8inch SiC Ntau lawm qib wafer 4H-N SiC substrate
Cov lus hauv qab no qhia txog qhov tshwj xeeb ntawm peb 8inch SiC wafers:
| 8 nti N-hom SiC DSP Specs | |||||
| Tus lej | Yam khoom | Chav tsev | Ntau lawm | Kev tshawb fawb | Dummy |
| 1: Parameters | |||||
| 1.1 | polytype | -- | 4H | 4H | 4H |
| 1.2 | nto orientation | ° | <11-20>4 ± 0.5 | <11-20>4 ± 0.5 | <11-20>4 ± 0.5 |
| 2: Hluav taws xob parameter | |||||
| 2.1 | dopant | -- | n-hom Nitrogen | n-hom Nitrogen | n-hom Nitrogen |
| 2.2 | tiv taus | ohm · cm | 0.015 ~ 0.025 hli | 0.01-0.03 Nws | NA |
| 3: Mechanical Parameter | |||||
| 3.1 | txoj kab uas hla | mm | 200 ± 0.2 | 200 ± 0.2 | 200 ± 0.2 |
| 3.2 | tuab | ib m | 500 ± 25 | 500 ± 25 | 500 ± 25 |
| 3.3 | Notch orientation | ° | [1-100] ± 5 | [1-100] ± 5 | [1-100] ± 5 |
| 3.4 | Notch Qhov tob | mm | 1 ~ 1.5 hli | 1 ~ 1.5 hli | 1 ~ 1.5 hli |
| 3.5 | LTV | ib m | ≤5 (10mm * 10mm) | ≤5 (10mm * 10mm) | ≤10 (10mm * 10mm) |
| 3.6 | TTV | ib m | ≤10 | ≤10 | ≤ 15 |
| 3.7 | Hneev | ib m | - 25-25 | -45-45 | -65-65 |
| 3.8 | Warp | ib m | ≤ 30 | ≤ 50 | ≤70 |
| 3.9 | AFM | nm | Ra≤0.2 | Ra≤0.2 | Ra≤0.2 |
| 4: Qauv | |||||
| 4.1 | micropipe ceev | ua/cm2 | ≤ 2 | ≤10 | ≤ 50 |
| 4.2 | cov ntsiab lus hlau | atom/cm2 | ≤1E11 | ≤1E11 | NA |
| 4.3 | TSD | ua/cm2 | ≤500 | ≤1000 | NA |
| 4.4 | BPD | ua/cm2 | ≤2000 | ≤5000 | NA |
| 4.5 | TED | ua/cm2 | ≤7000 | ≤10000 | NA |
| 5.Pem hauv ntej zoo | |||||
| 5.1 | pem hauv ntej | -- | Si | Si | Si |
| 5.2 | nto tiav | -- | Lub ntsej muag CMP | Lub ntsej muag CMP | Lub ntsej muag CMP |
| 5.3 | particle | ua/wafer | ≤100 (qhov loj me ≥0.3μm) | NA | NA |
| 5.4 | khawb | ua/wafer | ≤5, Tag Nrho Ntev ≤200mm | NA | NA |
| 5.5 | Ntug chips/indents/cracks/stains/contamination | -- | Tsis muaj | Tsis muaj | NA |
| 5.6 | Polytype cheeb tsam | -- | Tsis muaj | Thaj tsam ≤10% | Thaj tsam ≤30% |
| 5.7 | pem hauv ntej cim | -- | Tsis muaj | Tsis muaj | Tsis muaj |
| 6: Rov qab zoo | |||||
| 6.1 | rov qab ua tiav | -- | C-ntsej muag MP | C-ntsej muag MP | C-ntsej muag MP |
| 6.2 | khawb | mm | NA | NA | NA |
| 6.3 | Back defects ntug chips/indents | -- | Tsis muaj | Tsis muaj | NA |
| 6.4 | Rov qab roughness | nm | Ra≤5 | Ra≤5 | Ra≤5 |
| 6.5 | Back marking | -- | Ntsig | Ntsig | Ntsig |
| 7 :qab | |||||
| 7.1 | ntug | -- | Chamfer | Chamfer | Chamfer |
| 8: Pob | |||||
| 8.1 | ntim | -- | Epi-npaj nrog lub tshuab nqus tsev ntim | Epi-npaj nrog lub tshuab nqus tsev ntim | Epi-npaj nrog lub tshuab nqus tsev ntim |
| 8.2 | ntim | -- | Multi-wafer ntim cassette | Multi-wafer ntim cassette | Multi-wafer ntim cassette |
Daim duab qhia ntxaws
Sau koj cov lus ntawm no thiab xa tuaj rau peb