BF33 iav Wafer Advanced Borosilicate Substrate 2 "4" 6 "8" 12 "

Lus piav qhia luv luv:

BF33 iav wafer, thoob ntiaj teb lees paub raws li lub npe lag luam BOROFLOAT 33, yog qib hwm-qib borosilicate ntab iav tsim los ntawm SCHOTT siv cov txheej txheem tshwj xeeb microfloat ntau lawm. Cov txheej txheem tsim khoom no muab cov ntawv iav nrog cov tuab tuab tshwj xeeb, zoo heev nto flatness, tsawg kawg nkaus micro-roughness, thiab zoo heev optical transparency.


Nta

Txheej txheem cej luam ntawm BF33 iav Wafer

BF33 iav wafer, thoob ntiaj teb lees paub raws li lub npe lag luam BOROFLOAT 33, yog qib hwm-qib borosilicate ntab iav tsim los ntawm SCHOTT siv cov txheej txheem tshwj xeeb microfloat ntau lawm. Cov txheej txheem tsim khoom no muab cov ntawv iav nrog cov tuab tuab tshwj xeeb, zoo heev nto flatness, tsawg kawg nkaus micro-roughness, thiab zoo heev optical transparency.

Ib qho tseem ceeb qhov txawv ntawm BF33 yog nws cov coefficient qis ntawm thermal expansion (CTE) ntawm kwv yees li 3.3 × 10-6 K-1, ua rau nws zoo tagnrho match rau silicon substrates. Cov cuab yeej no tso cai rau kev sib koom ua ke tsis muaj kev ntxhov siab hauv microelectronics, MEMS, thiab optoelectronic li.

Cov khoom sib xyaw ntawm BF33 iav Wafer

BF33 belongs rau tsev neeg iav borosilicate thiab muaj tshaj80% silica (SiO2), nrog rau boron oxide (B2O3), alkali oxides, thiab kab ntawm txhuas oxide. Qhov formulation no muab:

  • Tsawg ceevpiv rau cov dej qab zib-txiv qaub iav, txo qhov hnyav tag nrho.

  • Txo cov ntsiab lus alkali, txo qis ion leaching hauv rhiab analytical lossis biomedical systems.

  • Txhim kho kev tiv thaivrau tshuaj tua kab mob los ntawm acids, alkalis, thiab organic solvents.

Cov txheej txheem ntau lawm ntawm BF33 iav Wafer

BF33 iav wafers yog tsim los ntawm ib tug series ntawm precision-tswj cov kauj ruam. Ua ntej, high-purity raw cov ntaub ntawv-tsuas yog silica, boron oxide, thiab kab alkali thiab txhuas oxides-yog raug hnyav thiab sib tov. Cov batch yog melted ntawm qhov kub thiab txias thiab refined kom tshem tawm npuas thiab impurities. Siv cov txheej txheem microfloat, molten iav ntws hla molten tin los ua cov ntawv tiaj tus, cov ntawv zoo li qub. Cov nplooj ntawv no maj mam annealed los daws kev ntxhov siab sab hauv, tom qab ntawd txiav rau hauv daim duab plaub thiab ntxiv blanked rau hauv ib puag ncig wafers. Cov npoo wafer yog beveled los yog chamfered rau durability, ua raws li precision lapping thiab ob-sab polishing kom ua tiav qhov chaw du. Tom qab ntxuav ultrasonic hauv chav huv, txhua lub wafer tau soj ntsuam nruj rau qhov ntev, flatness, kho qhov muag zoo, thiab qhov tsis xws luag. Thaum kawg, wafers tau ntim rau hauv cov thawv tsis muaj paug kom ntseeg tau zoo kom txog thaum siv.

Mechanical Properties ntawm BF33 iav Wafer

Khoom BOROFLOAT 33
Qhov ntom 2.23 g / cm3
Modulus ntawm Elasticity 63 kN / hli
Knoop Hardness HK 0.1/20 480
Poisson tus ratio 0.2
Dielectric tsis tu ncua (@ 1 MHz & 25 ° C) 4.6
Poob Tangent (@ 1 MHz & 25 ° C) 37 x 10-4
Dielectric zog (@ 50 Hz & 25 ° C) 16 kV / hli
Refractive Index 1.472 ib
Dispersion (nF - nC) 71.9 x 10-4

FAQ ntawm BF33 iav Wafer

BF33 iav yog dab tsi?

BF33, tseem hu ua BOROFLOAT® 33, yog tus hwm borosilicate ntab iav tsim los ntawm SCHOTT siv cov txheej txheem microfloat. Nws muaj cov thermal expansion tsawg (~ 3.3 × 10⁻⁶ K⁻¹), zoo heev thermal shock resistance, siab optical clarity, thiab zoo heev chemical durability.

BF33 txawv ntawm iav li cas?

Piv rau dej qab zib-lime iav, BF33:

  • Nws muaj qhov qis dua coefficient ntawm thermal expansion, txo kev ntxhov siab los ntawm kev hloov kub.

  • Cov tshuaj tiv thaiv ntau dua rau cov kua qaub, alkalis, thiab cov kuab tshuaj.

  • Muaj ntau dua UV thiab IR kis tau tus mob.

  • Muab cov neeg kho tshuab zoo zog thiab khawb tsis kam.

 

Vim li cas BF33 siv hauv semiconductor thiab MEMS daim ntawv thov?

Nws cov thermal expansion zoo sib xws silicon, ua rau nws zoo tagnrho rau anodic bonding thiab microfabrication. Nws cov tshuaj tiv thaiv kab mob kuj tseem tso cai rau nws los tiv thaiv etching, tu, thiab cov txheej txheem kub tsis muaj degradation.

BF33 puas tuaj yeem tiv taus qhov kub thiab txias?

  • Kev siv txuas ntxiv: mus txog ~ 450 ° C

  • Lub sij hawm luv luv (≤ 10 teev): mus txog ~ 500 ° C
    Nws qhov qis CTE kuj tseem ua rau nws zoo heev rau kev hloov pauv sai sai.

 

Txog Peb

XKH tshwj xeeb hauv kev tsim cov thev naus laus zis, tsim khoom, thiab muag cov iav tshwj xeeb kho qhov muag thiab cov ntaub ntawv siv lead ua tshiab. Peb cov khoom siv kho qhov muag khoom siv hluav taws xob, khoom siv hluav taws xob, thiab tub rog. Peb muab Sapphire optical Cheebtsam, xov tooj ntawm tes lens npog, Ceramics, LT, Silicon Carbide SIC, Quartz, thiab semiconductor siv lead ua wafers. Nrog cov kws tshaj lij thiab cov cuab yeej siv niaj hnub, peb ua tau zoo hauv kev ua cov khoom lag luam uas tsis yog tus qauv, aiming los ua ib qho khoom siv optoelectronic high-tech enterprise.

Sapphire Wafer Blank High Purity Raw Sapphire Substrate Rau Kev Ua Haujlwm 5


  • Yav dhau los:
  • Tom ntej:

  • Sau koj cov lus ntawm no thiab xa tuaj rau peb