • Lub hom phiaj tseem ceeb ntawm kev ntxuav yog ua kom muaj hluav taws xob ua haujlwm. Cov lus qhia tshwj xeeb feem ntau suav nrog cov lej suav thiab qhov ntau thiab tsawg (piv txwv li, cov khoom ≥0.1μm yuav tsum tau muab tshem tawm kom zoo), hlau ion concentrations (piv txwv li, Fe, Cu yuav tsum tau tswj kom ≤10¹⁰ atoms / cm² lossis qis dua), thiab qib organic residue. Txawm tias cov kab mob microscopic tuaj yeem ua rau luv luv, cov dej xau, lossis tsis ua haujlwm ntawm lub qhov rooj oxide.

• iav Wafers

  • Raws li substrates, cov ntsiab lus tseem ceeb yog lub cev zoo meej thiab tshuaj lom neeg ruaj khov. Cov lus qhia tshwj xeeb tsom rau qib macro-theem xws li qhov tsis muaj khawb, tsis tshem tawm cov stains, thiab kev saib xyuas ntawm qhov qub nto roughness thiab geometry. Lub hom phiaj ntawm kev ntxuav yog feem ntau los xyuas kom pom kev huv thiab zoo adhesion rau cov txheej txheem tom ntej xws li txheej.

II. Khoom Nthuav: Qhov txawv ntawm Crystalline thiab Amorphous

• Silicon

  • Silicon yog cov khoom siv crystalline, thiab nws qhov chaw ib txwm loj hlob ntawm cov khoom tsis sib xws silicon dioxide (SiO₂) oxide txheej. Cov txheej oxide no ua rau muaj kev pheej hmoo rau kev ua haujlwm hluav taws xob thiab yuav tsum tau muab tshem tawm kom huv thiab sib npaug.

• iav

  • iav yog amorphous silica network. Nws cov khoom siv feem ntau zoo sib xws hauv cov txheej txheem ntawm silicon oxide txheej ntawm silicon, uas txhais tau hais tias nws tuaj yeem nrawm nrawm los ntawm hydrofluoric acid (HF) thiab tseem muaj kev cuam tshuam rau cov alkali yaig, ua rau muaj kev nce hauv qhov roughness lossis deformation. Qhov kev sib txawv tseem ceeb no hais tias kev ntxuav silicon wafer tuaj yeem zam lub teeb, tswj etching kom tshem tawm cov kab mob, thaum ntxuav iav wafer yuav tsum tau ua nrog kev saib xyuas hnyav kom tsis txhob ua rau cov khoom siv hauv paus puas.

III. Kev sib piv ntawm kev daws teeb meem

Raws li cov hom phiaj tau hais tseg thiab cov yam ntxwv ntawm cov khoom siv, cov kev daws teeb meem ntawm silicon thiab iav wafers txawv:

• Iav Wafer Cleaning txheej txheem

  • Tam sim no, feem ntau cov iav ua cov nroj tsuag siv cov txheej txheem tu raws li cov khoom siv ntawm cov iav, tso siab rau cov neeg ua haujlwm tsis muaj zog alkaline.

  • Cleaning Agent Yam ntxwv:Cov tshuaj ntxuav tshwj xeeb no feem ntau tsis muaj zog alkaline, nrog pH ntawm 8-9. Lawv feem ntau muaj cov surfactants (piv txwv li, alkyl polyoxyethylene ether), hlau chelating agents (xws li, HEDP), thiab cov organic tu, tsim los emulsify thiab decompose organic paug xws li roj thiab cov ntiv tes, thaum ua kom tsawg corrosive rau iav matrix.

  • Txheej Txheem Flow:Cov txheej txheem tu ib txwm muaj xws li siv cov ntsiab lus tshwj xeeb ntawm cov tshuaj tsis muaj zog alkaline ntxuav ntawm qhov kub ntawm chav tsev kub txog 60 ° C, ua ke nrog kev tu ultrasonic. Tom qab ntxuav, cov wafers tau siv ntau cov kauj ruam yaug nrog dej ntshiab thiab maj mam ziab (xws li, qeeb nqa lossis IPA vapor ziab). Cov txheej txheem no ua tau raws li qhov xav tau ntawm iav wafer kom pom kev huv thiab kev huv huv.

• Silicon Wafer Cleaning txheej txheem

  • Rau kev ua cov khoom siv hluav taws xob, silicon wafers feem ntau dhau los ua tus qauv RCA tu, uas yog ib txoj kev tu kom zoo uas muaj peev xwm daws tau txhua yam kab mob, kom ntseeg tau tias cov khoom siv hluav taws xob ua tau zoo rau cov khoom siv semiconductor tau ntsib.

IV. Thaum Iav Ua Tau Zoo Tshaj "Cleanliness" Standards

Thaum cov iav wafers siv nyob rau hauv daim ntawv thov uas yuav tsum tau stringent particle suav thiab hlau ion theem (xws li, raws li substrates nyob rau hauv semiconductor txheej txheem los yog rau zoo heev nyias zaj duab xis deposition nto), lub intrinsic tu txheej txheem yuav tsis txaus. Nyob rau hauv cov ntaub ntawv no, semiconductor tu cov hauv paus ntsiab lus yuav siv tau, qhia ib tug hloov RCA tu lub tswv yim.

Lub hauv paus ntawm lub tswv yim no yog kom dilute thiab optimize tus txheej txheem RCA txheej txheem tsis tau raws li qhov rhiab ntawm iav:

• Organic Contaminant Tshem Tawm:SPM cov kev daws teeb meem lossis cov dej ozone me me tuaj yeem siv los rhuav tshem cov kab mob organic los ntawm kev muaj zog oxidation.

• Particle Tshem Tawm:Cov tshuaj diluted SC1 siab heev yog ua haujlwm ntawm qhov kub thiab txias thiab lub sijhawm kho luv dua los siv nws cov electrostatic repulsion thiab micro-etching cuam tshuam kom tshem tawm cov khoom, thaum txo qis corrosion ntawm iav.

• Hlau Ion Tshem Tawm:Ib qho tshuaj diluted SC2 los yog yooj yim dilute hydrochloric acid / dilute nitric acid daws yog siv los tshem tawm cov kab mob hlau los ntawm chelation.

• Kev txwv nruj:DHF (di-ammonium fluoride) yuav tsum tau zam kiag li los tiv thaiv corrosion ntawm iav substrate.

Nyob rau hauv tag nrho cov kev hloov kho, combining megasonic technology ho txhim khu kev tshem tawm ntawm nano-sized hais thiab yog softer rau saum npoo.

Xaus

Kev tu cov txheej txheem rau silicon thiab iav wafers yog qhov tshwm sim ntawm kev thim rov qab engineering raws li lawv cov ntawv thov zaum kawg, cov khoom siv, thiab cov yam ntxwv ntawm lub cev thiab tshuaj. Silicon wafer tu nrhiav "atomic-level cleanliness" rau kev ua haujlwm hluav taws xob, thaum lub iav wafer tu tsom mus rau kev ua tiav "zoo meej, tsis muaj kev puas tsuaj" ntawm lub cev. Raws li cov iav wafers tau siv ntau dua hauv cov ntawv siv semiconductor, lawv cov txheej txheem ntxuav yuav inevitably hloov zuj zus tshaj li ib txwm tsis muaj zog alkaline tu, tsim kho kom zoo dua qub, kho cov kev daws teeb meem zoo li cov txheej txheem RCA hloov kom tau raws li cov qauv kev huv huv dua.