Infrared Nanosecond Laser Drilling khoom rau iav Drilling thickness≤20mm

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Technical Summary:
Lub Infrared Nanosecond Laser iav Drilling System yog kev lag luam-qib kev daws teeb meem tshwj xeeb tsim rau precision drilling ntawm iav cov ntaub ntawv. Siv lub 1064nm infrared nanosecond laser qhov chaw (pulse dav: 10-300ns), qhov system no ua tiav high-precision drilling nyob rau hauv ntau yam iav substrates nrog thicknesses ≤20mm los ntawm meej zog tswj thiab beam shaping technologies.
Hauv kev siv cov kab ntau lawm, Infrared Nanosecond Laser Glass Drilling System qhia txog cov txheej txheem tshwj xeeb. Piv nrog rau cov khoom siv sib xyaw ua ke los yog CO₂ laser ua, lub kaw lus ua kom zoo thermal nyhuv tswj lub tshuab ua kom qhov tseeb drilling nrog lub qhov taub xws li Φ0.1-5mm hauv cov qauv dej qab zib-kua txiv iav, thaum tuav lub qhov phab ntsa taper hauv ± 0.5 °. Tshwj xeeb tshaj yog nyob rau hauv lub koob yees duab smartphone sapphire npog lub lens ua, lub kaw lus tuaj yeem tsim Φ0.3mm micro-qhov arrays nrog qhov tseeb ntawm ± 10μm, ua tau raws li cov kev cai miniaturization nruj hauv cov neeg siv khoom siv hluav taws xob. Lub kaw lus los ntawm tus qauv nrog automated loading / unloading interfaces rau seamless kev koom ua ke nrog cov kab ntau lawm.

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Product Detail

Khoom cim npe

Lub ntsiab parameter

Laser hom	Infrared nanosecond
Platform loj	*800 600 hli**
	*2000 1200 hli**
Drilling thickness	≤ 20 (mm)
Drilling ceev	0-5000 (mm / s)
Drilling ntug breakage	<0.5 (mm)
Nco tseg: Platform loj tuaj yeem kho tau.

Laser Drilling Txoj Cai

Lub laser beam yog teem rau ntawm ib qho kev pom zoo nyob rau hauv lub workpiece thickness, ces scans raws predefined paths ntawm kev kub ceev. Los ntawm kev sib cuam tshuam nrog lub zog loj laser beam, lub hom phiaj cov khoom raug tshem tawm txheej txheej los ntawm txheej los ua cov kab txiav, ua tiav cov perforation meej (lub voj voog, square, lossis complex geometries) nrog kev tswj cov khoom sib cais.

Qhov zoo ntawm Laser Drilling

· High automation kev koom ua ke nrog tsawg zog siv thiab ua haujlwm yooj yim;

· Kev ua haujlwm tsis sib cuag ua rau tsis muaj kev txwv cov qauv geometry tshaj li cov qauv siv;

· Consumable-free lag luam txo cov nqi khiav lag luam thiab txhim khu ib puag ncig sustainability;

· Superior precision nrog tsawg ntug chipping thiab tshem tawm ntawm lwm yam workpiece puas tsuaj;

Infrared nanosecond iav laser drilling khoom 2

Qauv qauv

Cov txheej txheem siv

Lub kaw lus yog engineered rau precision ua ntawm nkig / tawv cov ntaub ntawv xws li drilling, grooving, zaj duab xis tshem tawm, thiab nto texturing. Cov ntawv thov ib txwm muaj xws li:

1. Drilling thiab notching rau da dej qhov rooj Cheebtsam

2. Precision perforation ntawm cov khoom siv iav panels

3. Hnub ci vaj huam sib luag ntawm drilling

4. Hloov/socket npog phaj perforation

5. Daim iav txheej tshem tawm nrog drilling

6. Kev cai nto texturing thiab grooving rau cov khoom tshwj xeeb

Kev ua tau zoo

1. Loj-hom platform haum cov khoom sib txawv ntawm qhov ntev ntawm kev lag luam

2. Complex contour drilling ua tiav hauv kev ua haujlwm ib zaug

3. Tsawg ntug chipping nrog superior nto tiav (Ra <0.8μm)

4. Seamless hloov ntawm cov khoom specifications nrog intuitive ua hauj lwm

5. Kev ua haujlwm raug nqi zoo nrog:

· Cov nyiaj tau los siab (> 99.2%)

