TGV Los ntawm iav Via iav BF33 Quartz JGS1 JGS2 Sapphire Khoom
TGV Product Introduction
Peb cov kev daws teeb meem TGV (Los ntawm iav Via) muaj nyob rau hauv ntau yam khoom zoo xws li BF33 borosilicate iav, fused quartz, JGS1 thiab JGS2 fused silica, thiab sapphire (ib leeg siv lead ua Al₂O₃). Cov ntaub ntawv no raug xaiv rau lawv cov khoom siv kho qhov muag zoo, thermal, thiab cov khoom siv kho tshuab, ua rau lawv zoo tagnrho substrates rau kev ntim khoom semiconductor, MEMS, optoelectronics, thiab microfluidic daim ntaub ntawv. Peb muab precision ua kom tau raws li koj qhov tshwj xeeb ntawm qhov ntev thiab metallization yuav tsum tau.
TGV Materials and Properties Table
| Khoom siv | Hom | Yam Khoom |
|---|---|---|
| BF33 | Borosilicate iav | Tsawg CTE, zoo thermal stability, yooj yim rau laum thiab polish |
| Quartz | Fused Silica (SiO₂) | Tsis tshua muaj CTE, siab transparency, zoo heev hluav taws xob rwb thaiv tsev |
| JGS1 | Optical Quartz iav | Kev kis tau zoo los ntawm UV rau NIR, tsis muaj npuas, siab purity |
| JGS 2 | Optical Quartz iav | Zoo ib yam li JGS1, tso cai rau cov npuas me me |
| Sapphire | Ib leeg Crystal Al₂O₃ | High hardness, siab thermal conductivity, zoo heev RF rwb thaiv tsev |
TGV application
TGV Applications:
Los ntawm iav Via (TGV) technology yog dav siv nyob rau hauv advanced microelectronics thiab optoelectronics. Cov ntawv thov ib txwm muaj xws li:
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3D IC thiab wafer-theem ntim- enabling ntsug hluav taws xob interconnections los ntawm iav substrates rau compact, high-density integration.
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MEMS cov khoom siv- muab hermetic iav interposers nrog dhau-vias rau sensors thiab actuators.
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RF Cheebtsam & kav hlau txais xov modules- leveraging qhov tsawg dielectric poob ntawm iav rau high-frequency kev ua tau zoo.
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Optoelectronic kev koom ua ke- xws li micro-lens arrays thiab photonic circuits xav tau pob tshab, insulating substrates.
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Microfluidic chips- suav nrog qhov tseeb ntawm-qhov rau cov kua dej thiab cov hluav taws xob nkag.
Hais txog XINKEHUI
Shanghai Xinkehui Tshiab Khoom Co., Ltd. yog ib qho ntawm cov khoom siv kho qhov muag & semiconductor loj tshaj plaws nyob rau hauv Suav teb, nrhiav tau nyob rau hauv 2002. Ntawm XKH, peb muaj ib pab neeg R & D muaj zog tsim los ntawm cov kws paub txog kev paub thiab engineers uas tau mob siab rau kev tshawb fawb thiab kev tsim cov khoom siv hluav taws xob siab heev.
Peb pab pawg nquag tsom mus rau cov haujlwm tshiab xws li TGV (Los ntawm iav Via) thev naus laus zis, muab cov kev daws teeb meem rau ntau yam khoom siv hluav taws xob thiab cov ntawv thov photonic. Leveraging peb cov kev txawj ntse, peb txhawb cov kws tshawb fawb thiab kev lag luam cov neeg koom tes thoob ntiaj teb nrog cov khoom zoo, cov substrates, thiab precision iav ua.
Cov koom tes thoob ntiaj teb
Nrog peb cov kws tshaj lij cov khoom siv semiconductor, XINKEHUI tau tsim kev sib koom tes thoob plaws ntiaj teb. Peb zoo siab koom tes nrog cov tuam txhab ua lag luam hauv ntiaj teb xws liCorningthiabSchott iav, uas tso cai rau peb txuas ntxiv txhim kho peb cov peev txheej thev naus laus zis thiab tsav kev tsim kho tshiab hauv thaj chaw xws li TGV (Los ntawm iav Via), hluav taws xob hluav taws xob, thiab cov khoom siv optoelectronic.
Los ntawm cov kev sib koom tes thoob ntiaj teb no, peb tsis tsuas yog txhawb nqa cov ntawv thov kev lag luam tab sis kuj tseem koom nrog kev sib koom ua haujlwm tsim kho uas thawb cov ciam teb ntawm cov khoom siv thev naus laus zis. Los ntawm kev ua haujlwm zoo nrog cov neeg koom tes zoo siab no, XINKEHUI ua kom ntseeg tau tias peb nyob twj ywm nyob rau hauv lub hauv ntej ntawm semiconductor thiab advanced electronics kev lag luam.
