SiC substrate 3inch 350um thickness HPSI hom Prime Qib Dummy qib
Cov khoom
Parameter | Qib ntau lawm | Qib tshawb fawb | Dummy Qib | Chav tsev |
Qib | Qib ntau lawm | Qib tshawb fawb | Dummy Qib | |
Txoj kab uas hla | 76.2 ± 0.5 | 76.2 ± 0.5 | 76.2 ± 0.5 | mm |
Thickness | 500 ± 25 | 500 ± 25 | 500 ± 25 | µm |
Wafer Orientation | On-axis: <0001> ± 0.5° | On-axis: <0001> ± 2.0° | On-axis: <0001> ± 2.0° | degree |
Micropipe Density (MPD) | ≤ 1 | ≤ 5 | ≤ 10 | cm-2^-2-2 |
Hluav taws xob Resistivity | ≥1E10 | ≥1E5 | ≥1E5 | Ω·cm |
Dopant | Undoped | Undoped | Undoped | |
Thawj Txoj Kev Ncaj Ncees | {1-100} ± 5.0° | {1-100} ± 5.0° | {1-100} ± 5.0° | degree |
Qhov Loj Loj Loj | 32.5 ± 3.0 | 32.5 ± 3.0 | 32.5 ± 3.0 | mm |
Secondary Flat Length | 18.0 ± 2.0 | 18.0 ± 2.0 | 18.0 ± 2.0 | mm |
Secondary Flat Orientation | 90 ° CW los ntawm thawj lub tiaj tus ± 5.0 ° | 90 ° CW los ntawm thawj lub tiaj tus ± 5.0 ° | 90 ° CW los ntawm thawj lub tiaj tus ± 5.0 ° | degree |
Ntug Exclusion | 3 | 3 | 3 | mm |
LTV/TTV/Bow/Warp | 3 / 10 / ± 30 / 40 | 3 / 10 / ± 30 / 40 | 5 / 15 / ± 40 / 45 | µm |
Nto Roughness | Lub ntsej muag: CMP, C-lub ntsej muag: Polished | Lub ntsej muag: CMP, C-lub ntsej muag: Polished | Lub ntsej muag: CMP, C-lub ntsej muag: Polished | |
Cracks (High-Intensity Light) | Tsis muaj | Tsis muaj | Tsis muaj | |
Hex Phaj (High-Intensity Light) | Tsis muaj | Tsis muaj | Thaj tsam 10% | % |
Polytype Areas (High-Intensity Light) | Thaj tsam 5% | Cov cheeb tsam 20% | Thaj tsam 30% | % |
Scratches (High-Intensity Light) | ≤ 5 khawb, cumulative ntev ≤ 150 | ≤ 10 khawb, cumulative ntev ≤ 200 | ≤ 10 khawb, cumulative ntev ≤ 200 | mm |
Ntug Chiping | Tsis muaj ≥ 0.5 mm dav / qhov tob | 2 tso cai ≤ 1 hli dav / qhov tob | 5 pub ≤ 5 mm dav / qhov tob | mm |
Nto Cov Kab Mob | Tsis muaj | Tsis muaj | Tsis muaj |
Daim ntawv thov
1. High-power Electronics
Qhov zoo tshaj thermal conductivity thiab dav bandgap ntawm SiC wafers ua rau lawv zoo tagnrho rau high-power, high-frequency khoom:
●MOSFETs thiab IGBTs rau kev hloov hluav taws xob.
● Cov tshuab hluav taws xob zoo tshaj plaws hauv tsheb, suav nrog cov tshuab hluav taws xob thiab cov chargers.
●Smart grid infrastructure thiab lub zog tauj dua tshiab.
2. RF thiab Microwave Systems
SiC substrates pab txhawb kev siv RF thiab microwave nrog cov teeb liab tsawg tsawg:
● Kev sib txuas lus thiab satellite systems.
●Aerospace radar systems.
●Advanced 5G network Cheebtsam.
3. Optoelectronics thiab Sensors
Cov khoom tshwj xeeb ntawm SiC txhawb ntau yam kev siv optoelectronic:
● UV ntes rau ib puag ncig saib xyuas thiab kev paub txog kev lag luam.
●LED thiab laser substrates rau solid-state teeb pom kev zoo thiab precision instruments.
● High-temperature sensors rau aerospace thiab automotive industries.
4. Kev Tshawb Fawb thiab Kev Txhim Kho
Kev sib txawv ntawm cov qib (Kev Tsim Kho, Kev Tshawb Fawb, Dummy) ua rau muaj kev sim ua kom pom tseeb thiab cov cuab yeej ua qauv hauv kev kawm thiab kev lag luam.
Qhov zoo
● Kev ntseeg tau:Zoo heev resistivity thiab stability nyob rau hauv cov qib.
●Customization:Taug kev orientations thiab thicknesses kom haum rau cov kev xav tau sib txawv.
● High Purity:Undoped muaj pes tsawg leeg ua kom tsis muaj impurity-hais txog variations.
● Scalability:Ua tau raws li qhov yuav tsum tau ua ntawm ob qho tib si ntau lawm thiab kev tshawb nrhiav kev sim.
3-nti high-purity SiC wafers yog koj lub qhov rooj rau cov khoom siv ua haujlwm siab thiab kev ua haujlwm thev naus laus zis tshiab. Rau kev nug thiab cov ncauj lus kom ntxaws specifications, hu rau peb hnub no.
Cov ntsiab lus
Lub 3-nti High Purity Silicon Carbide (SiC) Wafers, muaj nyob rau hauv Kev Tsim Khoom, Kev Tshawb Fawb, thiab Qib Dummy, yog cov khoom siv zoo tshaj plaws uas tsim los rau cov khoom siv hluav taws xob siab, RF/microwave systems, optoelectronics, thiab qib R & D. Cov wafers no muaj qhov tsis muaj qhov tsis zoo, cov khoom siv hluav taws xob ib nrab nrog kev tiv thaiv zoo (≥1E10 Ω·cm rau Qib Qib), tsawg micropipe ceev (≤1 cm−2^-2−2), thiab tshwj xeeb nto zoo. Lawv tau ua kom zoo rau kev ua haujlwm siab, suav nrog kev hloov hluav taws xob, kev sib txuas lus, UV sensing, thiab LED thev naus laus zis. Nrog rau cov kev taw qhia customizable, superior thermal conductivity, thiab robust mechanical zog, cov SiC wafers pab tau zoo, txhim khu kev qha ntaus ntawv fabrication thiab groundbreaking innovation nyob rau hauv industries.