Copper substrate ib leeg siv lead ua Cu wafer 5x5x0.5 / 1mm 10x10x0.5 / 1mm 20x20x0.5 / 1mm

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Peb cov tooj liab substrates thiab wafers yog tsim los ntawm high-purity tooj liab (99.99%) nrog ib tug siv lead ua qauv, muab zoo heev hluav taws xob thiab thermal conductivity. Cov wafers no muaj nyob rau hauv cubic orientations ntawm <100>, <110>, thiab <111>, ua rau lawv zoo tagnrho rau kev siv nyob rau hauv high-kev ua tau zoo electronics thiab semiconductor manufacturing. Nrog qhov ntev ntawm 5 × 5 × 0.5 hli, 10 × 10 × 1 hli, thiab 20 × 20 × 1 hli, peb cov tooj liab substrates yog customizable kom tau raws li ntau yam kev xav tau. Lub lattice parameter rau cov siv lead ua wafers ib leeg yog 3.607 Å, kom ntseeg tau cov qauv kev ncaj ncees rau kev tsim khoom siab heev. Cov kev xaiv saum npoo muaj xws li ib sab polished (SSP) thiab ob sab polished (DSP) tiav, muab kev yooj yim rau ntau yam kev tsim khoom.

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Vim nws cov cua kub tsis kam thiab cov khoom siv ua haujlwm ntev, tooj liab substrates tau dav siv hauv microelectronics, cua sov dissipation systems thiab lub zog cia thev naus laus zis, qhov kev tswj xyuas thermal thiab kev ntseeg siab yog qhov tseem ceeb. Cov khoom no ua rau tooj liab substrates yog cov khoom tseem ceeb hauv ntau daim ntawv thov kev siv thev naus laus zis.
Cov no yog qee yam ntawm cov yam ntxwv ntawm tooj liab ib leeg siv lead ua substrate: Cov hluav taws xob zoo conductivity, conductivity thib ob tsuas yog nyiaj. Cov thermal conductivity zoo heev, thiab thermal conductivity yog qhov zoo tshaj plaws ntawm cov hlau. Kev ua haujlwm zoo, tuaj yeem ua tiav ntau yam kev siv tshuab metallurgical.Corrosion kuj yog qhov zoo, tab sis qee qhov kev tiv thaiv tseem xav tau.Cov nqi txheeb ze yog tsawg, thiab tus nqi pheej yig dua hauv cov khoom siv hlau substrate.
Copper substrate yog dav siv nyob rau hauv ntau yam lag luam vim nws zoo heev hluav taws xob conductivity, thermal conductivity thiab mechanical zog. Cov hauv qab no yog cov kev siv tseem ceeb ntawm tooj liab substrate:
1. Hluav taws xob Circuit Court board: tooj liab foil substrate khoom raws li ib tug luam Circuit Court board (PCB). Siv rau high density interconnect circuit board, flexible circuit board, thiab lwm yam. Nws muaj zoo conductivity thiab tshav kub dissipation zog thiab yog haum rau high-power electronics.

2. Cov ntawv thov kev tswj cua sov: siv los ua cov cua txias substrate rau LED teeb, hluav taws xob hluav taws xob, thiab lwm yam. Tsim ntau yam khoom siv hluav taws xob, hluav taws xob hluav taws xob thiab lwm yam kev tswj xyuas thermal. Qhov zoo tshaj plaws thermal conductivity ntawm tooj liab yog siv los ua thiab dissipate tshav kub zoo.

3. Electromagnetic shielding daim ntawv thov: raws li cov khoom siv hluav taws xob hauv lub plhaub thiab thaiv txheej, los muab kev tiv thaiv electromagnetic zoo. Siv rau cov xov tooj ntawm tes, khoos phis tawj thiab lwm yam khoom siv hluav taws xob ntawm lub plhaub hlau thiab cov txheej thaiv sab hauv. Nrog zoo electromagnetic shielding kev ua tau zoo, tuaj yeem thaiv electromagnetic cuam tshuam.

4.Lwm daim ntawv thov: raws li cov khoom siv hluav taws xob hluav taws xob rau lub tsev hluav taws xob. Siv rau hauv kev tsim khoom ntawm ntau yam khoom siv hluav taws xob, lub cev muaj zog, transformers thiab lwm yam khoom siv hluav taws xob. Raws li cov khoom siv kho kom zoo nkauj, siv nws cov khoom ua haujlwm zoo.

Peb tuaj yeem kho ntau yam tshwj xeeb, thicknesses thiab cov duab ntawm Copper Ib leeg siv lead ua substrate raws li cov neeg siv khoom tshwj xeeb.

Daim duab qhia ntxaws