SiC Ceramic Fork Arm / End Effector - Advanced Precision Handling rau Semiconductor Manufacturing

Lus piav qhia luv luv:

SiC Ceramic Fork Arm, feem ntau hu ua Ceramic End Effector, yog ib qho kev ua haujlwm siab ua haujlwm tshwj xeeb tsim tshwj xeeb rau kev thauj khoom wafer, kev sib dhos, thiab qhov chaw nyob rau hauv high-tech industries, tshwj xeeb tshaj yog nyob rau hauv semiconductor thiab photovoltaic ntau lawm. Fabricated siv high-purity silicon carbide ceramics, cov khoom no sib xyaw ua ke tshwj xeeb lub zog, ultra-low thermal expansion, thiab superior tiv thaiv thermal shock thiab corrosion.


Nta

Product Overview

SiC Ceramic Fork Arm, feem ntau hu ua Ceramic End Effector, yog ib qho kev ua haujlwm siab ua haujlwm tshwj xeeb tsim tshwj xeeb rau kev thauj khoom wafer, kev sib dhos, thiab qhov chaw nyob rau hauv high-tech industries, tshwj xeeb tshaj yog nyob rau hauv semiconductor thiab photovoltaic ntau lawm. Fabricated siv high-purity silicon carbide ceramics, cov khoom no sib xyaw ua ke tshwj xeeb lub zog, ultra-low thermal expansion, thiab superior tiv thaiv thermal shock thiab corrosion.

Tsis zoo li cov khoom siv hluav taws xob ua los ntawm txhuas, stainless hlau, lossis txawm tias quartz, SiC ceramic end effectors muaj kev ua haujlwm tsis sib xws hauv lub tshuab nqus tsev, chav huv huv, thiab kev ua haujlwm hnyav, ua rau lawv yog ib feem tseem ceeb ntawm lwm tiam wafer tuav cov neeg hlau. Nrog rau kev thov ntau ntxiv rau kev tsim khoom tsis muaj paug thiab nruj dua nyob rau hauv chipmaking, kev siv cov ceramic kawg effectors tau dhau los ua tus qauv kev lag luam sai.

Manufacturing Principple

Fabrication ntawmSiC Ceramic End Effectorssuav nrog cov txheej txheem ntawm high-precision, high-purity txheej txheem uas ua kom muaj kev ua tau zoo thiab kav ntev. Ob txheej txheem tseem ceeb feem ntau yog siv:

Reaction-Bonded Silicon Carbide (RB-SiC)

Nyob rau hauv cov txheej txheem no, ib tug preform ua los ntawm silicon carbide hmoov thiab binder yog infiltrated nrog molten silicon ntawm qhov kub thiab txias (~ 1500 ° C), uas reacts nrog residual carbon los tsim ib tug ntom, nruj SiC-Si composite. Txoj kev no muaj kev tswj xyuas qhov zoo tshaj plaws thiab muaj txiaj ntsig zoo rau kev tsim khoom loj.

Siab tsis muaj Sintered Silicon Carbide (SSiC)

SSiC yog tsim los ntawm sintering ultra-nplua, high-purity SiC hmoov ntawm qhov kub thiab txias (> 2000 ° C) yam tsis tas siv cov khoom siv ntxiv lossis kev sib khi. Qhov no ua rau muaj cov khoom lag luam nrog ze li 100% ntom ntom thiab cov khoom siv hluav taws xob siab tshaj plaws muaj nyob rau cov khoom siv Sic. Nws yog qhov zoo tagnrho rau kev siv wafer tuav cov ntaub ntawv tshwj xeeb.

Tom qab ua tiav

  • Precision CNC Machining: Ua tiav siab flatness thiab parallelism.

  • Nto Finishing: Pob zeb diamond polishing txo qhov roughness rau <0.02 µm.

  • Kev tshuaj xyuas: Optical interferometry, CMM, thiab kev kuaj tsis muaj kev puas tsuaj yog ua haujlwm los xyuas txhua daim.

Cov kauj ruam no lav tias covSiC end effectormuab wafer qhov tseeb qhov tseeb, zoo heev planarity, thiab me me particle tiam.

Cov yam ntxwv tseem ceeb thiab cov txiaj ntsig

Feature Kev piav qhia
Ultra-High Hardness Vickers hardness> 2500 HV, tiv taus hnav thiab chipping.
Tsawg Thermal Expansion CTE ~ 4.5 × 10⁻⁶ / K, ua kom muaj kev ruaj ntseg nyob rau hauv thermal cycling.
Tshuaj Inertness Resistant rau HF, HCl, plasma gases, thiab lwm yam corrosive agents.
Zoo heev Thermal Shock Resistance Haum rau cov cua kub ceev / txias hauv lub tshuab nqus tsev thiab lub tshuab cua sov.
Siab Rigidity thiab muaj zog Txhawb ntev cantilevered diav rawg caj npab yam tsis muaj deflection.
Tsawg Outgassing Zoo tagnrho rau ultra-high nqus tsev vacuum (UHV) ib puag ncig.
ISO Class 1 Cleanroom Npaj Kev ua haujlwm tsis muaj particle ua kom muaj kev ncaj ncees wafer.

