Dia300x1.0mmt Thickness Sapphire Wafer C-Plane SSP / DSP

Lus piav qhia luv luv:

Shanghai Xinkehui New Material Co., Ltd. tuaj yeem tsim cov sapphire wafers nrog ntau yam kev taw qhia saum npoo (c, r, a, thiab m-plane), thiab tswj lub kaum sab xis ntawm qhov txiav mus rau hauv 0.1 degree.Siv peb cov cuab yeej cuab tam, peb muaj peev xwm ua tiav qhov zoo xav tau rau cov ntawv thov xws li kev loj hlob epitaxial thiab wafer bonding.

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Product Detail

Khoom cim npe

Taw qhia ntawm wafer box

Cov khoom siv Crystal	99,999% Al2O3, High Purity, Monocrystalline, Al2O3
Crystal zoo	Inclusions, block marks, ntxaib, Xim, micro- npuas thiab dispersal chaw yog tsis muaj nyob
Txoj kab uas hla	2 nti	3 nti	4 nti	6 nti ~ 12 nti
Txoj kab uas hla	50.8 ± 0.1 hli	76.2 ± 0.2 hli	100 ± 0.3 hli	Raws li cov kev cai ntawm cov txheej txheem ntau lawm
Thickness	430 ± 15 µm	550 ± 15 µm	650 ± 20 µm	Tau customized los ntawm cov neeg siv khoom
Kev taw qhia	C- dav hlau (0001) rau M-plane (1-100) lossis A-plane (1 1-2 0) 0.2 ± 0.1 ° / 0.3 ± 0.1 °, R-plane (1-1 0 2), A-plane (1 1-2 0 ), M-plane(1-1 0 0), Ib qho kev taw qhia, Txhua lub kaum ntse ntse
Thawj lub tiaj tiaj ntev	16.0 ± 1 hli	22.0 ± 1.0 hli	32.5 ± 1.5 hli	Raws li cov kev cai ntawm cov txheej txheem ntau lawm
Thawj Txoj Kev Ncaj Ncees	A-plane (1 1-2 0) ± 0.2 °
TTV	≤10µm	≤15µm	≤ 20µm	≤ 30μm
LTV	≤10µm	≤15µm	≤ 20µm	≤ 30μm
TIR	≤10µm	≤15µm	≤ 20µm	≤ 30μm
HUV	≤10µm	≤15µm	≤ 20µm	≤ 30μm
Warp	≤10µm	≤15µm	≤ 20µm	≤ 30μm
Pem hauv ntej nto	Epi Polished (Ra <0.2nm)

* Hneev nti: Qhov sib txawv ntawm qhov chaw nruab nrab ntawm qhov nruab nrab ntawm qhov chaw dawb, tsis yog-clamped wafer los ntawm lub dav hlau siv, qhov twg lub dav hlau siv tau txhais los ntawm peb lub ces kaum ntawm daim duab peb sab sib npaug.

* Warp: Qhov sib txawv ntawm qhov siab tshaj plaws thiab qhov tsawg kawg nkaus nyob deb ntawm qhov nruab nrab ntawm qhov chaw dawb, tsis-clamped wafer los ntawm lub dav hlau siv tau teev tseg saum toj no.

Cov khoom lag luam zoo thiab cov kev pabcuam rau cov khoom siv semiconductor txuas ntxiv mus thiab kev loj hlob ntawm epitaxial:

High degree ntawm flatness (tswj TTV, hneev nti, warp thiab lwm yam)

Kev tu kom zoo (tsis muaj qhov paug paug, tsis muaj hlau tsis muaj paug)

Substrate drilling, grooving, txiav, thiab rov qab polishing

Txuas cov ntaub ntawv xws li kev huv thiab cov duab ntawm substrate (yeem)

Yog tias koj xav tau sapphire substrates, thov hu rau:

xa ntawv:eric@xkh-semitech.com+86 158 0194 2596 /doris@xkh-semitech.com+86 187 0175 6522

Peb yuav rov qab rau koj asap!