Multi-Wire Pob Zeb Diamond Sawing Tshuab rau SiC Sapphire Ultra-Hard Brittle Materials
Taw qhia rau Multi-Wire Pob Zeb Diamond Sawing Tshuab
Multi-wire pob zeb diamond sawing tshuab yog lub xeev-of-the-art slicing system tsim los ua cov ntaub ntawv nyuaj heev thiab nkig. Los ntawm kev siv ntau qhov sib npaug ntawm cov pob zeb diamond-coated xov hlau, lub tshuab tuaj yeem txiav ntau lub wafers nyob rau hauv ib lub voj voog, ua tiav ob qho tib si high throughput thiab precision. Cov tshuab no tau dhau los ua cov cuab yeej tseem ceeb hauv kev lag luam xws li semiconductors, hnub ci photovoltaics, LEDs, thiab cov ceramics siab heev, tshwj xeeb tshaj yog rau cov ntaub ntawv xws li SiC, sapphire, GaN, quartz, thiab alumina.
Piv nrog rau cov pa ib leeg-xaim txiav, kev teeb tsa ntau-xaim xa ntau ntau mus rau pua pua ntawm cov hlais ib pawg, txo qis lub sij hawm voj voog thaum ua kom zoo heev flatness (Ra <0.5 μm) thiab qhov ntev precision (± 0.02 hli). Nws modular tsim integrates automated hlau tensioning, workpiece tuav systems, thiab kev soj ntsuam online, kom ntseeg tau ntev, ruaj khov, thiab tag nrho cov khoom siv.
Technical Parameters ntawm Multi-Wire Pob Zeb Diamond Sawing Tshuab
| Yam khoom | Specification | Yam khoom | Specification |
|---|---|---|---|
| Qhov loj tshaj plaws ua haujlwm (Square) | 220 × 200 × 350 hli | Tsav lub cev muaj zog | 17.8 kW × 2 |
| Maximum ua haujlwm loj (Round) | Φ205 × 350 hli | Hlau tsav lub cev muaj zog | 11.86 kW × 2 |
| Spindle sib nrug | Φ250 ± 10 × 370 × 2 axis (mm) | Worktable nqa lub cev muaj zog | 2.42 kW × 1 |
| Thawj axis | 650 hli | Lub cev muaj zog | 0.8 kW × 1 |
| Hlau khiav ceev | 1500m / min | Npaj lub cev muaj zog | 0.45 kW × 2 |
| Hlau txoj kab uas hla | Φ0.12-0.25 hli | Lub cev muaj zog | 4.15 kW × 2 |
| Nqa ceev | 225mm / min | Slurry lub cev muaj zog | 7.5 kW × 1 |
| Max. rooj tig | ± 12 ° | Slurry tank muaj peev xwm | 300 L |
| Lub kaum sab xis | ± 3° | Coolant ntws | 200 L / min |
| Swing zaus | ~ 30 zaug / min | Temp. raug | ± 2 ° C |
| Pub tus nqi | 0.01-9.99 hli / min | Fais fab mov | 335 + 210 hli (mm²) |
| Hlau pub tus nqi | 0.01-300 hli / min | Compressed cua | 0.4-0.6 MPa |
| Tshuab loj | 3550 × 2200 × 3000 hli | Qhov hnyav | 13.500 Kg |
Ua hauj lwm Mechanism ntawm Multi-Wire Pob Zeb Diamond Sawing Tshuab
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Multi-Wire Cutting Motion
Ntau lub pob zeb diamond xaim txav ntawm synchronized ceev txog 1500 m / min. Precision-guided pulleys thiab kaw-voj nro tswj (15-130 N) ua kom cov xov hlau ruaj khov, txo txoj kev sib txawv los yog tawg. -
Kev pub noj kom raug & Muab qhov chaw
Servo-driven positioning ua tiav ± 0.005 hli raug. Kev xaiv laser lossis kev pom kev pom kev sib raug zoo txhim kho cov txiaj ntsig rau cov duab nyuaj. -
Txias thiab tshem tawm cov khib nyiab
High-pressure coolant tsis tu ncua tshem tawm cov chips thiab ua kom txias rau qhov chaw ua haujlwm, tiv thaiv thermal puas. Multi-theem filtration ncua lub neej coolant thiab txo downtime. -
Smart Control Platform
High-response servo tsav tsheb (<1 ms) dynamically kho pub, nro, thiab xaim ceev. Integrated daim ntawv qhia kev tswj thiab ib-nias parameter switching streamline loj ntau lawm.