 

Daim ntawv thov

SiC Ceramic Fork Arm / End Effector yog dav siv nyob rau hauv kev lag luam uas yuav tsum tau huab precision, huv si, thiab tshuaj tiv thaiv. Cov xwm txheej tseem ceeb ntawm daim ntawv thov muaj xws li:

Semiconductor Manufacturing

  • Wafer loading / unloading hauv deposition (CVD, PVD), etching (RIE, DRIE), thiab tu tshuab.

  • Robotic wafer thauj ntawm FOUPs, cassettes, thiab cov txheej txheem txheej txheem.

  • Kub-kub tuav thaum thermal ua los yog annealing.

Photovoltaic Cell Production

  • Kev thauj khoom me me ntawm cov khoom tawg yooj yim silicon wafers lossis hnub ci substrates hauv cov kab tsis siv neeg.

Flat Panel Display (FPD) Kev lag luam

  • Tsiv loj iav panels los yog substrates nyob rau hauv OLED / LCD ntau lawm ib puag ncig.

Compound Semiconductor / MEMS

  • Siv nyob rau hauv GaN, SiC, thiab MEMS fabrication kab uas tswj kev kis kab mob thiab qhov chaw raug yog qhov tseem ceeb.

Nws lub luag haujlwm kawg nkaus yog qhov tseem ceeb tshwj xeeb hauv kev ua kom tsis muaj qhov tsis xws luag, ruaj khov tuav thaum lub sijhawm ua haujlwm rhiab.

Customization Muaj peev xwm

Peb muab ntau yam customization kom tau raws li cov khoom sib txawv thiab cov txheej txheem yuav tsum tau ua:

  • Fork Design: Ob-prong, ntau tus ntiv tes, lossis cais-theem layouts.

  • Wafer Size Compatibility: Los ntawm 2 "mus rau 12" wafers.

  • Mounting Interfaces: Tau tshaj OEM robotic caj npab.

  • Thickness & Surface Tolerances: Micron-theem flatness thiab ntug rounding muaj.

  • Anti-Slip nta: Xaiv qhov chaw textures lossis coatings rau kev ruaj ntseg wafer tuav.

Txhuaceramic kawg effectoryog co-tsim nrog cov neeg siv khoom kom paub meej haum nrog cov cuab yeej siv tsawg tsawg.

Cov lus nug nquag nug (FAQ)

Q1: SiC zoo dua li quartz li cas rau qhov kawg effector daim ntawv thov?
A1:Thaum quartz feem ntau yog siv rau nws cov purity, nws tsis muaj cov neeg kho tshuab toughness thiab nws yooj yim tawg nyob rau hauv load los yog kub poob. SiC muaj lub zog zoo dua, hnav tsis kam, thiab thermal stability, txo qhov kev pheej hmoo ntawm downtime thiab wafer puas.

Q2: Puas yog qhov no yog cov khoom siv hluav taws xob sib txuas nrog txhua tus neeg hlau wafer handlers?
A2:Yog lawm, peb cov ceramic kawg effectors tau sib xws nrog feem ntau loj wafer tuav tshuab thiab tuaj yeem hloov kho rau koj cov qauv neeg hlau tshwj xeeb nrog cov duab kos duab kos duab.

Q3: Nws puas tuaj yeem tuav 300 hli wafers yam tsis muaj warping?
A3:kiag li. Lub siab rigidity ntawm SiC tso cai rau txawm nyias, ntev diav rawg caj npab los tuav 300 hli wafers ruaj ntseg yam tsis muaj sagging los yog deflection thaum lub sij hawm txav.

Q4: Dab tsi yog qhov kev pab cuam lub neej ntawm SiC ceramic kawg effector?
A4:Nrog rau kev siv kom zoo, SiC kawg effector tuaj yeem siv sijhawm ntev li 5 txog 10 npaug ntev dua li cov qauv quartz lossis txhuas, ua tsaug rau nws cov kev tiv thaiv zoo rau thermal thiab mechanical stress.

Q5: Koj puas muab kev hloov pauv lossis kev pabcuam sai sai?
A5:Yog lawm, peb txhawb nqa cov qauv tsim sai thiab muab cov kev pabcuam hloov pauv raws li CAD kos duab lossis rov qab-engineered qhov chaw los ntawm cov khoom siv uas twb muaj lawm.

Txog Peb

XKH tshwj xeeb hauv kev tsim cov thev naus laus zis, tsim khoom, thiab muag cov iav tshwj xeeb kho qhov muag thiab cov ntaub ntawv siv lead ua tshiab. Peb cov khoom siv kho qhov muag khoom siv hluav taws xob, khoom siv hluav taws xob, thiab tub rog. Peb muab Sapphire optical Cheebtsam, xov tooj ntawm tes lens npog, Ceramics, LT, Silicon Carbide SIC, Quartz, thiab semiconductor siv lead ua wafers. Nrog cov kws tshaj lij thiab cov cuab yeej siv niaj hnub, peb ua tau zoo hauv kev ua cov khoom lag luam uas tsis yog tus qauv, aiming los ua ib qho khoom siv optoelectronic high-tech enterprise.

567 ib

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  • Sau koj cov lus ntawm no thiab xa tuaj rau peb