· Consumable-free processing

· Zero pa phem emissions

6.Kev ua haujlwm tsis sib cuag ua kom muaj kev ruaj ntseg ntawm qhov chaw

Ntsiab nta

1. Precision Thermal Management Technology:

· Siv cov txheej txheem ntau-pulse nce qib drilling nrog adjustable ib leeg-pulse zog (0.1-50 mJ)

· Kev tsim kho tshiab ntawm cov kab hlau thaiv kab hlau thaiv kev tiv thaiv qhov cua sov ua rau thaj tsam li ntawm 10% ntawm lub qhov taub

· Real-time infrared ntsuas kub ntsuas module cia li them nyiaj rau lub zog tsis muaj zog (± 2% stability)

2. Intelligent Processing Platform:

· Nruab nrog high-precision linear motor theem (rov ua dua qhov tseeb: ± 2 μm)

· Integrated vision alignment system (5-megapixel CCD, paub qhov tseeb: ± 5 μm)

· Preloaded txheej txheem database nrog optimized tsis rau 50+ hom iav ntaub ntawv

3. High-Efficiency Production Design:

· Dual-chaw nres tsheb alternating ua hauj lwm hom nrog cov ntaub ntawv hloov lub sij hawm ≤3 vib nas this

· Standard processing voj voog ntawm 1 qhov / 0.5 sec (Φ0.5 hli los ntawm-qhov)

· Modular tsim ua kom muaj kev sib hloov ceev ceev ntawm cov tsom iav tsom iav (kev ua haujlwm ntau: Φ0.1-10 hli)

Brittle Hard Material Processing Applications

Hom khoom	Daim ntawv thov Scenario	Txheej txheem txheej txheem
Soda-lime iav	Da dej qhov rooj	Mounting qhov & cov kav dej
Soda-lime iav	Cov khoom siv tswj vaj huam sib luag	Dej qhov arrays
Tempered iav	Qhov cub saib qhov rais	Qhov cua qhov arrays
Tempered iav	Induction cooktops	Angled txias channels
Borosilicate iav	Hnub ci vaj huam sib luag	Mounting qhov
Borosilicate iav	Laboratory glassware	Kev cai tso dej raws
iav-ceramic	Cooktop nto	Burner positioning qhov
iav-ceramic	Induction cookers	Sensor mounting qhov arrays
Sapphire	Cov cuab yeej ntse npog	Qhov cua qhov
Sapphire	Industrial viewports	Txhim kho qhov
Coated iav	Cov iav da dej	Mounting qhov (txheej txheem tshem tawm + drilling)
Coated iav	Ntaub phab ntsa	Low-E iav zais qhov dej qhov
Ceramicized iav	Hloov/socket npog	Kev ruaj ntseg slots + hlau qhov
Ceramicized iav	hluav taws teeb meem	Emergency Pressure Relief qhov

XKH muab kev txhawb nqa dav dav thiab cov kev pabcuam ntxiv rau cov khoom siv infrared nanosecond laser iav drilling kom ntseeg tau tias kev ua haujlwm zoo thoob plaws hauv lub neej ntawm cov cuab yeej siv. Peb muab cov txheej txheem tsim kho raws li cov kev pabcuam uas peb pab pawg engineering koom tes nrog cov neeg siv khoom los tsim cov khoom siv tshwj xeeb cov tsev qiv ntawv, suav nrog cov kev pabcuam tshwj xeeb drilling rau cov ntaub ntawv nyuaj xws li sapphire thiab tempered iav nrog thickness variations ntawm 0.1mm txog 20mm. Rau kev ua kom zoo tshaj plaws, peb ua cov khoom siv hauv tsev calibration thiab kev ntsuas kev ua tau zoo, ua kom cov kev ntsuas tseem ceeb xws li lub qhov taub qhov siab (± 5μm) thiab ntug zoo (Ra <0.5μm) ua tau raws li cov qauv kev lag luam.

Yav dhau los: Microjet laser tshuab cuab yeej wafer txiav SiC cov ntaub ntawv ua

Tom ntej: 6 Nti Conductive SiC Composite Substrate 4H Diameter 150mm Ra≤0.2nm Warp≤35μm

Sau koj cov lus ntawm no thiab xa tuaj rau peb