Cov txiaj ntsig tseem ceeb ntawm Multi-Wire Pob Zeb Diamond Sawing Tshuab
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Kev tsim khoom siab
Muaj peev xwm txiav 50-200 wafers ib qho kev khiav, nrog kerf poob <100 μm, txhim kho cov khoom siv txog li 40%. Kev xa tawm yog 5-10 × ntawm cov kab ke ib leeg ib leeg. -
Tswj Precision
Hlau nro stability nyob rau hauv ± 0.5 N ua kom zoo ib yam ntawm cov ntaub ntawv nkig. Kev saib xyuas lub sijhawm tiag tiag ntawm 10 "HMI interface txhawb nqa daim ntawv qhia cia thiab chaw taws teeb ua haujlwm. -
Yooj yim, Modular Tsim
Tau tshaj cov hlau diameters los ntawm 0.12-0.45 mm rau cov txheej txheem txiav sib txawv. Optional robotic tuav tso cai rau tag nrho automated ntau lawm kab. -
Industrial-Qib Reliability
Heavy-duty cam khwb cia / forged ntas txo deformation (<0.01 hli). Qhia pulleys nrog ceramic los yog carbide coatings muab tshaj 8000 teev ntawm kev pab cuam lub neej.
Daim ntawv thov teb ntawm Multi-Wire Pob Zeb Diamond Sawing Tshuab
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Semiconductors: Txiav SiC rau EV fais fab modules, GaN substrates rau 5G li.
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Photovoltaics: High-speed silicon wafer slicing nrog ± 10 μm uniformity.
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LED & Optics: Sapphire substrates rau epitaxy thiab precision optical ntsiab nrog <20 μm ntug chipping.
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Advanced Ceramics: Kev ua haujlwm ntawm alumina, AlN, thiab cov ntaub ntawv zoo sib xws rau cov khoom siv hauv aerospace thiab thermal tswj.
FAQ - Multi-Wire Pob Zeb Diamond Pom Tshuab
Q1: Dab tsi yog qhov zoo ntawm ntau cov hlau sawing piv nrog cov tshuab ib leeg?
A: Multi-wire systems tuaj yeem hlais kaum rau ntau pua ntawm wafers ib txhij, txhawb kev ua haujlwm ntawm 5-10 ×. Kev siv cov khoom siv kuj tseem siab dua nrog kerf poob qis dua 100 μm, ua rau nws zoo tagnrho rau ntau lawm.
Q2: Cov ntaub ntawv twg tuaj yeem ua tiav?
A: Lub tshuab yog tsim los rau cov ntaub ntawv nyuaj thiab nkig, suav nrog silicon carbide (SiC), sapphire, gallium nitride (GaN), quartz, alumina (Al₂O₃), thiab txhuas nitride (AlN).
Q3: Dab tsi yog qhov ua tiav qhov tseeb thiab qhov zoo ntawm qhov chaw?
A: Nto roughness tuaj yeem ncav cuag Ra <0.5 μm, nrog qhov tseeb qhov tseeb ntawm ± 0.02 hli. Ntug chipping tuaj yeem tswj tau mus rau <20 μm, ntsib semiconductor thiab optoelectronic kev lag luam qauv.
Q4: Cov txheej txheem txiav puas ua rau tawg lossis puas?
A: Nrog rau lub siab txias txias thiab kaw-voj nro tswj, qhov kev pheej hmoo ntawm micro-cracks thiab kev ntxhov siab puas tsuaj yog txo qis, ua kom muaj kev ncaj ncees wafer zoo.
