Ob chav chaw nres tsheb square tshuab monocrystalline silicon pas nrig ua 6/8/12 nti nto flatness Ra≤0.5μm

Lus piav qhia luv luv:

Monocrystalline silicon ob chav nres tsheb square tshuab yog ib qho khoom siv tau zoo rau kev ua haujlwm ntawm monocrystalline silicon rods (Ingot). Nws siv ob lub chaw nres tsheb synchronous ua haujlwm tsim thiab tuaj yeem txiav ob lub silicon rods tib lub sijhawm, txhim kho kev ua haujlwm zoo. Cov cuab yeej ua cov cylindrical silicon rods rau hauv square / quasi-square silicon blocks (Grit) los ntawm cov pob zeb diamond hlau txiav tshuab lossis sab hauv cov saw hniav, npaj rau kev txiav tom ntej (xws li ua silicon wafers), thiab tau siv dav hauv cov khoom siv silicon ua txuas hauv photovoltaic thiab semiconductor industries.

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Khoom cim npe

Khoom nta:

(1) Ob chav chaw nres tsheb synchronous ua
· Ob chav efficiency: Ib txhij ua ntawm ob lub silicon rods (Ø6 "-12") nce productivity los ntawm 40% -60% vs. Simplex khoom.

· Kev tswj hwm ywj pheej: Txhua qhov chaw nres tsheb tuaj yeem kho tus kheej ntawm qhov kev txiav txim siab (nruj, pub ceev) kom hloov mus rau qhov sib txawv silicon pas nrig specifications.

(2) High-precision txiav
· Dimensional raug: square bar sab nrug kam rau ua ± 0.15mm, ntau yam ≤0.20mm.

· Nto zoo: txiav ntug tawg <0.5mm, txo qhov sib tsoo tom ntej.

(3) Kev txawj ntse tswj
· Adaptive cutting: real-time saib xyuas ntawm silicon pas nrig morphology, dynamic hloov ntawm txoj kev txiav (xws li kev khoov silicon pas nrig).

· Cov ntaub ntawv traceability: sau cov kev ua tsis tau ntawm txhua tus pas nrig silicon los txhawb MES system docking.

(4) Tsawg tus nqi siv tau
· Pob zeb diamond hlau noj: ≤0.06m / mm (silicon pas nrig ntev), hlau txoj kab uas hla ≤0.30mm.

· Coolant ncig: Lub kaw lus pom txuas ntxiv lub neej kev pabcuam thiab txo cov kua dej pov tseg.

Technology thiab kev loj hlob zoo:

(1) Txiav tshuab optimization
- Ntau kab txiav: 100-200 pob zeb diamond kab yog siv nyob rau hauv parallel, thiab txiav ceev yog ≥40mm / min.

- Kev tswj nruj: kaw lub voj kev hloov kho (± 1N) kom txo tau txoj kev pheej hmoo ntawm cov hlau tawg.

(2) Compatibility extension
- Cov khoom siv hloov pauv: Txhawb P-hom / N-hom monocrystalline silicon, sib xws nrog TOPCon, HJT thiab lwm cov roj teeb uas muaj txiaj ntsig zoo silicon rods.

- Saj zawg zog loj: silicon pas nrig ntev 100-950mm, square pas nrig sab nrug 166-233mm adjustable.

(3) Automation hloov tshiab
- Neeg hlau thauj khoom thiab tshem tawm: tsis siv neeg thauj khoom / tshem tawm ntawm cov pas nrig silicon, tuav ≤3 feeb.

- Kev tshuaj ntsuam xyuas ntse: Kev saib xyuas kwv yees kom txo qis kev poob qis.

(4) Kev ua thawj coj hauv kev lag luam
- Kev them nyiaj yug Wafer: tuaj yeem ua tiav ≥100μm ultra-thin silicon nrog square rods, fragmentation tus nqi <0.5%.

- Kev siv hluav taws xob kom zoo: Kev siv hluav taws xob rau ib chav tsev ntawm silicon pas nrig yog txo los ntawm 30% (vs.

Technical Parameters:

Lub npe parameter	Index tus nqi
Tus naj npawb ntawm cov tuav tau ua tiav	2 pcs / teev
Kev ua bar ntev ntau yam	100 ~ 950 hli
Machining margin ntau yam	166-233 hli
Txiav ceev	≥40mm / min
Pob zeb diamond hlau ceev	0 ~ 35m / s
Pob zeb diamond txoj kab uas hla	0.30mm los yog tsawg dua
Linear noj	0.06m / mm los yog tsawg dua
Tau tshaj round pas nrig txoj kab uas hla	Tiav square pas nrig txoj kab uas hla + 2mm, Xyuas kom polishing dhau tus nqi
Txiav ntug breakage tswj	Raw ntug ≤0.5mm, Tsis muaj chipping, zoo nto zoo
Arc ntev uniformity	Projection ntau yam <1.5mm, Tsuas yog silicon pas nrig distortion
Tshuab qhov ntev (ib lub tshuab)	4800 × 3020 × 3660mm
Tag nrho cov nqi zog	56 kW ua
Cov khoom hnyav tuag	12t ib

Machining qhov tseeb Index Table:

Yam khoom Precision	Tolerance ntau
Square bar margin kam rau ua	± 0.15 hli
Square bar ntug ntau yam	≤0.20mm
Lub kaum sab xis ntawm txhua sab ntawm square pas nrig	90 ° ± 0.05 °
Flatness ntawm square pas nrig	≤0.15mm
Robot rov ua qhov tseeb	± 0.05 hli

XKH cov kev pabcuam:

XKH muab cov kev pabcuam tag nrho rau mono-crystalline silicon dual-station tshuab, suav nrog cov khoom siv kho kom haum (sib haum nrog cov silicon rods loj), cov txheej txheem commissioning (txiav parameter optimization), kev cob qhia kev ua haujlwm thiab kev txhawb nqa tom qab muag (qhov tseem ceeb ntawm cov khoom siv, kuaj cov chaw taws teeb), kom ntseeg tau tias cov neeg siv khoom tau txais txiaj ntsig siab (> 99%) thiab kev tsim khoom siv qis qis (AI) kev tsim khoom thiab kev txhim kho cov nqi qis. Lub sijhawm khoom xa tuaj yog 2-4 lub hlis.